CN101540299B - 元件搭载用基板、半导体组件及其制造方法及便携式设备 - Google Patents
元件搭载用基板、半导体组件及其制造方法及便携式设备 Download PDFInfo
- Publication number
- CN101540299B CN101540299B CN2009101346932A CN200910134693A CN101540299B CN 101540299 B CN101540299 B CN 101540299B CN 2009101346932 A CN2009101346932 A CN 2009101346932A CN 200910134693 A CN200910134693 A CN 200910134693A CN 101540299 B CN101540299 B CN 101540299B
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- CN
- China
- Prior art keywords
- projected electrode
- wiring layer
- electrode
- insulating resin
- mounting substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/023—Redistribution layers [RDL] for bonding areas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- Wire Bonding (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008022013A JP5028291B2 (ja) | 2008-01-31 | 2008-01-31 | 素子搭載用基板、素子搭載用基板の製造方法、半導体モジュールおよび半導体モジュールの製造方法 |
JP022013/08 | 2008-01-31 | ||
JP2008050473A JP2009212114A (ja) | 2008-02-29 | 2008-02-29 | 突起電極の構造、素子搭載用基板およびその製造方法、半導体モジュール、ならびに携帯機器 |
JP050473/08 | 2008-02-29 | ||
JP080994/08 | 2008-03-26 | ||
JP2008080994A JP5022963B2 (ja) | 2008-03-26 | 2008-03-26 | 突起電極の構造、素子搭載用基板およびその製造方法、半導体モジュール、ならびに携帯機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101540299A CN101540299A (zh) | 2009-09-23 |
CN101540299B true CN101540299B (zh) | 2013-04-24 |
Family
ID=41035973
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009101346932A Active CN101540299B (zh) | 2008-01-31 | 2009-02-01 | 元件搭载用基板、半导体组件及其制造方法及便携式设备 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5028291B2 (de) |
CN (1) | CN101540299B (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101669534B1 (ko) * | 2009-12-07 | 2016-10-26 | 해성디에스 주식회사 | 범프를 구비한 회로기판 및 그 제조 방법 |
WO2011136363A1 (ja) * | 2010-04-28 | 2011-11-03 | 三洋電機株式会社 | 回路装置の製造方法 |
US9398389B2 (en) * | 2013-05-13 | 2016-07-19 | Knowles Electronics, Llc | Apparatus for securing components in an electret condenser microphone (ECM) |
JP7226472B2 (ja) | 2020-05-26 | 2023-02-21 | 株式会社村田製作所 | 部品相互接続要素を備えた電子部品 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6010769A (en) * | 1995-11-17 | 2000-01-04 | Kabushiki Kaisha Toshiba | Multilayer wiring board and method for forming the same |
US6452280B1 (en) * | 1996-03-06 | 2002-09-17 | Matsushita Electric Industrial Co., Ltd. | Flip chip semiconductor apparatus with projecting electrodes and method for producing same |
US6831234B1 (en) * | 1996-06-19 | 2004-12-14 | Ibiden Co., Ltd. | Multilayer printed circuit board |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5823943B2 (ja) * | 1975-07-16 | 1983-05-18 | 松下電器産業株式会社 | 絶縁体の貫通電極形成方法 |
JP3769587B2 (ja) * | 2000-11-01 | 2006-04-26 | 株式会社ノース | 配線回路用部材とその製造方法と多層配線回路基板と半導体集積回路装置 |
JP2004095913A (ja) * | 2002-08-30 | 2004-03-25 | Dainippon Printing Co Ltd | プリント配線基板及びその製造方法 |
JP2006310530A (ja) * | 2005-04-28 | 2006-11-09 | Sanyo Electric Co Ltd | 回路装置およびその製造方法 |
JP4568215B2 (ja) * | 2005-11-30 | 2010-10-27 | 三洋電機株式会社 | 回路装置および回路装置の製造方法 |
-
2008
- 2008-01-31 JP JP2008022013A patent/JP5028291B2/ja active Active
-
2009
- 2009-02-01 CN CN2009101346932A patent/CN101540299B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6010769A (en) * | 1995-11-17 | 2000-01-04 | Kabushiki Kaisha Toshiba | Multilayer wiring board and method for forming the same |
US6452280B1 (en) * | 1996-03-06 | 2002-09-17 | Matsushita Electric Industrial Co., Ltd. | Flip chip semiconductor apparatus with projecting electrodes and method for producing same |
US6831234B1 (en) * | 1996-06-19 | 2004-12-14 | Ibiden Co., Ltd. | Multilayer printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
JP2009182274A (ja) | 2009-08-13 |
JP5028291B2 (ja) | 2012-09-19 |
CN101540299A (zh) | 2009-09-23 |
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