CN101568882A - 感光性树脂组合物及层压体 - Google Patents

感光性树脂组合物及层压体 Download PDF

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Publication number
CN101568882A
CN101568882A CNA200880001204XA CN200880001204A CN101568882A CN 101568882 A CN101568882 A CN 101568882A CN A200880001204X A CNA200880001204X A CN A200880001204XA CN 200880001204 A CN200880001204 A CN 200880001204A CN 101568882 A CN101568882 A CN 101568882A
Authority
CN
China
Prior art keywords
photosensitive resin
plating
substrate
resin composition
corrosion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA200880001204XA
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English (en)
Chinese (zh)
Inventor
姬田优香理
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Original Assignee
Asahi Kasei E Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E Materials Corp filed Critical Asahi Kasei E Materials Corp
Publication of CN101568882A publication Critical patent/CN101568882A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Polymerisation Methods In General (AREA)
CNA200880001204XA 2007-02-02 2008-01-25 感光性树脂组合物及层压体 Pending CN101568882A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP024363/2007 2007-02-02
JP2007024363 2007-02-02

Publications (1)

Publication Number Publication Date
CN101568882A true CN101568882A (zh) 2009-10-28

Family

ID=39689901

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA200880001204XA Pending CN101568882A (zh) 2007-02-02 2008-01-25 感光性树脂组合物及层压体

Country Status (5)

Country Link
JP (1) JP4885243B2 (enExample)
KR (1) KR20090082240A (enExample)
CN (1) CN101568882A (enExample)
TW (1) TW200846825A (enExample)
WO (1) WO2008099655A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103430100A (zh) * 2011-03-03 2013-12-04 日合墨东株式会社 感光性树脂组合物、使用其的光致抗蚀膜、抗蚀图案的形成方法以及导体图案的形成方法
CN105103050A (zh) * 2013-01-28 2015-11-25 日产化学工业株式会社 具有图案的基板的制造方法以及氢氟酸蚀刻用树脂组合物

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5682214B2 (ja) * 2010-10-06 2015-03-11 横浜ゴム株式会社 紫外線硬化型樹脂組成物
JP5948543B2 (ja) * 2012-05-29 2016-07-06 旭化成株式会社 感光性樹脂組成物
KR102030179B1 (ko) * 2012-07-03 2019-11-08 현대모비스 주식회사 마이크로 하이브리드 시스템용 전력관리장치
KR102792073B1 (ko) * 2016-12-29 2025-04-08 주식회사 동진쎄미켐 네가티브 감광성 수지 조성물

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH106404A (ja) * 1996-06-19 1998-01-13 Takemoto Oil & Fat Co Ltd 光学的立体造形物の製造方法
JP4046398B2 (ja) * 1997-02-05 2008-02-13 ナブテスコ株式会社 光学的立体造形用樹脂組成物
JP3283239B2 (ja) * 1999-03-03 2002-05-20 日本合成化学工業株式会社 感光性樹脂組成物
JP3967049B2 (ja) * 1999-10-07 2007-08-29 富士フイルム株式会社 平版印刷版用原版
JP2004252093A (ja) * 2003-02-19 2004-09-09 Asahi Kasei Chemicals Corp 液状感光性樹脂凸版印刷版の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103430100A (zh) * 2011-03-03 2013-12-04 日合墨东株式会社 感光性树脂组合物、使用其的光致抗蚀膜、抗蚀图案的形成方法以及导体图案的形成方法
CN103430100B (zh) * 2011-03-03 2016-08-17 日兴材料株式会社 感光性树脂组合物、使用其的光致抗蚀膜、抗蚀图案的形成方法以及导体图案的形成方法
CN105103050A (zh) * 2013-01-28 2015-11-25 日产化学工业株式会社 具有图案的基板的制造方法以及氢氟酸蚀刻用树脂组合物

Also Published As

Publication number Publication date
JPWO2008099655A1 (ja) 2010-05-27
TW200846825A (en) 2008-12-01
TWI356972B (enExample) 2012-01-21
JP4885243B2 (ja) 2012-02-29
KR20090082240A (ko) 2009-07-29
WO2008099655A1 (ja) 2008-08-21

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SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20091028