CN101510536B - 半导体装置及半导体装置的制造方法 - Google Patents
半导体装置及半导体装置的制造方法 Download PDFInfo
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- CN101510536B CN101510536B CN200810186572.8A CN200810186572A CN101510536B CN 101510536 B CN101510536 B CN 101510536B CN 200810186572 A CN200810186572 A CN 200810186572A CN 101510536 B CN101510536 B CN 101510536B
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008-033012 | 2008-02-14 | ||
| JP2008033012A JP5007250B2 (ja) | 2008-02-14 | 2008-02-14 | 半導体装置の製造方法 |
| JP2008033012 | 2008-02-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101510536A CN101510536A (zh) | 2009-08-19 |
| CN101510536B true CN101510536B (zh) | 2012-07-18 |
Family
ID=40954354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810186572.8A Active CN101510536B (zh) | 2008-02-14 | 2008-12-25 | 半导体装置及半导体装置的制造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US7812456B2 (enExample) |
| JP (1) | JP5007250B2 (enExample) |
| CN (1) | CN101510536B (enExample) |
| TW (1) | TWI456714B (enExample) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7342312B2 (en) * | 2004-09-29 | 2008-03-11 | Rohm Co., Ltd. | Semiconductor device |
| US7812994B2 (en) | 2005-06-10 | 2010-10-12 | Marvell International Technology Ltd. | Handheld printer |
| JP5007250B2 (ja) * | 2008-02-14 | 2012-08-22 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP5538682B2 (ja) * | 2008-03-06 | 2014-07-02 | ピーエスフォー ルクスコ エスエイアールエル | 半導体装置及びその製造方法 |
| JP5415710B2 (ja) * | 2008-04-10 | 2014-02-12 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US8610283B2 (en) * | 2009-10-05 | 2013-12-17 | International Business Machines Corporation | Semiconductor device having a copper plug |
| US8759209B2 (en) | 2010-03-25 | 2014-06-24 | Stats Chippac, Ltd. | Semiconductor device and method of forming a dual UBM structure for lead free bump connections |
| JP5587702B2 (ja) * | 2010-08-26 | 2014-09-10 | 株式会社テラプローブ | 半導体装置及び半導体装置の製造方法 |
| US8742564B2 (en) | 2011-01-17 | 2014-06-03 | Bai-Yao Lou | Chip package and method for forming the same |
| US8581389B2 (en) * | 2011-05-27 | 2013-11-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Uniformity control for IC passivation structure |
| JP5605520B2 (ja) * | 2012-03-22 | 2014-10-15 | 株式会社村田製作所 | 半導体装置および半導体モジュール |
| JP5826716B2 (ja) | 2012-06-19 | 2015-12-02 | 株式会社東芝 | 半導体装置及びその製造方法 |
| US9136221B2 (en) * | 2012-09-28 | 2015-09-15 | Intel Corporation | Methods of providing dielectric to conductor adhesion in package structures |
| WO2014069662A1 (ja) | 2012-11-05 | 2014-05-08 | 大日本印刷株式会社 | 配線構造体 |
| JP5986499B2 (ja) * | 2012-12-21 | 2016-09-06 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP6221074B2 (ja) | 2013-03-22 | 2017-11-01 | パナソニックIpマネジメント株式会社 | 半導体装置 |
| JP2015018958A (ja) | 2013-07-11 | 2015-01-29 | インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation | 実装構造体および実装構造体製造方法 |
| JP6299406B2 (ja) * | 2013-12-19 | 2018-03-28 | ソニー株式会社 | 半導体装置、半導体装置の製造方法、及び電子機器 |
| JP6658782B2 (ja) * | 2013-12-19 | 2020-03-04 | ソニー株式会社 | 半導体装置の製造方法 |
| CN105793964A (zh) * | 2014-11-13 | 2016-07-20 | 瑞萨电子株式会社 | 半导体器件及其制造方法 |
| JP2017045865A (ja) | 2015-08-26 | 2017-03-02 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| CN105575935A (zh) * | 2016-02-25 | 2016-05-11 | 中国电子科技集团公司第十三研究所 | Cmos驱动器晶圆级封装及其制作方法 |
| US9922920B1 (en) | 2016-09-19 | 2018-03-20 | Nanya Technology Corporation | Semiconductor package and method for fabricating the same |
| JP6814698B2 (ja) * | 2017-06-05 | 2021-01-20 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP6872991B2 (ja) * | 2017-06-29 | 2021-05-19 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| JP2019114750A (ja) | 2017-12-26 | 2019-07-11 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| KR102432627B1 (ko) | 2018-01-11 | 2022-08-17 | 삼성전자주식회사 | 반도체 패키지 |
| JP7063027B2 (ja) * | 2018-03-19 | 2022-05-09 | Tdk株式会社 | 薄膜コンデンサおよび薄膜コンデンサの製造方法 |
| US11302734B2 (en) * | 2018-06-29 | 2022-04-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Deep trench isolation structures resistant to cracking |
| US20200058646A1 (en) * | 2018-08-14 | 2020-02-20 | Intel Corporation | Structures and methods for large integrated circuit dies |
| JP2020077743A (ja) * | 2018-11-07 | 2020-05-21 | 日立化成株式会社 | 積層体及び半導体パッケージ |
| WO2020154862A1 (en) * | 2019-01-28 | 2020-08-06 | Yangtze Memory Technologies Co., Ltd. | Systems and methods for designing dummy patterns |
| KR102494920B1 (ko) | 2019-05-21 | 2023-02-02 | 삼성전자주식회사 | 반도체 패키지 |
| US10971447B2 (en) * | 2019-06-24 | 2021-04-06 | International Business Machines Corporation | BEOL electrical fuse |
| TWI754997B (zh) | 2019-07-31 | 2022-02-11 | 日商村田製作所股份有限公司 | 半導體裝置及高頻模組 |
| JP2021197474A (ja) | 2020-06-16 | 2021-12-27 | 株式会社村田製作所 | 半導体装置 |
| KR20230013677A (ko) | 2021-07-16 | 2023-01-27 | 삼성전자주식회사 | 더미 패턴을 포함하는 반도체 패키지 |
| WO2025013298A1 (ja) * | 2023-07-13 | 2025-01-16 | 株式会社レゾナック | 配線基板の製造方法、半導体装置の製造方法、配線基板、及び、半導体装置 |
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| JPH09306914A (ja) * | 1996-05-16 | 1997-11-28 | Oki Electric Ind Co Ltd | 半導体素子の配線形成方法 |
| JP2000349196A (ja) * | 1999-06-08 | 2000-12-15 | Sumitomo Metal Electronics Devices Inc | 電子部品の電解めっき方法および電子部品の製造方法 |
| US6277669B1 (en) * | 1999-09-15 | 2001-08-21 | Industrial Technology Research Institute | Wafer level packaging method and packages formed |
| JP2001351984A (ja) * | 2000-06-08 | 2001-12-21 | Mitsubishi Electric Corp | ダミーパターンのレイアウト決定方法、それを用いた半導体装置およびその製造方法 |
| JP2002217377A (ja) * | 2001-01-18 | 2002-08-02 | Hitachi Ltd | 半導体集積回路装置およびその製造方法 |
| JP2003017530A (ja) * | 2001-06-28 | 2003-01-17 | Hitachi Ltd | 半導体装置およびその実装方法 |
| JP2003017494A (ja) | 2001-07-04 | 2003-01-17 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
| JP2007220870A (ja) * | 2006-02-16 | 2007-08-30 | Casio Comput Co Ltd | 半導体基板および半導体素子の製造方法 |
| TW200532837A (en) | 2004-03-26 | 2005-10-01 | Renesas Tech Corp | Method for manufacturing semiconductor integrated circuit device |
| US7425767B2 (en) * | 2004-07-14 | 2008-09-16 | Megica Corporation | Chip structure with redistribution traces |
| JP2007173749A (ja) | 2005-12-26 | 2007-07-05 | Sony Corp | 半導体装置及びその製造方法 |
| JP5007250B2 (ja) * | 2008-02-14 | 2012-08-22 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
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| US7812456B2 (en) | 2010-10-12 |
| TW200941664A (en) | 2009-10-01 |
| CN101510536A (zh) | 2009-08-19 |
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| US20090206490A1 (en) | 2009-08-20 |
| US8558391B2 (en) | 2013-10-15 |
| US20130001772A1 (en) | 2013-01-03 |
| TWI456714B (zh) | 2014-10-11 |
| JP5007250B2 (ja) | 2012-08-22 |
| JP2009194144A (ja) | 2009-08-27 |
| US20110001236A1 (en) | 2011-01-06 |
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