TWI457042B - 具有潛伏致動層之有機發光裝置 - Google Patents

具有潛伏致動層之有機發光裝置 Download PDF

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Publication number
TWI457042B
TWI457042B TW96126063A TW96126063A TWI457042B TW I457042 B TWI457042 B TW I457042B TW 96126063 A TW96126063 A TW 96126063A TW 96126063 A TW96126063 A TW 96126063A TW I457042 B TWI457042 B TW I457042B
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strontium
barium
cesium
metal precursor
metal
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TW96126063A
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TW200822798A (en
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Larry Neil Lewis
Qinglan Huang
Donald Franklin Foust
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Gen Electric
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/14Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
    • C23C18/143Radiation by light, e.g. photolysis or pyrolysis
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/14Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
    • C23C18/145Radiation by charged particles, e.g. electron beams or ion irradiation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/82Cathodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60Forming conductive regions or layers, e.g. electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14Carrier transporting layers
    • H10K50/15Hole transporting layers
    • H10K50/155Hole transporting layers comprising dopants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14Carrier transporting layers
    • H10K50/16Electron transporting layers
    • H10K50/165Electron transporting layers comprising dopants
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Luminescent Compositions (AREA)

Claims (19)

  1. 一種有機發光裝置,其具有包含至少一種金屬先質之反應產物之陰極層,當曝露至熱或光時,該金屬先質能夠釋出至少一種低功函數金屬,其中該金屬先質係包括式M(N3 )x 化合物,其中M係選自由鋰、鈉、鉀、銣、銫、鉣、鈹、鎂、鈣、鍶、鋇、鐳、鑭、鈰、鐠、釹、鉅、釤、銪、釓、鋱、鏑、鈥、鉺、銩、鐿、鎦及其組合所構成群組;且x為1至3。
  2. 如請求項1之有機發光裝置,其中該至少一種低功函數金屬係具有功函數值小於3.0eV。
  3. 如請求項1之有機發光裝置,其中該至少一種低功函數金屬係選自包括鋰、鈉、鉀、銣、銫、鉣、鈹、鎂、鈣、鍶、鋇、鐳、鑭、鈰、鐠、釹、鉅、釤、銪、釓、鋱、鏑、鈥、鉺、銩、鐿、鎦及其組合。
  4. 如請求項1之有機發光裝置,其中低功函數金屬為鋇。
  5. 如請求項1之有機發光裝置,其中金屬先質係包括雙疊氮化鋇。
  6. 一種有機發光裝置,其包含:基板,至少一個陰極層,覆蓋該基板一個表面之至少一部份,此陰極層包含得自使至少一種式M(N3 )x 金屬先質分解之反應產物;陽極層材料,覆蓋第二個基板之至少一部份,及; 有機發光材料,位於陰極層與陽極層之間,而其中當相反電荷被施加至陽極與陰極層時,光係被發射;其中M係選自包括鋰、鈉、鉀、銣、銫、鉣、鈹、鎂、鈣、鍶、鋇、鐳、鑭、鈰、鐠、釹、鉅、釤、銪、釓、鋱、鏑、鈥、鉺、銩、鐿、鎦及其組合;且x為1至3。
  7. 如請求項6之有機發光裝置,其中陰極層材料係包括鋇。
  8. 如請求項6之有機發光裝置,其中金屬先質為雙疊氮化鋇。
  9. 一種製造有機發光裝置之方法,該方法包括在大氣空氣中,對基板施加至少一種金屬先質之溶液,其包含至少一種金屬之疊氮化物,M(N3 )x ,且使該至少一種金屬先質曝露至熱或光,以釋出該至少一種金屬;其中M係選自包括鋰、鈉、鉀、銣、銫、鉣、鈹、鎂、鈣、鍶、鋇、鐳、鑭、鈰、鐠、釹、鉅、釤、銪、釓、鋱、鏑、鈥、鉺、銩、鐿、鎦及其組合;且x具有數值1至3。
  10. 如請求項9之方法,其中該至少一種金屬先質為雙疊氮化鋇。
  11. 一種製造有機發光二極體之方法,其包括以下步驟:提供至少一種金屬先質,其能夠轉變成經沉積之含金屬層,其中該至少一種金屬先質係包括式M(N3 )x 化合物,其中M係選自由鋰、鈉、鉀、銣、銫、鉣、鈹、鎂、 鈣、鍶、鋇、鐳、鑭、鈰、鐠、釹、鉅、釤、銪、釓、鋱、鏑、鈥、鉺、銩、鐿、鎦及其組合所構成群組;且x具有數值1至3;在基板頂上形成包含該至少一種金屬先質之層;使先質層轉化,以形成經沉積之含金屬陰極;將發光有機層與陰極合併,及將陽極與陰極及發光層合併,該發光層係被定位於陰極與陽極之間。
  12. 如請求項11之方法,其中該至少一種金屬先質為金屬疊氮化物。
  13. 如請求項11之方法,其中該至少一種金屬先質為雙疊氮化鋇。
  14. 如請求項11之方法,其中轉化係使用能量來源達成,選自包括光、熱、電子束照射、離子束照射及其混合。
  15. 如請求項11之方法,其中該至少一種金屬先質係以流體施用。
  16. 如請求項11之方法,其中陰極具有功函數值小於3.0eV。
  17. 一種光面板,其包含如請求項1之裝置。
  18. 如請求項17之光面板,其中陰極層材料係包括鋇。
  19. 如請求項17之光面板,其中該至少一種金屬先質係包括雙疊氮化鋇。
TW96126063A 2006-09-28 2007-07-17 具有潛伏致動層之有機發光裝置 TWI457042B (zh)

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Application Number Priority Date Filing Date Title
US11/536,228 US20070075628A1 (en) 2005-10-04 2006-09-28 Organic light emitting devices having latent activated layers

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US (1) US20070075628A1 (zh)
EP (1) EP2067192A2 (zh)
JP (1) JP5663165B2 (zh)
KR (1) KR101434867B1 (zh)
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JP6035706B2 (ja) * 2010-04-09 2016-11-30 三菱化学株式会社 有機電界素子用組成物の製造方法、有機電界素子用組成物、有機電界発光素子の製造方法、有機電界発光素子、有機el表示装置および有機el照明
KR102465065B1 (ko) 2015-09-29 2022-11-09 프라이요그, 엘엘씨 금속 조성물 및 이의 제조 방법
KR20210143789A (ko) 2019-03-25 2021-11-29 시노비아 테크놀로지스 비평형 열경화 공정

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CN101517772B (zh) 2012-07-18
CN101517772A (zh) 2009-08-26
KR20090071573A (ko) 2009-07-01
WO2008094294A2 (en) 2008-08-07
TW200822798A (en) 2008-05-16
US20070075628A1 (en) 2007-04-05
JP2010505236A (ja) 2010-02-18
JP5663165B2 (ja) 2015-02-04
WO2008094294A3 (en) 2009-02-19
EP2067192A2 (en) 2009-06-10
KR101434867B1 (ko) 2014-09-02

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