TWI353453B - - Google Patents
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- Publication number
- TWI353453B TWI353453B TW096127945A TW96127945A TWI353453B TW I353453 B TWI353453 B TW I353453B TW 096127945 A TW096127945 A TW 096127945A TW 96127945 A TW96127945 A TW 96127945A TW I353453 B TWI353453 B TW I353453B
- Authority
- TW
- Taiwan
- Prior art keywords
- probe card
- probe
- card
- reference surface
- parallelism
- Prior art date
Links
- 239000000523 sample Substances 0.000 claims description 288
- 230000003014 reinforcing effect Effects 0.000 claims description 32
- 238000007689 inspection Methods 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 14
- 238000012937 correction Methods 0.000 claims description 10
- 238000005304 joining Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims 2
- 238000009434 installation Methods 0.000 claims 1
- 238000009941 weaving Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 53
- 239000000758 substrate Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 8
- 238000012360 testing method Methods 0.000 description 6
- 230000000149 penetrating effect Effects 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910000737 Duralumin Inorganic materials 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 235000013372 meat Nutrition 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006208911A JP5101060B2 (ja) | 2006-07-31 | 2006-07-31 | プローブカードの平行度調整機構 |
| PCT/JP2007/064703 WO2008015962A1 (fr) | 2006-07-31 | 2007-07-26 | Mécanisme de réglage du parallélisme d'une carte sonde |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200809230A TW200809230A (en) | 2008-02-16 |
| TWI353453B true TWI353453B (enExample) | 2011-12-01 |
Family
ID=38997142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096127945A TW200809230A (en) | 2006-07-31 | 2007-07-31 | Mechanism for adjusting the parallelness of a probe card |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8049525B2 (enExample) |
| EP (1) | EP2051293A1 (enExample) |
| JP (1) | JP5101060B2 (enExample) |
| KR (1) | KR101115548B1 (enExample) |
| CN (1) | CN101496156B (enExample) |
| SG (1) | SG173419A1 (enExample) |
| TW (1) | TW200809230A (enExample) |
| WO (1) | WO2008015962A1 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8456184B2 (en) * | 2007-03-14 | 2013-06-04 | Nhk Spring Co., Ltd. | Probe card for a semiconductor wafer |
| TWI428608B (zh) * | 2011-09-16 | 2014-03-01 | Mpi Corp | 探針測試裝置與其製造方法 |
| TWI479158B (zh) * | 2013-01-28 | 2015-04-01 | Mpi Corp | 晶圓測試探針卡 |
| US9470750B2 (en) * | 2013-04-16 | 2016-10-18 | Mpi Corporation | Alignment adjusting mechanism for probe card, position adjusting module using the same and modularized probing device |
| US9435856B2 (en) * | 2013-04-16 | 2016-09-06 | Mpi Corporation | Position adjustable probing device and probe card assembly using the same |
| CN103267940B (zh) * | 2013-05-06 | 2016-08-10 | 上海华岭集成电路技术股份有限公司 | 多模块平行测试系统 |
| JP5819880B2 (ja) * | 2013-05-08 | 2015-11-24 | 本田技研工業株式会社 | 平行度調整装置および平行度調整方法 |
| KR101415276B1 (ko) * | 2013-10-07 | 2014-07-04 | 주식회사 쎄믹스 | 웨이퍼 표면 검사가 가능한 웨이퍼 프로버 시스템 |
| KR102566685B1 (ko) * | 2016-07-18 | 2023-08-14 | 삼성전자주식회사 | 프로브 카드용 클램핑 장치 및 이를 포함하는 프로브 카드 |
| KR102425309B1 (ko) | 2016-10-12 | 2022-07-26 | 삼성전자주식회사 | 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더 |
| JP6895772B2 (ja) * | 2017-03-07 | 2021-06-30 | 東京エレクトロン株式会社 | 検査装置およびコンタクト方法 |
| JP7075725B2 (ja) * | 2017-05-30 | 2022-05-26 | 株式会社日本マイクロニクス | 電気的接続装置 |
| JP2020009978A (ja) * | 2018-07-12 | 2020-01-16 | 東京エレクトロン株式会社 | 回路装置、テスタ、検査装置及び回路基板の反り調整方法 |
| KR102673906B1 (ko) * | 2018-11-02 | 2024-06-10 | 세메스 주식회사 | 카드 홀더 및 이를 포함하는 프로브 스테이션 |
| US11933816B2 (en) * | 2019-03-20 | 2024-03-19 | Celadon Systems, Inc. | Portable probe card assembly |
| CN115280166A (zh) * | 2020-03-13 | 2022-11-01 | 日本电产理德股份有限公司 | 检查治具以及包括所述检查治具的基板检查装置 |
| CN113640557B (zh) * | 2021-08-11 | 2022-12-23 | 山东大学 | 一种扎针高度自调整系统及方法 |
| TWM639797U (zh) * | 2022-02-10 | 2023-04-11 | 旺矽科技股份有限公司 | 晶圓檢測系統及其環形座 |
| KR102851820B1 (ko) * | 2023-08-14 | 2025-08-29 | 에이엠티 주식회사 | Hbm 테스트용 소켓의 장착장치 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1610375A3 (en) | 1995-05-26 | 2008-11-05 | FormFactor, Inc. | Contact carriers for populating substrates with spring contacts |
| JP2002323538A (ja) * | 2001-04-25 | 2002-11-08 | Mitsubishi Materials Corp | プローブ装置 |
| JP4022518B2 (ja) * | 2001-06-18 | 2007-12-19 | 株式会社アドバンテスト | 平面調整機構を有するプローブコンタクトシステム |
| JP2003324132A (ja) * | 2002-04-30 | 2003-11-14 | Japan Electronic Materials Corp | テスト用基板 |
| JP3621938B2 (ja) * | 2002-08-09 | 2005-02-23 | 日本電子材料株式会社 | プローブカード |
| JP2006010629A (ja) * | 2004-06-29 | 2006-01-12 | Tokyo Electron Ltd | 平行調整機構を備えたプローブカード |
| JP4395429B2 (ja) * | 2004-10-20 | 2010-01-06 | 日本発條株式会社 | コンタクトユニットおよびコンタクトユニットを用いた検査システム |
-
2006
- 2006-07-31 JP JP2006208911A patent/JP5101060B2/ja not_active Expired - Fee Related
-
2007
- 2007-07-26 CN CN2007800286100A patent/CN101496156B/zh not_active Expired - Fee Related
- 2007-07-26 US US12/309,825 patent/US8049525B2/en active Active
- 2007-07-26 KR KR1020097001962A patent/KR101115548B1/ko not_active Expired - Fee Related
- 2007-07-26 EP EP07791403A patent/EP2051293A1/en not_active Withdrawn
- 2007-07-26 SG SG2011053824A patent/SG173419A1/en unknown
- 2007-07-26 WO PCT/JP2007/064703 patent/WO2008015962A1/ja not_active Ceased
- 2007-07-31 TW TW096127945A patent/TW200809230A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090033884A (ko) | 2009-04-06 |
| US20100001752A1 (en) | 2010-01-07 |
| CN101496156A (zh) | 2009-07-29 |
| CN101496156B (zh) | 2011-07-20 |
| TW200809230A (en) | 2008-02-16 |
| WO2008015962A1 (fr) | 2008-02-07 |
| JP5101060B2 (ja) | 2012-12-19 |
| US8049525B2 (en) | 2011-11-01 |
| KR101115548B1 (ko) | 2012-03-05 |
| SG173419A1 (en) | 2011-08-29 |
| EP2051293A1 (en) | 2009-04-22 |
| JP2008032648A (ja) | 2008-02-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |