CN101510536B - 半导体装置及半导体装置的制造方法 - Google Patents

半导体装置及半导体装置的制造方法 Download PDF

Info

Publication number
CN101510536B
CN101510536B CN200810186572.8A CN200810186572A CN101510536B CN 101510536 B CN101510536 B CN 101510536B CN 200810186572 A CN200810186572 A CN 200810186572A CN 101510536 B CN101510536 B CN 101510536B
Authority
CN
China
Prior art keywords
pattern
dielectric film
semiconductor substrate
semiconductor device
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200810186572.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN101510536A (zh
Inventor
小出优树
南正隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Electronics Corp
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Publication of CN101510536A publication Critical patent/CN101510536A/zh
Application granted granted Critical
Publication of CN101510536B publication Critical patent/CN101510536B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10Bump connectors ; Manufacturing methods related thereto
    • H01L24/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/023Redistribution layers [RDL] for bonding areas
    • H01L2224/0231Manufacturing methods of the redistribution layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/0401Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/05575Plural external layers
    • H01L2224/0558Plural external layers being stacked
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/05599Material
    • H01L2224/056Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05638Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/05644Gold [Au] as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001Core members of the bump connector
    • H01L2224/13099Material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001Core members of the bump connector
    • H01L2224/13099Material
    • H01L2224/131Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13101Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H01L2224/13111Tin [Sn] as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01004Beryllium [Be]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01014Silicon [Si]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01015Phosphorus [P]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01019Potassium [K]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01022Titanium [Ti]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01023Vanadium [V]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01028Nickel [Ni]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01047Silver [Ag]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/0105Tin [Sn]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01074Tungsten [W]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/014Solder alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/049Nitrides composed of metals from groups of the periodic table
    • H01L2924/04944th Group
    • H01L2924/04941TiN
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/049Nitrides composed of metals from groups of the periodic table
    • H01L2924/050414th Group
    • H01L2924/05042Si3N4
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1306Field-effect transistor [FET]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
CN200810186572.8A 2008-02-14 2008-12-25 半导体装置及半导体装置的制造方法 Active CN101510536B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008-033012 2008-02-14
JP2008033012A JP5007250B2 (ja) 2008-02-14 2008-02-14 半導体装置の製造方法
JP2008033012 2008-02-14

Publications (2)

Publication Number Publication Date
CN101510536A CN101510536A (zh) 2009-08-19
CN101510536B true CN101510536B (zh) 2012-07-18

Family

ID=40954354

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200810186572.8A Active CN101510536B (zh) 2008-02-14 2008-12-25 半导体装置及半导体装置的制造方法

Country Status (4)

Country Link
US (3) US7812456B2 (enExample)
JP (1) JP5007250B2 (enExample)
CN (1) CN101510536B (enExample)
TW (1) TWI456714B (enExample)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7342312B2 (en) * 2004-09-29 2008-03-11 Rohm Co., Ltd. Semiconductor device
US7812994B2 (en) 2005-06-10 2010-10-12 Marvell International Technology Ltd. Handheld printer
JP5007250B2 (ja) * 2008-02-14 2012-08-22 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5538682B2 (ja) * 2008-03-06 2014-07-02 ピーエスフォー ルクスコ エスエイアールエル 半導体装置及びその製造方法
JP5415710B2 (ja) * 2008-04-10 2014-02-12 ルネサスエレクトロニクス株式会社 半導体装置
US8610283B2 (en) * 2009-10-05 2013-12-17 International Business Machines Corporation Semiconductor device having a copper plug
US8759209B2 (en) 2010-03-25 2014-06-24 Stats Chippac, Ltd. Semiconductor device and method of forming a dual UBM structure for lead free bump connections
JP5587702B2 (ja) * 2010-08-26 2014-09-10 株式会社テラプローブ 半導体装置及び半導体装置の製造方法
US8742564B2 (en) 2011-01-17 2014-06-03 Bai-Yao Lou Chip package and method for forming the same
US8581389B2 (en) * 2011-05-27 2013-11-12 Taiwan Semiconductor Manufacturing Company, Ltd. Uniformity control for IC passivation structure
JP5605520B2 (ja) * 2012-03-22 2014-10-15 株式会社村田製作所 半導体装置および半導体モジュール
JP5826716B2 (ja) 2012-06-19 2015-12-02 株式会社東芝 半導体装置及びその製造方法
US9136221B2 (en) * 2012-09-28 2015-09-15 Intel Corporation Methods of providing dielectric to conductor adhesion in package structures
WO2014069662A1 (ja) 2012-11-05 2014-05-08 大日本印刷株式会社 配線構造体
JP5986499B2 (ja) * 2012-12-21 2016-09-06 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6221074B2 (ja) 2013-03-22 2017-11-01 パナソニックIpマネジメント株式会社 半導体装置
JP2015018958A (ja) 2013-07-11 2015-01-29 インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation 実装構造体および実装構造体製造方法
JP6299406B2 (ja) * 2013-12-19 2018-03-28 ソニー株式会社 半導体装置、半導体装置の製造方法、及び電子機器
JP6658782B2 (ja) * 2013-12-19 2020-03-04 ソニー株式会社 半導体装置の製造方法
CN105793964A (zh) * 2014-11-13 2016-07-20 瑞萨电子株式会社 半导体器件及其制造方法
JP2017045865A (ja) 2015-08-26 2017-03-02 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
CN105575935A (zh) * 2016-02-25 2016-05-11 中国电子科技集团公司第十三研究所 Cmos驱动器晶圆级封装及其制作方法
US9922920B1 (en) 2016-09-19 2018-03-20 Nanya Technology Corporation Semiconductor package and method for fabricating the same
JP6814698B2 (ja) * 2017-06-05 2021-01-20 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6872991B2 (ja) * 2017-06-29 2021-05-19 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP2019114750A (ja) 2017-12-26 2019-07-11 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
KR102432627B1 (ko) 2018-01-11 2022-08-17 삼성전자주식회사 반도체 패키지
JP7063027B2 (ja) * 2018-03-19 2022-05-09 Tdk株式会社 薄膜コンデンサおよび薄膜コンデンサの製造方法
US11302734B2 (en) * 2018-06-29 2022-04-12 Taiwan Semiconductor Manufacturing Company, Ltd. Deep trench isolation structures resistant to cracking
US20200058646A1 (en) * 2018-08-14 2020-02-20 Intel Corporation Structures and methods for large integrated circuit dies
JP2020077743A (ja) * 2018-11-07 2020-05-21 日立化成株式会社 積層体及び半導体パッケージ
WO2020154862A1 (en) * 2019-01-28 2020-08-06 Yangtze Memory Technologies Co., Ltd. Systems and methods for designing dummy patterns
KR102494920B1 (ko) 2019-05-21 2023-02-02 삼성전자주식회사 반도체 패키지
US10971447B2 (en) * 2019-06-24 2021-04-06 International Business Machines Corporation BEOL electrical fuse
TWI754997B (zh) 2019-07-31 2022-02-11 日商村田製作所股份有限公司 半導體裝置及高頻模組
JP2021197474A (ja) 2020-06-16 2021-12-27 株式会社村田製作所 半導体装置
KR20230013677A (ko) 2021-07-16 2023-01-27 삼성전자주식회사 더미 패턴을 포함하는 반도체 패키지
WO2025013298A1 (ja) * 2023-07-13 2025-01-16 株式会社レゾナック 配線基板の製造方法、半導体装置の製造方法、配線基板、及び、半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1929124A (zh) * 2005-09-06 2007-03-14 株式会社瑞萨科技 半导体器件及其制造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09306914A (ja) * 1996-05-16 1997-11-28 Oki Electric Ind Co Ltd 半導体素子の配線形成方法
JP2000349196A (ja) * 1999-06-08 2000-12-15 Sumitomo Metal Electronics Devices Inc 電子部品の電解めっき方法および電子部品の製造方法
US6277669B1 (en) * 1999-09-15 2001-08-21 Industrial Technology Research Institute Wafer level packaging method and packages formed
JP2001351984A (ja) * 2000-06-08 2001-12-21 Mitsubishi Electric Corp ダミーパターンのレイアウト決定方法、それを用いた半導体装置およびその製造方法
JP2002217377A (ja) * 2001-01-18 2002-08-02 Hitachi Ltd 半導体集積回路装置およびその製造方法
JP2003017530A (ja) * 2001-06-28 2003-01-17 Hitachi Ltd 半導体装置およびその実装方法
JP2003017494A (ja) 2001-07-04 2003-01-17 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2007220870A (ja) * 2006-02-16 2007-08-30 Casio Comput Co Ltd 半導体基板および半導体素子の製造方法
TW200532837A (en) 2004-03-26 2005-10-01 Renesas Tech Corp Method for manufacturing semiconductor integrated circuit device
US7425767B2 (en) * 2004-07-14 2008-09-16 Megica Corporation Chip structure with redistribution traces
JP2007173749A (ja) 2005-12-26 2007-07-05 Sony Corp 半導体装置及びその製造方法
JP5007250B2 (ja) * 2008-02-14 2012-08-22 ルネサスエレクトロニクス株式会社 半導体装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1929124A (zh) * 2005-09-06 2007-03-14 株式会社瑞萨科技 半导体器件及其制造方法

Also Published As

Publication number Publication date
US7812456B2 (en) 2010-10-12
TW200941664A (en) 2009-10-01
CN101510536A (zh) 2009-08-19
US8274157B2 (en) 2012-09-25
US20090206490A1 (en) 2009-08-20
US8558391B2 (en) 2013-10-15
US20130001772A1 (en) 2013-01-03
TWI456714B (zh) 2014-10-11
JP5007250B2 (ja) 2012-08-22
JP2009194144A (ja) 2009-08-27
US20110001236A1 (en) 2011-01-06

Similar Documents

Publication Publication Date Title
CN101510536B (zh) 半导体装置及半导体装置的制造方法
US12074119B2 (en) Chip package structure
US8101496B2 (en) Method of manufacturing ball grid array type semiconductor device
CN101060088B (zh) 半导体封装结构及其制造方法
TWI578470B (zh) 半導體裝置和半導體裝置的製造方法
US20110024900A1 (en) Semiconductor device including a stress buffer material formed above a low-k metallization system
CN107799493B (zh) 半导体封装
EP1482553A2 (en) Semiconductor device and manufacturing method thereof
US11545463B2 (en) Chip package structure with ring-like structure
US12113033B2 (en) Chip package structure
JP5412552B2 (ja) 半導体装置
JP2008016514A (ja) 半導体装置の製造方法および半導体装置
JP2005019522A (ja) 半導体装置及びその製造方法
US12417970B2 (en) Method for forming chip package structure
US20230069511A1 (en) Semiconductor package
JP2008010449A (ja) 半導体装置の製造方法
JP2008160142A (ja) 半導体装置及びその製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
ASS Succession or assignment of patent right

Owner name: NEC ELECTRONICS CORPORATION

Free format text: FORMER OWNER: RENESAS TECHNOLOGY CORP.

Effective date: 20100816

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: TOKYO, JAPAN TO: KANAGAWA PREFECTURE, JAPAN

TA01 Transfer of patent application right

Effective date of registration: 20100816

Address after: Kanagawa

Applicant after: NEC electronics KK

Address before: Tokyo, Japan

Applicant before: Renesas Technology Corp.

C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP02 Change in the address of a patent holder

Address after: Tokyo, Japan

Patentee after: Renesas Electronics Corporation

Address before: Kanagawa

Patentee before: Renesas Electronics Corporation

CP02 Change in the address of a patent holder