CN101473072A - 电解涂覆装置和方法 - Google Patents

电解涂覆装置和方法 Download PDF

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Publication number
CN101473072A
CN101473072A CNA2007800226453A CN200780022645A CN101473072A CN 101473072 A CN101473072 A CN 101473072A CN A2007800226453 A CNA2007800226453 A CN A2007800226453A CN 200780022645 A CN200780022645 A CN 200780022645A CN 101473072 A CN101473072 A CN 101473072A
Authority
CN
China
Prior art keywords
axle
tape
substrate
conductive
negative electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007800226453A
Other languages
English (en)
Chinese (zh)
Inventor
R·洛赫特曼
J·卡祖恩
N·施奈德
J·普菲斯特
G·波尔
N·瓦格纳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF SE
Original Assignee
BASF SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BASF SE filed Critical BASF SE
Publication of CN101473072A publication Critical patent/CN101473072A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/14—Electrodes, e.g. composition, counter electrode for pad-plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C25D5/06—Brush or pad plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
CNA2007800226453A 2006-04-18 2007-04-17 电解涂覆装置和方法 Pending CN101473072A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06112723 2006-04-18
EP06112723.9 2006-04-18

Publications (1)

Publication Number Publication Date
CN101473072A true CN101473072A (zh) 2009-07-01

Family

ID=38236519

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007800226453A Pending CN101473072A (zh) 2006-04-18 2007-04-17 电解涂覆装置和方法

Country Status (11)

Country Link
US (1) US20090101511A1 (ja)
EP (1) EP2010699A2 (ja)
JP (1) JP2009534527A (ja)
KR (1) KR20090009876A (ja)
CN (1) CN101473072A (ja)
BR (1) BRPI0710241A2 (ja)
CA (1) CA2649786A1 (ja)
IL (1) IL194754A0 (ja)
RU (1) RU2420616C2 (ja)
TW (1) TW200811316A (ja)
WO (1) WO2007118875A2 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395626B (ja) * 2009-12-18 2013-05-11
CN103959483A (zh) * 2011-03-12 2014-07-30 王家雄 用于制备薄膜型太阳能电池的组合式连续电沉积设备
CN105164591A (zh) * 2013-04-30 2015-12-16 尤尼韦索有限公司 用于处理微机械部件的支座
CN106795645A (zh) * 2014-09-18 2017-05-31 莫杜美拓有限公司 用于连续施加纳米层压金属涂层的方法和装置
CN113400698A (zh) * 2021-05-11 2021-09-17 重庆金美新材料科技有限公司 一种导电传动带及其制备方法、薄膜水电镀设备
WO2024082493A1 (zh) * 2022-10-19 2024-04-25 重庆金美新材料科技有限公司 一种阴极导电机构和电镀系统

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EP1919703B1 (en) 2005-08-12 2013-04-24 Modumetal, LLC Compositionally modulated composite materials and methods for making the same
TW200829726A (en) * 2006-11-28 2008-07-16 Basf Ag Method and device for electrolytic coating
EP2265746A2 (de) * 2008-03-13 2010-12-29 Basf Se Verfahren und dispersion zum aufbringen einer metallschicht auf einem substrat sowie metallisierbare thermoplastische formmasse
NL1035265C2 (nl) * 2008-04-07 2009-10-08 Meco Equip Eng Werkwijze en inrichting voor het elektrolytisch galvaniseren van niet-metallische glasachtige substraten.
CA2764887C (en) 2009-06-08 2018-09-11 Modumetal Llc Electrodeposited, nanolaminate coatings and claddings for corrosion protection
KR101103450B1 (ko) * 2010-07-27 2012-01-09 주식회사 케이씨텍 기판 도금 장치
WO2014145771A1 (en) 2013-03-15 2014-09-18 Modumetal, Inc. Electrodeposited compositions and nanolaminated alloys for articles prepared by additive manufacturing processes
US10472727B2 (en) 2013-03-15 2019-11-12 Modumetal, Inc. Method and apparatus for continuously applying nanolaminate metal coatings
CN105189828B (zh) 2013-03-15 2018-05-15 莫杜美拓有限公司 具有高硬度的镍铬纳米层压涂层
CA2905548C (en) 2013-03-15 2022-04-26 Modumetal, Inc. Nanolaminate coatings
EA201500947A1 (ru) 2013-03-15 2016-03-31 Модьюметл, Инк. Устройство и способ электроосаждения нанослоистого покрытия
RU2534794C2 (ru) * 2013-03-21 2014-12-10 Открытое акционерное общество "Научно-исследовательский институт конструкционных материалов на основе графита "НИИграфит" Способ связывания волокнистого пан материала при проведении стадий получения из него углеродного волокна
KR101419276B1 (ko) * 2013-08-27 2014-07-15 (주)엠에스티테크놀로지 플라즈마 전해 산화에 의한 코팅 형성 방법
BR112017005534A2 (pt) 2014-09-18 2017-12-05 Modumetal Inc métodos de preparação de artigos por processos de eletrodeposição e fabricação aditiva
DE102015121349A1 (de) 2015-12-08 2017-06-08 Staku Anlagenbau Gmbh Vorrichtung zur Oberflächenbehandlung eines Endlosmaterials sowie deren Verwendung
KR101681083B1 (ko) * 2016-06-26 2016-12-01 주식회사 지에스아이 곡면부를 포함하는 상대전극을 갖는 도금장치
CA3036191A1 (en) 2016-09-08 2018-03-15 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
US11293272B2 (en) 2017-03-24 2022-04-05 Modumetal, Inc. Lift plungers with electrodeposited coatings, and systems and methods for producing the same
EP3612669A1 (en) 2017-04-21 2020-02-26 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
WO2019210264A1 (en) 2018-04-27 2019-10-31 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
CN110952121B (zh) * 2018-12-17 2023-12-05 嘉兴瑞通智能装备有限公司 焊带制造装置和电镀机构及其电镀方法
CN113512749A (zh) * 2020-12-08 2021-10-19 郑州大学 一种电镀金刚石刀具实验装置
CN117136257A (zh) * 2021-04-21 2023-11-28 三菱电机株式会社 电镀电极和使用该电镀电极的电镀方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
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DE1756267A1 (de) * 1968-04-27 1971-10-07 Carl Klingspor Galvanisiervorrichtung fuer Gewebe
LU80496A1 (fr) * 1978-11-09 1980-06-05 Cockerill Procede et diopositif pour le depot electrolytique en continu et a haute densite de courant d'un metal de recouvrement sur une tole
DE4413149A1 (de) * 1994-04-15 1995-10-19 Schmid Gmbh & Co Geb Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtung für Leiterplatten
WO2003038158A2 (de) * 2001-10-25 2003-05-08 Infineon Technologies Ag Galvanisiereinrichtung und galvanisiersystem zum beschichten von bereits leitfähig ausgebildeten strukturen
DE10234705B4 (de) * 2001-10-25 2008-01-17 Infineon Technologies Ag Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen
DE10342512B3 (de) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395626B (ja) * 2009-12-18 2013-05-11
CN103959483A (zh) * 2011-03-12 2014-07-30 王家雄 用于制备薄膜型太阳能电池的组合式连续电沉积设备
CN103959483B (zh) * 2011-03-12 2016-10-26 王家雄 用于制备薄膜型太阳能电池的组合式连续电沉积设备
CN105164591A (zh) * 2013-04-30 2015-12-16 尤尼韦索有限公司 用于处理微机械部件的支座
CN105164591B (zh) * 2013-04-30 2017-05-31 尤尼韦索有限公司 用于处理微机械部件的支座和包括该支座的组件
CN106795645A (zh) * 2014-09-18 2017-05-31 莫杜美拓有限公司 用于连续施加纳米层压金属涂层的方法和装置
CN106795645B (zh) * 2014-09-18 2020-03-27 莫杜美拓有限公司 用于连续施加纳米层压金属涂层的方法和装置
CN113400698A (zh) * 2021-05-11 2021-09-17 重庆金美新材料科技有限公司 一种导电传动带及其制备方法、薄膜水电镀设备
WO2024082493A1 (zh) * 2022-10-19 2024-04-25 重庆金美新材料科技有限公司 一种阴极导电机构和电镀系统

Also Published As

Publication number Publication date
KR20090009876A (ko) 2009-01-23
RU2008145108A (ru) 2010-05-27
IL194754A0 (en) 2009-08-03
RU2420616C2 (ru) 2011-06-10
TW200811316A (en) 2008-03-01
WO2007118875A3 (de) 2008-08-07
US20090101511A1 (en) 2009-04-23
CA2649786A1 (en) 2007-10-25
WO2007118875A2 (de) 2007-10-25
JP2009534527A (ja) 2009-09-24
EP2010699A2 (de) 2009-01-07
BRPI0710241A2 (pt) 2011-08-09

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Open date: 20090701