US20090101511A1 - Electroplating device and method - Google Patents

Electroplating device and method Download PDF

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Publication number
US20090101511A1
US20090101511A1 US12/297,864 US29786407A US2009101511A1 US 20090101511 A1 US20090101511 A1 US 20090101511A1 US 29786407 A US29786407 A US 29786407A US 2009101511 A1 US2009101511 A1 US 2009101511A1
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United States
Prior art keywords
electrically conductive
shafts
band
substrate
bands
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Abandoned
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US12/297,864
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English (en)
Inventor
Rene Lochtman
Juergen Kaczun
Norbert Schneider
Juergen Pfister
Gert Pohl
Norbert Wagner
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BASF SE
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Individual
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Assigned to BASF AKTIENGESELLSCHAFT reassignment BASF AKTIENGESELLSCHAFT ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KACZUN, JUERGEN, WAGNER, NORBERT, LOCHTMAN, RENE, PFISTER, JUERGEN, SCHNEIDER, NORBERT, POHL, GERT
Publication of US20090101511A1 publication Critical patent/US20090101511A1/en
Abandoned legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/14—Electrodes, e.g. composition, counter electrode for pad-plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C25D5/06—Brush or pad plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Definitions

  • the invention relates to a device for the electrolytic coating of at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a nonconductive substrate, which comprises at least one bath, one anode and one cathode, the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer.
  • the invention furthermore relates to a method for the electrolytic coating of at least one substrate, which is carried out in a device designed according to the invention.
  • DE-B 103 42 512 discloses a device and a method for the electrolytic treatment of electrically conductive structures electrically insulated from one another on surfaces of a strip-shaped object to be treated.
  • the object to be treated is transported on a transport path and continuously in a transport direction, the object to be treated being contacted with a contacting electrode arranged outside an electrolysis region so that a negative voltage is applied to the electrically conductive structures.
  • a contacting electrode arranged outside an electrolysis region so that a negative voltage is applied to the electrically conductive structures.
  • metal ions from the treatment liquid then deposit on the electrically conductive structures to form a metal layer.
  • a galvanizing apparatus in which the contacting unit is arranged in the electrolyte bath is disclosed, for example, in DE-A 102 34 705.
  • the galvanizing apparatus described here is suitable for coating structures arranged on a strip-shaped support, which are already conductively formed.
  • the contacting is in this case carried out via rolls which are in contact with the conductively formed structures. Since the rolls lie in the electrolyte bath, metal from the electrolyte bath likewise deposits on them. In order to be able to remove the metal again, the rolls are constructed from individual segments which are connected cathodically so long as they are in contact with the structures to be coated, and connected anodically when there is no contact between the rolls and the electrically conductive structure.
  • a disadvantage of this arrangement is that a voltage is applied only for a short time on structures which are short as seen in the transport direction, while a voltage is applied over a substantially longer period of time on structures which are long, likewise as seen in the transport direction.
  • the layer which is deposited on long structures is therefore substantially larger than the layer which is deposited on short structures.
  • a disadvantage of the methods known from the prior art is that they cannot be used to coat structures which are very short—especially as seen in the transport direction of the substrate.
  • Another disadvantage is that many rolls connected in series are required in order to produce sufficiently long contact times, so that a very long device is needed.
  • a device for the electrolytic coating of at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a nonconductive substrate which comprises at least one bath, one anode and one cathode, the bath containing an electrolyte solution containing at least one metal salt. From the electrolyte solution, metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer.
  • the at least one cathode is brought in contact with the substrate's surface to be coated while the substrate is transported through the bath.
  • the cathode comprises at least one band having at least one electrically conductive section, which is guided around at least two rotatable shafts.
  • the shafts are configured with a suitable cross section matched to the respective substrate.
  • the shafts are preferably designed cylindrically and may, for example, be provided with grooves in which the at least one band runs.
  • at least one of the shafts is preferably connected cathodically, the shaft being configured so that the current is transmitted from the surface of the shaft to the band.
  • the substrate can be contacted simultaneously via the shafts and the band.
  • the grooves it is also possible for only the grooves to be electrically conductive and for the regions of the shafts between the grooves to be made of an insulating material, so as to prevent the substrate from being electrically contacted via the shafts as well.
  • the current supply of the shafts takes place via sliprings, for example, although it is also possible to use any other suitable device with which current can be transmitted to rotating shafts.
  • the cathode comprises at least one band having at least one electrically conductive section, it is possible even for substrates with short electrically conductive structures, especially as seen in the transport direction of the substrate, to be provided with a sufficiently thick coating. This is possible since owing to the configuration of the cathode as a band, according to the invention, even short electrically conductive structures stay in contact with the cathode for a longer time than is the case in the methods known from the prior art.
  • At least two bands are arranged offset in series.
  • the arrangement is preferably such that the second band, arranged offset behind the first band, contacts the electrically conductive structure in the region on which the metal was deposited when contacting with the first band.
  • more than two bands are connected in series.
  • respectively successive bands arranged offset are guided via at least one common shaft.
  • the bands are respectively guided via two shafts in this case, as seen in the transport direction of the substrate, the rear shaft of the first band is simultaneously the front shaft of the second band.
  • the advantage of this arrangement is that it is possible to economize on shafts and the bath can be kept shorter.
  • the shafts it is also possible to guide the successively arranged bands via respectively independent shafts.
  • the shafts it is advantageous for the shafts to be configured so that they can be raised from the substrate.
  • metal also deposits on the bands and the shafts.
  • the shafts and the bands In order to remove this metal again, it is necessary to connect the shafts and the bands anodically.
  • the bands are respectively arranged independently on shafts, the respectively individual bands together with their shafts can be raised from the substrate and connected anodically, while bands preceding or following the raised bands simultaneously contact the substrate and the electrically conductive structures lying on it, so that the removal of the deposited metal from the bands and shafts can take place during continuous operation.
  • the shafts cannot be raised, or when only one group of bands connected offset in series is provided, in which respectively successive bands arranged offset are guided via at least one common shaft, the metal deposited on the bands and shafts can only be removed during production pauses.
  • the at least one band has a network structure.
  • the advantage of the network structure is that only small regions of the electrically conductive structures to be coated on the substrate are respectively covered by the band. The coating takes place in the holes of the network. So that it is also possible to coat the electrically conductive structures in the regions on which the network rests, even for the case in which the bands are designed in the form of a network structure it is advantageous to arrange at least two bands respectively offset in series, It is also possible to connect two bands designed as networks directly in series, the networks then respectively having different mesh widths and/or different mesh shapes so that regions on which the front network rests can also be coated. Furthermore, it is also possible to provide one band configured as a network, the band having regions with a different mesh width and/or a different mesh shape. Bands with individual holes formed in them are also to be understood as a network in the context of the present invention.
  • the advantage of a band designed in the form of a network is that the network can extend over the entire width of the shafts. It is not necessary for a plurality of narrow bands designed in the form of networks to be arranged next to one another.
  • the width of the individual bands is selected to be as narrow as possible when they are not designed in the form of a network.
  • the width of the bands in this case depends on the fabrication possibilities. The narrower the bands can be formed, the smaller are the conductive structures which can be coated.
  • An advantage of narrow bands with a small distance between them is that the contacting probability of extremely small structures is therefore greater than with a smaller number of wide bands. Since the contact surface of the bands impedes the deposition by covering the structures directly under the band, it is advantageous for this covering effect to be minimized by narrow bands.
  • the electrolyte throughput over the surfaces to be metallized is more uniform owing to a multiplicity of smaller surface accesses than with few surface accesses, as there are with a small number of wide bands.
  • the number of bands arranged next to one another depends on the width of the substrate. When the substrate to be coated is wider, commensurately more bands must be arranged next to one another. Here, care should be taken that a free gap respectively remains between the bands, in which the metal can be deposited on the electrically conductive substrate or the structured or full-surface electrically conductive surface of the substrate.
  • the gap between two bands arranged next to each other is preferably as wide as the band arranged offset behind. Since in the case of a band configured in the form of a network, the coating takes place on the substrate's positions exposed by the individual holes of the network, it is not absolutely necessary here to arrange a plurality of narrow bands in network form next to one another. In this case, it may be sufficient to use one band which extends over the entire width of the substrate.
  • the at least one band alternately comprises conductive sections and nonconductive sections.
  • the band it is possible for the band to be additionally guided around at least one anodically connected shaft, although care should be taken that the length of the conductive sections is less than the distance between a cathodically connected shaft and a neighboring anodically connected shaft. In this way, regions of the band which are in contact with the substrate to be coated are connected cathodically, and regions of the band which are not in contact with the substrate are connected anodically.
  • the advantage of this connection is that metal which deposits on the band during the cathodic connection of the band is removed again during the anodic connection.
  • the anodically connected region is preferably longer than or at least equally long as the cathodically connected region. This may be achieved on the one hand in that the anodically connected shaft has a greater diameter than the cathodically connected shafts, and on the other hand, with an equal or smaller diameter of the anodically connected shafts, it is possible to provide at least as many of them as cathodically connected shafts, the spacing of the cathodically connected shafts and the spacing of the anodically connected shafts preferably being of equal size.
  • the length of the conductive sections is preferably greater than or equal to the distance between two neighboring cathodically connected shafts. Coating then takes place on the electrically conductive structure of the substrate from the first contact of the electrically conductive structure with the cathodically connected section of the band until the time at which the contact of the cathodically connected section of the band with the electrically conductive structure on the substrate is ended.
  • bands with alternately conductive and nonconductive sections for example, it is possible to use linked bands in which the individual links are fastened to one another, for example by brackets. A corresponding number of electrically conductive links are mounted in succession according to the required length of the conductive sections. In order to produce an electrically nonconductive section, at least one nonconductive link is inserted between two electrically conductive links. Besides the structure as a linked chain, it is also possible to provide at least one electrically nonconductive flexible band as a support, which comprises electrically conductive sections fitted electrically insulated from one another at predetermined distances.
  • a suitable conductive material here is, for example, wire or foils which are wound around the support or else flexible or rigid foils which, for example, may also be provided in the form of a network or have holes which are connected to the support.
  • the connection to the support may, for example, be carried out using adhesives.
  • a gap is preferably formed between the individual supports in this case.
  • the supports to contain holes or have a structure in the form of a network.
  • the band has a network structure, for example in which an electrically conductive network is connected to an electrically nonconductive network in order to form the electrically conductive sections and electrically nonconductive sections
  • the electrically conductive sections in the form of a network may be connected to the meshes of a nonconductive section, for example with the aid of a wire which is guided through the individual meshes of the network structure.
  • the band may nevertheless also have any other structure by which conductive and nonconductive sections can be produced in alternation.
  • the substrate In order to coat on a plurality of sides of the substrate it may preferably be rotated in the device, with which the substrate can be rotated, so that after the rotation the surface to be coated first points in the direction of the coating.
  • the electrolytic coating devices When the electrolytic coating devices are arranged above one another, it is also possible to coat the foils simultaneously on the upper side and the lower side by guiding them respectively through between two devices which contact the foil on the upper and lower sides and then deviating them around one of the devices after passing through, so that they can then be guided through between it and a further device arranged above or below the device.
  • the device according to the invention and the method according to the invention it is furthermore possible to coat through-holes contained in the substrate, for instance bores or slots, or even indentations such as blind holes.
  • the coating is carried out in that the metal layers deposited on the upper side and the lower side grow together in the hole.
  • a conductive hole wall is at least partially provided which is coated by the method according to the invention. In this way, it is then also possible to coat the entire wall of a hole. If not all of the hole wall is electrically conductive, here again the entire hole wall is coated by the metal layers growing together.
  • the shafts may also contain a plurality of electrically conductive regions, at least one of which is connected anodically and at least one other is connected cathodically.
  • the band running around is likewise connected cathodically in the cathodically connected region of the shaft, so that coating of the electrically conductive substrate or the structured or full-surface electrically conductive surface of the substrate takes place, while the undesired material previously deposited in the anodic region is removed again from the shaft and/or the at least one band.
  • the electrically conductive sections of the at least one band and the shaft surfaces, or the shaft regions which are in contact with the at least one band are preferably made of an electrically conductive material which does not pass into the electrolyte solution during operation of the device.
  • Suitable materials for making the conductive sections of the band and the shaft surfaces, or the shaft regions which are in contact with the at least one band are for example metals, graphite, conductive polymers such as polythiophenes or metal/plastic composite materials. Stainless steel and/or titanium are preferred materials.
  • Suitable electrolyte solutions which can be used for the electrolytic coating of electrically conductive structures, are known to the person skilled in the art for example from Werner Jillek, Gustl Keller, Handbuch dernatiplattentechnik [handbook of printed circuit technology], Eugen G. Leuze Verlag, 2003, volume 4, pages 332 to 352.
  • At least one further transport roll which preferably consists of an electrically insulating material, to transport the substrate through the bath.
  • a combination of at least one band with at least one additional transport roll is likewise possible.
  • the number of transport rolls required depends on the size of the substrate to be coated.
  • the spacing of the transport rolls must be selected so that at least one transport roll is always in contact with the substrate, unless the transport take places using the bands.
  • the transport may also be carried out using the winding and unwinding unit which is preferably arranged outside the bath.
  • a good contact between the cathodically connected band and the substrate to be coated may also be achieved by pressing the band onto the substrate via the weight of the shafts around which it runs. It is also possible to produce an additional application pressure by pressing the band against the substrate by spring mounting of the shafts.
  • the shafts are preferably driven outside the bath. In a preferred embodiment, all the shafts are driven. It is nevertheless also possible to drive only some of the shafts.
  • the bands may be driven by the substrate lying in contact with them, no shaft around which the band runs being provided with its own drive. It is nevertheless also possible for the band to be additionally driven by the at least one shaft around which it runs. So that a uniform speed of all the bands is achieved, it is preferable for the shafts to be driven via a common drive unit.
  • the drive unit is preferably an electric motor.
  • the shafts are preferably connected to the drive unit via a chain or belt transmission. It is nevertheless also possible to provide the shafts respectively with gearwheels which engage in one another and via which the shafts are driven. Besides the possibilities described here, it is also possible to use any other suitable drive known to the person skilled in the art for driving the shafts.
  • the cathodically connected shafts are raised from the substrate for demetallization while the anodically connected shafts are simultaneously lowered onto the substrate.
  • the shafts previously connected cathodically are connected anodically so that the material deposited thereon can be removed from them, and the shafts previously connected anodically are connected cathodically so that the electrically conductive structures on the substrate can be coated further.
  • Such a shaft change is preferably carried out while the cathodically connected band section is not actually contacting any structure to be coated.
  • shielding is, for example, nonconductive cladding of the shafts which covers the shafts in the regions where they are in contact with the electrolyte solution, the cladding being at a very small distance from the shafts surface and the shafts being exposed only at the positions where the substrate and/or the bands are contacted.
  • the substrate to be coated is rotated through a predetermined angle after passing through the electrolytic coating device. After the rotation, the substrate passes either through the device for a second time or through a second corresponding device.
  • the angle through which the substrate is rotated preferably lies in the range of from 10° to 170°, more preferably in the range of from 50° to 140°, in particular in the range of from 80° to 100°, and more particularly preferably the angle through which the substrate is rotated is essentially 90°. Essentially 90° means that the angle through which the substrate is rotated does not differ by more than 5° from 90°.
  • the device for rotating the substrate may be arranged inside or outside the bath.
  • the rotation axis is perpendicular to the surface to be coated.
  • the rotation axis should be arranged so that after the rotation the substrate is positioned in such a way that the surfaced intended to be coated next points in the direction of the cathode.
  • the layer thickness of the metal layer deposited on the electrically conductive structure by the method according to the invention depends on the contact time, which is given by the speed with which the substrate passes through the device and the number of bands positioned in series, as well as the current strength with which the device is operated. A longer contact time may be achieved, for example, by connecting a plurality of devices according to the invention in series in at least one bath.
  • a plurality of devices according to the invention are connected in series respectively in individual baths. It is therefore possible to hold a different electrolyte solution in each bath, so as to deposit different metals successively on the electrically conductive structures. This is advantageous, for example, in decorative applications or for the production of gold contacts.
  • the respective layer thicknesses can be adjusted by selecting the throughput speed and the number of devices with the same electrolyte solution.
  • the device is preferably used for coating electrically conductive structures on an electrically nonconductive support, for example reinforced or unreinforced polymers such as those conventionally used for printed circuit boards, ceramic materials, glass, silicon, textiles etc.
  • the electrolytically coated electrically conductive structures produced in this way are, for example, conductor tracks.
  • the electrically conductive structures to be coated may, for example, be made of an electrically conductive material printed on the circuit board.
  • the electrically conductive structure preferably either contains particles of any geometry made of an electrically conductive material in a suitable matrix, or consists essentially of the electrically conductive material.
  • Suitable electrically conductive materials are, for example, carbon or graphite, metals, preferably aluminum, ion, gold, copper, nickel, silver and/or alloys or metal mixtures which contain at least one of these metals, electrically conductive metal complexes, conductive organic compounds or conductive polymers.
  • a pretreatment may possibly be necessary first, in order to make the structures electrically conductive. This may, for example, involve a chemical or mechanical pretreatment such as suitable cleaning. In this way, for example, the oxide layer which is disruptive for electrolytic coating is previously removed from metals.
  • the electrically conductive structures to be coated may, however, also be applied on the printed circuit boards by any other method known to the person skilled in the art. Such printed circuit boards are, for example, installed in products such as computers, telephones, televisions, electrical parts for automobiles, keyboards, radios, video, CD, CD-ROM and DVD players, game consoles, measuring and control equipment, sensors, electrical kitchen equipment, electronic toys etc.
  • Such flexible circuit supports are, for example, polymer films such as polyimide films, PET films or polyolefin films, on which electrically conductive structures are printed.
  • the device according to the invention and the method according to the invention are furthermore suitable for the production of RFID antennas, transponder antennas or other forms of antenna, chip card modules, flat cables, seat heaters, foil conductors, conductor tracks in solar cells or in LCD/plasma display screens or for the production of electrolytically coated products in any form, for example thin metal foils, polymer supports metal-clad on one or two sides with a defined layer thickness, 3D-molded interconnect devices or else for the production of decorative or functional surfaces on products, which are used for example for shielding electromagnetic radiation, for thermal conduction or as packaging. It is furthermore possible to produce contact sites or contact pads or interconnections on an integrated electronic component.
  • the substrate After leaving the electrolytic coating device, the substrate may be further processed according to all steps known to the person skilled in the art. For example, remaining electrolyte residues may be removed from the substrate by washing and/or the substrate may be dried.
  • the device according to the invention for the electrolytic coating of electrically conductive substrates or electrically conductive structures on electrically nonconductive substrates may, according to requirements, be equipped with any auxiliary device known to the person skilled in the art.
  • auxiliary devices are, for example, pumps, filters, supply instruments for chemicals, winding and unwinding instruments etc.
  • the device according to the invention may also be operated, for example, in the pulse method known from Werner Jillek, Gustl Keller, Handbuch der Porterplattentechnik [handbook of printed circuit technology], Eugen G. Leuze Verlag, 2003, volume 4, pages 192, 260, 349, 351, 352, 359.
  • the advantage of the device according to the invention and the method according to the invention is that the at least one band provides a greater contact area and therefore a longer contact time per unit area than is the case with rolls such as those known from the prior art. It is therefore possible achieve the desired layer thicknesses of electrically conductive structures within a shorter distance, such that the installations can also be made shorter or operated with a high throughput, so that a lower operating costs are or achieved.
  • Another essential advantage is that now even very short structures, for example those desired in the production of printed circuit boards, can be produced more rapidly, with greater control and above all more reproducibly and with homogeneous layer thicknesses than is possible with the roll systems known from the prior art.
  • FIG. 1 shows a plan view of a device designed according to the invention with a plurality of bands arranged offset in series
  • FIG. 2 shows a side view of the device according FIG. 1 ,
  • FIG. 3 shows a side view of a device designed according to the invention with bands which rest on the shaft
  • FIG. 4 shows a plan view of a device according FIG. 3 .
  • FIG. 5 shows a side view of a device designed according to the invention with bands which rest in grooves of the shaft
  • FIG. 6 shows a plan view of a device according FIG. 5 .
  • FIG. 7 shows a side view of a device designed according to the invention with cathodically and anodically connected shafts
  • FIG. 8 shows a detail of a band as used, for example, in FIG. 7 .
  • FIG. 9 shows a detail of a device designed according to the invention, in which the anodically and cathodically connected shafts can be raised or lowered,
  • FIG. 10 shows a device according to the invention in which the upper and lower sides of a substrate can be coated
  • FIG. 11 shows a device with which upper and lower sides of a substrate can be coated, in which bands are arranged offset in series,
  • FIG. 13 shows an enlarged representation of a detail of a band in a second embodiment
  • FIG. 14 shows a plan view of a detail of a band in a third embodiment
  • FIG. 15 shows a side view of the band according to FIG. 14 .
  • FIG. 16 shows a side view of a device according to the invention with segmented shafts
  • FIG. 17 shows a side view of anodes during the electrolytic coating
  • FIG. 18 shows a side view of the anodes according to FIG. 17 when changing the shafts.
  • FIG. 1 shows a plan view of a cathode designed according to the invention, in which a plurality of bands are arranged offset in series.
  • At least one shaft 3 around which a band 2 runs is respectively connected cathodically. Furthermore, it is also possible to connect each shaft 3 cathodically.
  • anodes 31 in addition to the cathode 1 must also be provided in the bath.
  • the cathodes 31 may be arranged either between the shafts 3 , as represented in FIG. 2 , or else above or below the band 2 .
  • FIG. 5 represents a side view
  • FIG. 6 a plan view of an embodiment in which the bands 2 are held in grooves 30 in the shafts 3 .
  • the width of a groove 30 preferably corresponds to the width of a band 2 and the depth of a groove 30 preferably to the thickness of a band 2 .
  • anodes 31 may be arranged between the cathodes as represented here.
  • the anodes 31 are, for example, designed as flat rods.
  • another electrolytic coating device may be arranged below the substrate 8 instead of the pressure rolls 21 .
  • the substrate 8 can then be coated simultaneously on its upper side and its lower side.
  • FIG. 9 shows a side view of a device designed according to the invention in a further embodiment.
  • the shafts of the anodically connected upper row 9 are arranged offset with respect to the shafts of the cathodically connected lower row 10 .
  • the distance h between two anodically connected shafts, or between two cathodically connected shafts, is selected respectively so that an anodically connected shaft can be guided through between two neighboring cathodically connected shafts and a cathodically connected shaft between two anodically connected shafts.
  • the arrows 15 in FIG. 9 represent the fact that the shafts of the lower row 10 can be raised and the shafts of the upper row 9 can be lowered. This makes it possible for the metal deposited on the cathodically connected shafts to be removed even in continuous production operation.
  • the cathodically connected shafts of the lower row 10 are raised as represented by the arrows 16 , while the shafts of the upper row 9 are lowered as represented by the arrows 16 .
  • the polarity of the shafts is reversed so that after lowering the upper row 9 , these shafts are connected cathodically, and after raising the lower row 10 , these shafts are connected anodically.
  • metal now deposits on the shafts of the upper row 9 which were previously connected anodically but now form the lower row 10 and are connected anodically, while metal is removed from the shafts of the lower row 10 which were previously connected cathodically, so long as they form the upper row 9 and are connected anodically.
  • the transport shafts are respectively the first and/or last shaft of a row 9 , 10 .
  • the first shaft of the upper row 9 always remains connected anodically and stays in its position.
  • FIG. 10 shows an electrolytic coating device in a further embodiment.
  • the substrate 8 is coated simultaneously on the upper and lower sides. To this end, the substrate 8 is guided through between an upper device 17 and a lower device 18 . The distance between the upper device 17 and the lower device 18 is selected so that it corresponds precisely to the thickness of the substrate 8 .
  • the shafts 19 next to the substrate are respectively connected cathodically, while the shafts 20 remote from the substrate are connected anodically.
  • the shafts 19 can preferably be raised from the substrate 8 and the shafts 20 lowered onto the substrate 8 .
  • the polarity of the shafts is simultaneously reversed, so that the shafts 20 are connected cathodically as soon as they contact the substrate 8 , and the shafts 19 are connected anodically as soon as they are raised from the substrate 8 .
  • a plurality of bands 2 are arranged in series on the upper side and the lower side of the substrate 8 .
  • the bands 2 are respectively guided around separate shafts.
  • the successively arranged bands 2 are preferably arranged mutually offset.
  • FIG. 11 corresponds substantially to the embodiment represented in FIG. 10 .
  • a cathodically connected shaft 19 and an anodically connected shaft 20 respectively form the rear shaft of a band 2 and simultaneously the front shaft of a further band 22 , which is represented here by dashes.
  • the arrangement of the bands 2 and of the further bands 22 represented by dashes corresponds to the arrangement represented in FIG. 1 .
  • the bands 22 are respectively arranged offset behind the bands 2 .
  • FIG. 12 represents an enlarged representation of a first embodiment of a band designed according to the invention with electrically conductive sections and electrically nonconductive sections.
  • the band 2 schematically represented here is constructed from individual conductive segments 23 and nonconductive segments 24 .
  • the individual segments 23 , 24 are respectively fastened to one another by brackets 25 .
  • the length of the conductive sections is established by the number of conductive segments 23 which are fastened together.
  • An electrically nonconductive section is in each case arranged between two conductive sections. In general, it is sufficient merely to use a single electrically nonconductive segment 24 for the electrically nonconductive section. It is nevertheless also possible to arrange a plurality of nonconductive segments 24 in series.
  • FIG. 13 represents a further embodiment of a band 2 .
  • the band 2 is made from a flexible support 26 , around which an electrically conductive wire 27 is wound in order to produce an electrically conductive section 12 .
  • a suitable flexible support 26 is, for example, a nonconductive plastic band which is optionally made of an elastomer.
  • an electrically conductive foil may be wound around the flexible support 26 in order to produce the electrically conductive section 12 .
  • a further embodiment of a band 2 is schematically represented in a plan view in FIG. 14 and a side view in FIG. 15 .
  • the band 2 represented here comprises two flexible nonconductive supports 26 , on which conductive sections 32 are fastened at a regular spacing.
  • the conductive sections 32 may, for example, be fastened on the conductive supports 26 by adhesive bonding.
  • the conductive sections 32 may be either rigid or flexible. In the case of rigid conductive sections 32 , their width is preferably selected so that they can run around the shafts 3 . To this end, it is necessary for the width of the conductive sections 32 to be less than the radius of the shaft 3 . If the conductive sections 32 are intended to be made wider, they are preferably made of this flexible material.
  • a suitable material is, for example, a likewise flexible metal foil.
  • the nonconductive support 26 and/or the conductive sections 32 of the band 2 may also be provided with holes or designed in the form of a network.
  • any other structure known to the person skilled in the art from which a band, which alternately has electrically conductive and electrically nonconductive sections, can be produced is possible.
  • a network structure as the band 2 , an electrically conductive network being connected to an electrically nonconductive network, wire or polymer support in order to form the electrically conductive sections 12 and electrically nonconductive sections 13 .
  • the electrically conductive sections in the form of a network may then be connected to the meshes of a nonconductive section with the aid of a wire which is guided through the individual meshes of the network structure.
  • FIG. 16 shows an embodiment of a device designed according to the invention, in which the shafts 3 are constructed from individual conductive segments 35 and nonconductive segments 36 .
  • the conductive segments 35 and the nonconductive segments 36 are arranged alternately. This makes it possible for a conductive segment 35 to be connected cathodically and for a neighboring conductive segment 35 , which is separated from the cathodically connected segment 35 by a nonconductive segment 36 , to be connected anodically.
  • the band 2 running around the shafts 3 it is necessary for the band 2 running around the shafts 3 to be configured with individual conductive 12 and electrically nonconductive sections 13 .
  • the nonconductive sections 13 of the band 2 must be arranged so that they respectively rest on a nonconductive segment 36 of the shaft.
  • sliding contacts 37 , 38 are preferably provided on the shafts 3 .
  • the first sliding contact 37 is used as an anode
  • the second sliding contact 38 as a cathode. So long as a conductive segment 35 is in contact with the first sliding contact 37 , this segment 35 is connected anodically, and it is connected cathodically as soon as it comes in contact with the second sliding contact 38 .
  • FIG. 17 shows a side view of anodes during the electrolytic coating.
  • FIG. 18 shows the anodes in a position when the shafts 3 (which are not represented here) change their position.
  • anodes 31 are provided in addition to the anodically connected shafts 3 or electrically conductive segments of the shafts 3 , they may for example be constructed as represented in FIGS. 17 and 18 .
  • the anodes 31 are in their deployed position. For a substrate 8 which is coated simultaneously on the upper side and the lower side, they are then arranged above and below the substrate 8 . When only one side of the substrate 8 is coated, the anode 31 is preferably arranged on the side of the substrate 8 which is coated. In this case, care should be taken that the anode 31 does not touch the substrate. Otherwise, on the one hand, a short circuit could occur when the cathode touches the same electrically conductive structure as the anode, and on the other hand metal previously deposited on the structure would be removed again during the contact with the anode 31 .
  • the anodes 31 can be moved parallel to the surface of the substrate 8 which is to be coated, as represented by the double arrow 41 in FIG. 18 .
  • the movement takes place transversely to the direction in which the substrate is transported through the bath. This makes it possible to remove the anodes while the shafts 3 change their position. Damage of the anodes 31 and shafts 3 is thereby avoided.
  • the anodes 31 are made of a flexible material. This makes it possible for the anodes to be wound in respectively allocated anode winding/unwinding devices 40 and unwound therefrom.
  • the anode winding/unwinding devices 40 are preferably arranged above and below the bath, as represented here.
  • Such windable and unwindable anodes are, for example, made in the form of flexible metal bands or resilient spirals, If the anodes made of resilient spirals, a plurality of the spirals are preferably fastened next to one another.

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  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
US12/297,864 2006-04-18 2007-04-17 Electroplating device and method Abandoned US20090101511A1 (en)

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EP06112723.9 2006-04-18
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PCT/EP2007/053707 WO2007118875A2 (de) 2006-04-18 2007-04-17 Vorrichtung und verfahren zur galvanischen beschichtung

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US20110259751A1 (en) * 2008-04-07 2011-10-27 Meco Equipment Engineers B.V. Method and device for controlling uplink power
WO2012125288A3 (en) * 2011-03-12 2015-04-23 Jiaxiong Wang A continuous electroplating apparatus with modular sections
WO2016044720A1 (en) * 2014-09-18 2016-03-24 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
US10472727B2 (en) 2013-03-15 2019-11-12 Modumetal, Inc. Method and apparatus for continuously applying nanolaminate metal coatings
US10781524B2 (en) 2014-09-18 2020-09-22 Modumetal, Inc. Methods of preparing articles by electrodeposition and additive manufacturing processes
US10808322B2 (en) 2013-03-15 2020-10-20 Modumetal, Inc. Electrodeposited compositions and nanolaminated alloys for articles prepared by additive manufacturing processes
US10844504B2 (en) 2013-03-15 2020-11-24 Modumetal, Inc. Nickel-chromium nanolaminate coating having high hardness
US10961635B2 (en) 2005-08-12 2021-03-30 Modumetal, Inc. Compositionally modulated composite materials and methods for making the same
US11118280B2 (en) 2013-03-15 2021-09-14 Modumetal, Inc. Nanolaminate coatings
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US11180864B2 (en) 2013-03-15 2021-11-23 Modumetal, Inc. Method and apparatus for continuously applying nanolaminate metal coatings
US11242613B2 (en) 2009-06-08 2022-02-08 Modumetal, Inc. Electrodeposited, nanolaminate coatings and claddings for corrosion protection
US11286575B2 (en) 2017-04-21 2022-03-29 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
US11293272B2 (en) 2017-03-24 2022-04-05 Modumetal, Inc. Lift plungers with electrodeposited coatings, and systems and methods for producing the same
US11365488B2 (en) 2016-09-08 2022-06-21 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
US11519093B2 (en) 2018-04-27 2022-12-06 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation

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US10961635B2 (en) 2005-08-12 2021-03-30 Modumetal, Inc. Compositionally modulated composite materials and methods for making the same
US20110014492A1 (en) * 2008-03-13 2011-01-20 Basf Se Method and dispersion for applying a metal layer to a substrate and metallizable thermoplastic molding compound
US20110259751A1 (en) * 2008-04-07 2011-10-27 Meco Equipment Engineers B.V. Method and device for controlling uplink power
US8871076B2 (en) * 2008-04-07 2014-10-28 Meco Equipment Engineers B.V. Method and device for producing solar cells
US11242613B2 (en) 2009-06-08 2022-02-08 Modumetal, Inc. Electrodeposited, nanolaminate coatings and claddings for corrosion protection
WO2012125288A3 (en) * 2011-03-12 2015-04-23 Jiaxiong Wang A continuous electroplating apparatus with modular sections
US11118280B2 (en) 2013-03-15 2021-09-14 Modumetal, Inc. Nanolaminate coatings
US11180864B2 (en) 2013-03-15 2021-11-23 Modumetal, Inc. Method and apparatus for continuously applying nanolaminate metal coatings
US10844504B2 (en) 2013-03-15 2020-11-24 Modumetal, Inc. Nickel-chromium nanolaminate coating having high hardness
US11851781B2 (en) 2013-03-15 2023-12-26 Modumetal, Inc. Method and apparatus for continuously applying nanolaminate metal coatings
US10472727B2 (en) 2013-03-15 2019-11-12 Modumetal, Inc. Method and apparatus for continuously applying nanolaminate metal coatings
US10808322B2 (en) 2013-03-15 2020-10-20 Modumetal, Inc. Electrodeposited compositions and nanolaminated alloys for articles prepared by additive manufacturing processes
US11168408B2 (en) 2013-03-15 2021-11-09 Modumetal, Inc. Nickel-chromium nanolaminate coating having high hardness
WO2016044720A1 (en) * 2014-09-18 2016-03-24 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
US11560629B2 (en) 2014-09-18 2023-01-24 Modumetal, Inc. Methods of preparing articles by electrodeposition and additive manufacturing processes
US11692281B2 (en) 2014-09-18 2023-07-04 Modumetal, Inc. Method and apparatus for continuously applying nanolaminate metal coatings
US10781524B2 (en) 2014-09-18 2020-09-22 Modumetal, Inc. Methods of preparing articles by electrodeposition and additive manufacturing processes
US11365488B2 (en) 2016-09-08 2022-06-21 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
US11293272B2 (en) 2017-03-24 2022-04-05 Modumetal, Inc. Lift plungers with electrodeposited coatings, and systems and methods for producing the same
US11286575B2 (en) 2017-04-21 2022-03-29 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
US11519093B2 (en) 2018-04-27 2022-12-06 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
CN113512749A (zh) * 2020-12-08 2021-10-19 郑州大学 一种电镀金刚石刀具实验装置

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WO2007118875A3 (de) 2008-08-07
WO2007118875A2 (de) 2007-10-25
EP2010699A2 (de) 2009-01-07
BRPI0710241A2 (pt) 2011-08-09
TW200811316A (en) 2008-03-01
RU2008145108A (ru) 2010-05-27
RU2420616C2 (ru) 2011-06-10
JP2009534527A (ja) 2009-09-24
CA2649786A1 (en) 2007-10-25
CN101473072A (zh) 2009-07-01
IL194754A0 (en) 2009-08-03

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