CN101550582B - 电镀装置和电镀方法 - Google Patents

电镀装置和电镀方法 Download PDF

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Publication number
CN101550582B
CN101550582B CN2009101272163A CN200910127216A CN101550582B CN 101550582 B CN101550582 B CN 101550582B CN 2009101272163 A CN2009101272163 A CN 2009101272163A CN 200910127216 A CN200910127216 A CN 200910127216A CN 101550582 B CN101550582 B CN 101550582B
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China
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electroplate
electroplating
mentioned
pair
face
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Expired - Fee Related
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CN2009101272163A
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Chinese (zh)
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CN101550582A (zh
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黑泽英纪
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Nippon Mektron KK
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Nippon Mektron KK
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  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN2009101272163A 2008-04-02 2009-03-09 电镀装置和电镀方法 Expired - Fee Related CN101550582B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008-096534 2008-04-02
JP2008096534A JP2009249659A (ja) 2008-04-02 2008-04-02 電気めっき装置及び電気めっき方法
JP2008096534 2008-04-02

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CN101550582A CN101550582A (zh) 2009-10-07
CN101550582B true CN101550582B (zh) 2012-07-18

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CN2009101272163A Expired - Fee Related CN101550582B (zh) 2008-04-02 2009-03-09 电镀装置和电镀方法

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JP (1) JP2009249659A (xx)
CN (1) CN101550582B (xx)
HK (1) HK1132307A1 (xx)
TW (1) TWI381070B (xx)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5366787B2 (ja) * 2009-12-18 2013-12-11 株式会社中央製作所 連続垂直搬送式めっき装置
CN102337577B (zh) * 2010-07-22 2014-03-12 富葵精密组件(深圳)有限公司 电镀装置
CN102373497B (zh) * 2010-08-16 2014-05-21 富葵精密组件(深圳)有限公司 电镀装置及电镀方法
DE112016001606T5 (de) * 2015-04-06 2017-12-21 Mitsubishi Electric Corporation Halbleiterelement und Verfahren zu dessen Herstellung
CN105297121A (zh) * 2015-10-21 2016-02-03 胜宏科技（惠州）股份有限公司 一种电镀铜槽钛篮保养方法
CN105297096B (zh) * 2015-11-30 2017-12-19 中国华能集团公司 一种双面电沉积异种镀层的电镀装置及电镀方法
CN107513741A (zh) * 2017-09-07 2017-12-26 延康汽车零部件如皋有限公司 一种提高长工件铜镀层均匀性的电镀方法
CN112701072B (zh) * 2021-03-25 2021-10-22 西安奕斯伟硅片技术有限公司 晶圆处理装置及晶圆缺陷评价方法
CN116419991B (zh) * 2021-06-01 2024-03-01 株式会社荏原制作所 镀覆装置以及镀覆方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2466167Y (zh) * 2001-02-09 2001-12-19 吴德兴 轮圈用电镀装置
CN2732766Y (zh) * 2004-05-12 2005-10-12 重庆渝安创新科技(集团)有限公司 节约电能和设备附件的电镀硬铬设备
EP1664390B1 (en) * 2003-09-12 2007-01-03 ATOTECH Deutschland GmbH Device and method for electrolytically treating electrically insulated structures

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4490230A (en) * 1983-03-10 1984-12-25 At&T Technologies, Inc. Electroplating apparatus
JPS63293193A (ja) * 1987-05-26 1988-11-30 Matsushita Electric Works Ltd 電気メッキ方法
JPH06116799A (ja) * 1992-10-01 1994-04-26 Hitachi Chem Co Ltd 電気めっき法
JP3062911B2 (ja) * 1994-03-14 2000-07-12 富士通株式会社 メッキ装置
JP3352081B2 (ja) * 2001-02-01 2002-12-03 株式会社アスカエンジニアリング プリント基板の銅めっき装置
JP4711805B2 (ja) * 2005-11-08 2011-06-29 上村工業株式会社 めっき槽
US8177945B2 (en) * 2007-01-26 2012-05-15 International Business Machines Corporation Multi-anode system for uniform plating of alloys

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2466167Y (zh) * 2001-02-09 2001-12-19 吴德兴 轮圈用电镀装置
EP1664390B1 (en) * 2003-09-12 2007-01-03 ATOTECH Deutschland GmbH Device and method for electrolytically treating electrically insulated structures
CN2732766Y (zh) * 2004-05-12 2005-10-12 重庆渝安创新科技(集团)有限公司 节约电能和设备附件的电镀硬铬设备

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特表2005-537392A 2005.12.08

Also Published As

Publication number Publication date
JP2009249659A (ja) 2009-10-29
TW200942648A (en) 2009-10-16
TWI381070B (zh) 2013-01-01
HK1132307A1 (en) 2010-02-19
CN101550582A (zh) 2009-10-07

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