CN101553918B - 半导体结构以及组装方法 - Google Patents

半导体结构以及组装方法 Download PDF

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Publication number
CN101553918B
CN101553918B CN2006800397429A CN200680039742A CN101553918B CN 101553918 B CN101553918 B CN 101553918B CN 2006800397429 A CN2006800397429 A CN 2006800397429A CN 200680039742 A CN200680039742 A CN 200680039742A CN 101553918 B CN101553918 B CN 101553918B
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substrate
semiconductor
hardware
semiconductor chip
electric
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CN101553918A (zh
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B·W·康戴
L·维斯瓦纳坦
R·W·维兹
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NXP USA Inc
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Freescale Semiconductor Inc
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    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
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    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
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    • H10W44/226—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for HF amplifiers
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    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
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    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
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    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
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    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
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    • H10W72/874—On different surfaces
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    • H10W90/00—Package configurations
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    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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CN2006800397429A 2005-10-24 2006-10-10 半导体结构以及组装方法 Active CN101553918B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/257,784 2005-10-24
US11/257,784 US7446411B2 (en) 2005-10-24 2005-10-24 Semiconductor structure and method of assembly
PCT/US2006/039649 WO2007050287A2 (en) 2005-10-24 2006-10-10 Semiconductor structure and method of assembly

Publications (2)

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CN101553918A CN101553918A (zh) 2009-10-07
CN101553918B true CN101553918B (zh) 2011-09-07

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US (1) US7446411B2 (https=)
JP (1) JP2009513026A (https=)
CN (1) CN101553918B (https=)
TW (1) TWI489602B (https=)
WO (1) WO2007050287A2 (https=)

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TWI489602B (zh) 2015-06-21
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CN101553918A (zh) 2009-10-07
US20070090515A1 (en) 2007-04-26
US7446411B2 (en) 2008-11-04
TW200721421A (en) 2007-06-01
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