CN101496156B - 探针板的平行度调整机构 - Google Patents

探针板的平行度调整机构 Download PDF

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Publication number
CN101496156B
CN101496156B CN2007800286100A CN200780028610A CN101496156B CN 101496156 B CN101496156 B CN 101496156B CN 2007800286100 A CN2007800286100 A CN 2007800286100A CN 200780028610 A CN200780028610 A CN 200780028610A CN 101496156 B CN101496156 B CN 101496156B
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CN
China
Prior art keywords
probe card
probe
parallelism
wafer
clamp face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007800286100A
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English (en)
Chinese (zh)
Other versions
CN101496156A (zh
Inventor
山田佳男
中山浩志
长屋光浩
井沼毅
赤尾崇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NHK Spring Co Ltd
Original Assignee
NHK Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NHK Spring Co Ltd filed Critical NHK Spring Co Ltd
Publication of CN101496156A publication Critical patent/CN101496156A/zh
Application granted granted Critical
Publication of CN101496156B publication Critical patent/CN101496156B/zh
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
CN2007800286100A 2006-07-31 2007-07-26 探针板的平行度调整机构 Expired - Fee Related CN101496156B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP208911/2006 2006-07-31
JP2006208911A JP5101060B2 (ja) 2006-07-31 2006-07-31 プローブカードの平行度調整機構
PCT/JP2007/064703 WO2008015962A1 (fr) 2006-07-31 2007-07-26 Mécanisme de réglage du parallélisme d'une carte sonde

Publications (2)

Publication Number Publication Date
CN101496156A CN101496156A (zh) 2009-07-29
CN101496156B true CN101496156B (zh) 2011-07-20

Family

ID=38997142

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800286100A Expired - Fee Related CN101496156B (zh) 2006-07-31 2007-07-26 探针板的平行度调整机构

Country Status (8)

Country Link
US (1) US8049525B2 (enExample)
EP (1) EP2051293A1 (enExample)
JP (1) JP5101060B2 (enExample)
KR (1) KR101115548B1 (enExample)
CN (1) CN101496156B (enExample)
SG (1) SG173419A1 (enExample)
TW (1) TW200809230A (enExample)
WO (1) WO2008015962A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8456184B2 (en) * 2007-03-14 2013-06-04 Nhk Spring Co., Ltd. Probe card for a semiconductor wafer
TWI428608B (zh) * 2011-09-16 2014-03-01 Mpi Corp 探針測試裝置與其製造方法
TWI479158B (zh) * 2013-01-28 2015-04-01 Mpi Corp 晶圓測試探針卡
US9470750B2 (en) * 2013-04-16 2016-10-18 Mpi Corporation Alignment adjusting mechanism for probe card, position adjusting module using the same and modularized probing device
US9435856B2 (en) * 2013-04-16 2016-09-06 Mpi Corporation Position adjustable probing device and probe card assembly using the same
CN103267940B (zh) * 2013-05-06 2016-08-10 上海华岭集成电路技术股份有限公司 多模块平行测试系统
JP5819880B2 (ja) * 2013-05-08 2015-11-24 本田技研工業株式会社 平行度調整装置および平行度調整方法
KR101415276B1 (ko) * 2013-10-07 2014-07-04 주식회사 쎄믹스 웨이퍼 표면 검사가 가능한 웨이퍼 프로버 시스템
KR102566685B1 (ko) * 2016-07-18 2023-08-14 삼성전자주식회사 프로브 카드용 클램핑 장치 및 이를 포함하는 프로브 카드
KR102425309B1 (ko) 2016-10-12 2022-07-26 삼성전자주식회사 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더
JP6895772B2 (ja) * 2017-03-07 2021-06-30 東京エレクトロン株式会社 検査装置およびコンタクト方法
JP7075725B2 (ja) * 2017-05-30 2022-05-26 株式会社日本マイクロニクス 電気的接続装置
JP2020009978A (ja) * 2018-07-12 2020-01-16 東京エレクトロン株式会社 回路装置、テスタ、検査装置及び回路基板の反り調整方法
KR102673906B1 (ko) * 2018-11-02 2024-06-10 세메스 주식회사 카드 홀더 및 이를 포함하는 프로브 스테이션
US11933816B2 (en) * 2019-03-20 2024-03-19 Celadon Systems, Inc. Portable probe card assembly
CN115280166A (zh) * 2020-03-13 2022-11-01 日本电产理德股份有限公司 检查治具以及包括所述检查治具的基板检查装置
CN113640557B (zh) * 2021-08-11 2022-12-23 山东大学 一种扎针高度自调整系统及方法
TWM639797U (zh) * 2022-02-10 2023-04-11 旺矽科技股份有限公司 晶圓檢測系統及其環形座
KR102851820B1 (ko) * 2023-08-14 2025-08-29 에이엠티 주식회사 Hbm 테스트용 소켓의 장착장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002323538A (ja) * 2001-04-25 2002-11-08 Mitsubishi Materials Corp プローブ装置
JP2003324132A (ja) * 2002-04-30 2003-11-14 Japan Electronic Materials Corp テスト用基板
CN1485622A (zh) * 2002-08-09 2004-03-31 日本电子材料株式会社 探针卡
JP2006010629A (ja) * 2004-06-29 2006-01-12 Tokyo Electron Ltd 平行調整機構を備えたプローブカード

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1610375A3 (en) 1995-05-26 2008-11-05 FormFactor, Inc. Contact carriers for populating substrates with spring contacts
JP4022518B2 (ja) * 2001-06-18 2007-12-19 株式会社アドバンテスト 平面調整機構を有するプローブコンタクトシステム
JP4395429B2 (ja) * 2004-10-20 2010-01-06 日本発條株式会社 コンタクトユニットおよびコンタクトユニットを用いた検査システム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002323538A (ja) * 2001-04-25 2002-11-08 Mitsubishi Materials Corp プローブ装置
JP2003324132A (ja) * 2002-04-30 2003-11-14 Japan Electronic Materials Corp テスト用基板
CN1485622A (zh) * 2002-08-09 2004-03-31 日本电子材料株式会社 探针卡
JP2006010629A (ja) * 2004-06-29 2006-01-12 Tokyo Electron Ltd 平行調整機構を備えたプローブカード

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
JP特开2002323538A 2002.11.08
JP特开2003324132A 2003.11.14
JP特开2006010629A 2006.01.12
说明书第3页第2段至第10页第1段，图1-7.

Also Published As

Publication number Publication date
KR20090033884A (ko) 2009-04-06
TWI353453B (enExample) 2011-12-01
US20100001752A1 (en) 2010-01-07
CN101496156A (zh) 2009-07-29
TW200809230A (en) 2008-02-16
WO2008015962A1 (fr) 2008-02-07
JP5101060B2 (ja) 2012-12-19
US8049525B2 (en) 2011-11-01
KR101115548B1 (ko) 2012-03-05
SG173419A1 (en) 2011-08-29
EP2051293A1 (en) 2009-04-22
JP2008032648A (ja) 2008-02-14

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Granted publication date: 20110720

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