CN101542751B - 半导体芯片以及制造半导体芯片的方法 - Google Patents

半导体芯片以及制造半导体芯片的方法 Download PDF

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Publication number
CN101542751B
CN101542751B CN2007800359455A CN200780035945A CN101542751B CN 101542751 B CN101542751 B CN 101542751B CN 2007800359455 A CN2007800359455 A CN 2007800359455A CN 200780035945 A CN200780035945 A CN 200780035945A CN 101542751 B CN101542751 B CN 101542751B
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semiconductor chip
semiconductor substrate
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CN101542751A (zh
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U·斯特劳斯
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers

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  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
  • Wire Bonding (AREA)
CN2007800359455A 2006-09-29 2007-09-10 半导体芯片以及制造半导体芯片的方法 Active CN101542751B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102006046677.2 2006-09-29
DE102006046677 2006-09-29
DE102007004302.5 2007-01-29
DE102007004302A DE102007004302A1 (de) 2006-09-29 2007-01-29 Halbleiterchip und Verfahren zur Herstellung eines Halbleiterchips
PCT/DE2007/001638 WO2008040289A2 (de) 2006-09-29 2007-09-10 Halbleiterchip und verfahren zur herstellung eines halbleiterchips

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CN101542751A CN101542751A (zh) 2009-09-23
CN101542751B true CN101542751B (zh) 2012-12-26

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CN2007800359455A Active CN101542751B (zh) 2006-09-29 2007-09-10 半导体芯片以及制造半导体芯片的方法

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US (1) US8431937B2 (https=)
EP (1) EP2052419B1 (https=)
JP (2) JP5243436B2 (https=)
KR (1) KR101456729B1 (https=)
CN (1) CN101542751B (https=)
DE (1) DE102007004302A1 (https=)
TW (1) TWI358840B (https=)
WO (1) WO2008040289A2 (https=)

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Also Published As

Publication number Publication date
EP2052419A2 (de) 2009-04-29
JP5243436B2 (ja) 2013-07-24
TW200832755A (en) 2008-08-01
CN101542751A (zh) 2009-09-23
EP2052419B1 (de) 2018-11-07
KR101456729B1 (ko) 2014-10-31
WO2008040289A3 (de) 2008-09-18
KR20090081377A (ko) 2009-07-28
JP2013175750A (ja) 2013-09-05
DE102007004302A1 (de) 2008-04-03
US20100038664A1 (en) 2010-02-18
JP2010505249A (ja) 2010-02-18
WO2008040289A2 (de) 2008-04-10
US8431937B2 (en) 2013-04-30
TWI358840B (en) 2012-02-21

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