CN101517772B - 具有潜在活化层的有机发光器件 - Google Patents

具有潜在活化层的有机发光器件 Download PDF

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Publication number
CN101517772B
CN101517772B CN2007800355666A CN200780035566A CN101517772B CN 101517772 B CN101517772 B CN 101517772B CN 2007800355666 A CN2007800355666 A CN 2007800355666A CN 200780035566 A CN200780035566 A CN 200780035566A CN 101517772 B CN101517772 B CN 101517772B
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China
Prior art keywords
layer
organic light
light emitting
metal
barium
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Expired - Fee Related
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CN2007800355666A
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English (en)
Chinese (zh)
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CN101517772A (zh
Inventor
莱里·N·刘易斯
黄清澜
唐纳德·F·福斯特
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General Electric Co
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General Electric Co
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
    • C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
    • C23C18/145—Radiation by charged particles, e.g. electron beams or ion irradiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/15—Hole transporting layers
    • H10K50/155—Hole transporting layers comprising dopants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/16—Electron transporting layers
    • H10K50/165—Electron transporting layers comprising dopants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Electroluminescent Light Sources (AREA)
  • Luminescent Compositions (AREA)
CN2007800355666A 2006-09-28 2007-07-05 具有潜在活化层的有机发光器件 Expired - Fee Related CN101517772B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/536,228 US20070075628A1 (en) 2005-10-04 2006-09-28 Organic light emitting devices having latent activated layers
US11/536,228 2006-09-28
PCT/US2007/072847 WO2008094294A2 (en) 2006-09-28 2007-07-05 Organic light emitting devices having latent activated layers

Publications (2)

Publication Number Publication Date
CN101517772A CN101517772A (zh) 2009-08-26
CN101517772B true CN101517772B (zh) 2012-07-18

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800355666A Expired - Fee Related CN101517772B (zh) 2006-09-28 2007-07-05 具有潜在活化层的有机发光器件

Country Status (7)

Country Link
US (1) US20070075628A1 (https=)
EP (1) EP2067192A2 (https=)
JP (1) JP5663165B2 (https=)
KR (1) KR101434867B1 (https=)
CN (1) CN101517772B (https=)
TW (1) TWI457042B (https=)
WO (1) WO2008094294A2 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040031167A1 (en) * 2002-06-13 2004-02-19 Stein Nathan D. Single wafer method and apparatus for drying semiconductor substrates using an inert gas air-knife
US8709705B2 (en) 2004-12-13 2014-04-29 Pryog, Llc Metal-containing compositions and method of making same
US7534635B1 (en) 2008-03-24 2009-05-19 General Electric Company Getter precursors for hermetically sealed packaging
US8350144B2 (en) 2008-05-23 2013-01-08 Swaminathan Ramesh Hybrid photovoltaic cell module
KR101420327B1 (ko) * 2008-07-24 2014-08-14 삼성디스플레이 주식회사 유기 발광 소자의 제조 방법 및 유기 발광 소자
EP2326744B1 (en) * 2008-08-07 2022-06-01 Pryog, LLC Metal compositions and methods of making same
US20110008525A1 (en) * 2009-07-10 2011-01-13 General Electric Company Condensation and curing of materials within a coating system
TWI508618B (zh) * 2009-12-28 2015-11-11 Univ Nat Chiao Tung 製備有機發光二極體之方法及其裝置
JP6035706B2 (ja) * 2010-04-09 2016-11-30 三菱化学株式会社 有機電界素子用組成物の製造方法、有機電界素子用組成物、有機電界発光素子の製造方法、有機電界発光素子、有機ｅｌ表示装置および有機ｅｌ照明
US10941163B2 (en) 2015-09-29 2021-03-09 Pryog, Llc Metal compositions and methods of making same
JP7561139B2 (ja) 2019-03-25 2024-10-03 シノヴィア テクノロジーズ 非平衡熱硬化プロセス

Citations (1)

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US6703180B1 (en) * 2003-04-16 2004-03-09 Eastman Kodak Company Forming an improved stability emissive layer from a donor element in an OLED device

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US5023A (en) * 1847-03-20 Stocking-loom
US6010A (en) * 1849-01-09 Improvement in the manufacture of hats
JPS5451776A (en) * 1977-10-03 1979-04-23 Nippon Hoso Kyokai <Nhk> Gas discharge display panel
JPS5787042A (en) * 1980-11-19 1982-05-31 Hitachi Ltd Manufacture of gas discharge panel
JPS58216353A (ja) * 1982-06-10 1983-12-16 Toshiba Corp 点灯管
JPH02272087A (ja) * 1989-04-13 1990-11-06 Ricoh Co Ltd 薄膜エレクトロルミネッセンス素子の製造方法
JPH0636688A (ja) * 1992-07-14 1994-02-10 Hitachi Ltd ガラス封止デバイス製造方法およびガス放電表示パネルの製造装置
US5534312A (en) * 1994-11-14 1996-07-09 Simon Fraser University Method for directly depositing metal containing patterned films
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Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
US6703180B1 (en) * 2003-04-16 2004-03-09 Eastman Kodak Company Forming an improved stability emissive layer from a donor element in an OLED device

Also Published As

Publication number Publication date
KR101434867B1 (ko) 2014-09-02
TW200822798A (en) 2008-05-16
WO2008094294A2 (en) 2008-08-07
JP5663165B2 (ja) 2015-02-04
CN101517772A (zh) 2009-08-26
TWI457042B (zh) 2014-10-11
KR20090071573A (ko) 2009-07-01
US20070075628A1 (en) 2007-04-05
JP2010505236A (ja) 2010-02-18
EP2067192A2 (en) 2009-06-10
WO2008094294A3 (en) 2009-02-19

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