HK1132307A1 - Electroplating device and method for electroplating - Google Patents

Electroplating device and method for electroplating

Info

Publication number
HK1132307A1
HK1132307A1 HK09110651.0A HK09110651A HK1132307A1 HK 1132307 A1 HK1132307 A1 HK 1132307A1 HK 09110651 A HK09110651 A HK 09110651A HK 1132307 A1 HK1132307 A1 HK 1132307A1
Authority
HK
Hong Kong
Prior art keywords
electroplating
electroplating device
Prior art date
Application number
HK09110651.0A
Other languages
English (en)
Inventor
Hideki Kurosawa
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of HK1132307A1 publication Critical patent/HK1132307A1/xx

Links

HK09110651.0A 2008-04-02 2009-11-13 Electroplating device and method for electroplating HK1132307A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008096534A JP2009249659A (ja) 2008-04-02 2008-04-02 電気めっき装置及び電気めっき方法

Publications (1)

Publication Number Publication Date
HK1132307A1 true HK1132307A1 (en) 2010-02-19

Family

ID=41155063

Family Applications (1)

Application Number Title Priority Date Filing Date
HK09110651.0A HK1132307A1 (en) 2008-04-02 2009-11-13 Electroplating device and method for electroplating

Country Status (4)

Country Link
JP (1) JP2009249659A (xx)
CN (1) CN101550582B (xx)
HK (1) HK1132307A1 (xx)
TW (1) TWI381070B (xx)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5366787B2 (ja) * 2009-12-18 2013-12-11 株式会社中央製作所 連続垂直搬送式めっき装置
CN102337577B (zh) * 2010-07-22 2014-03-12 富葵精密组件(深圳)有限公司 电镀装置
CN102373497B (zh) * 2010-08-16 2014-05-21 富葵精密组件(深圳)有限公司 电镀装置及电镀方法
US10262960B2 (en) * 2015-04-06 2019-04-16 Mitsubishi Electric Corporation Semiconductor element having a warped surface and production method thereof
CN105297121A (zh) * 2015-10-21 2016-02-03 胜宏科技（惠州）股份有限公司 一种电镀铜槽钛篮保养方法
CN105297096B (zh) * 2015-11-30 2017-12-19 中国华能集团公司 一种双面电沉积异种镀层的电镀装置及电镀方法
CN107513741A (zh) * 2017-09-07 2017-12-26 延康汽车零部件如皋有限公司 一种提高长工件铜镀层均匀性的电镀方法
CN112701072B (zh) * 2021-03-25 2021-10-22 西安奕斯伟硅片技术有限公司 晶圆处理装置及晶圆缺陷评价方法
WO2022254579A1 (ja) * 2021-06-01 2022-12-08 株式会社荏原製作所 めっき装置およびめっき方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4490230A (en) * 1983-03-10 1984-12-25 At&T Technologies, Inc. Electroplating apparatus
JPS63293193A (ja) * 1987-05-26 1988-11-30 Matsushita Electric Works Ltd 電気メッキ方法
JPH06116799A (ja) * 1992-10-01 1994-04-26 Hitachi Chem Co Ltd 電気めっき法
JP3062911B2 (ja) * 1994-03-14 2000-07-12 富士通株式会社 メッキ装置
JP3352081B2 (ja) * 2001-02-01 2002-12-03 株式会社アスカエンジニアリング プリント基板の銅めっき装置
CN2466167Y (zh) * 2001-02-09 2001-12-19 吴德兴 轮圈用电镀装置
DE10342512B3 (de) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut
CN2732766Y (zh) * 2004-05-12 2005-10-12 重庆渝安创新科技(集团)有限公司 节约电能和设备附件的电镀硬铬设备
JP4711805B2 (ja) * 2005-11-08 2011-06-29 上村工業株式会社 めっき槽
US8177945B2 (en) * 2007-01-26 2012-05-15 International Business Machines Corporation Multi-anode system for uniform plating of alloys

Also Published As

Publication number Publication date
TW200942648A (en) 2009-10-16
CN101550582A (zh) 2009-10-07
CN101550582B (zh) 2012-07-18
JP2009249659A (ja) 2009-10-29
TWI381070B (zh) 2013-01-01

Similar Documents

Publication Publication Date Title
GB0818605D0 (en) Apparatus and method
GB0818609D0 (en) apparatus and method
IL208242A0 (en) Drill-aiming method and apparatus
EP2331233A4 (en) APPARATUS AND METHOD THEREOF
EP2308884A4 (en) PROCESS FOR THE PREPARATION OF HETEROSUBSTITUTED ALKYLHALOHYDROSILANE AND ITS USE
EP2336029A4 (en) COLD STARTING PROCESS AND DEVICE THEREFOR
GB0900690D0 (en) Apparatus and method
GB0802094D0 (en) Apparatus and method
GB0803231D0 (en) Apparatus and method
GB0821084D0 (en) Apparatus and method
GB0814828D0 (en) Chuck device and method
HK1132307A1 (en) Electroplating device and method for electroplating
HK1212698A1 (zh) 噻唑基和噁唑基異喹哪啶以及它們的使用方法
GB0810431D0 (en) Apparatus and method
EP2252927A4 (en) FINGER DETECTION APPARATUS AND METHOD
GB0820585D0 (en) Apparatus and method
GB0823333D0 (en) Apparatus and methods
ZA201103668B (en) Device and method for ball-handling-skills training
EP2339769A4 (en) RECEIVING DEVICE AND RECEIVING METHOD
GB2456905B (en) Method and apparatus
GB0823408D0 (en) Apparatus and methods
IL197897A0 (en) Placement device and method
GB0822280D0 (en) Method and apparatus
GB0821015D0 (en) Apparatus and method
GB0901647D0 (en) Component positioning apparatus and method

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20190309