CN101471415B - 半导体发光装置 - Google Patents

半导体发光装置 Download PDF

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Publication number
CN101471415B
CN101471415B CN200810185048.9A CN200810185048A CN101471415B CN 101471415 B CN101471415 B CN 101471415B CN 200810185048 A CN200810185048 A CN 200810185048A CN 101471415 B CN101471415 B CN 101471415B
Authority
CN
China
Prior art keywords
electrode
insulating substrate
circuit board
soldering
semiconductor light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200810185048.9A
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English (en)
Chinese (zh)
Other versions
CN101471415A (zh
Inventor
小田原正树
青木大
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Publication of CN101471415A publication Critical patent/CN101471415A/zh
Application granted granted Critical
Publication of CN101471415B publication Critical patent/CN101471415B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

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  • Led Device Packages (AREA)
CN200810185048.9A 2007-12-28 2008-12-26 半导体发光装置 Expired - Fee Related CN101471415B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007339330 2007-12-28
JP2007-339330 2007-12-28
JP2007339330A JP2009164176A (ja) 2007-12-28 2007-12-28 半導体発光装置

Publications (2)

Publication Number Publication Date
CN101471415A CN101471415A (zh) 2009-07-01
CN101471415B true CN101471415B (zh) 2013-09-11

Family

ID=40828655

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200810185048.9A Expired - Fee Related CN101471415B (zh) 2007-12-28 2008-12-26 半导体发光装置

Country Status (3)

Country Link
JP (1) JP2009164176A (https=)
KR (1) KR20090072969A (https=)
CN (1) CN101471415B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6219586B2 (ja) 2012-05-09 2017-10-25 ローム株式会社 半導体発光装置
KR101974354B1 (ko) 2013-02-14 2019-05-02 삼성전자주식회사 발광소자 패키지 및 그 제조 방법
JP2017076809A (ja) * 2016-12-05 2017-04-20 大日本印刷株式会社 樹脂付リードフレーム、半導体装置、照明装置
CN108807652B (zh) 2017-04-28 2023-03-21 日亚化学工业株式会社 发光装置
KR101971436B1 (ko) * 2017-12-22 2019-04-23 주식회사 에이유이 탑뷰 및 사이드뷰 실장이 가능한 cob 타입 엘이디 패키지 및 그 제조 방법
CN118507605B (zh) * 2024-05-14 2025-03-04 东莞市欧思科光电科技有限公司 Led灯珠、制备方法及电子设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1377045A (zh) * 2001-03-27 2002-10-30 佳邦科技股份有限公司 表面粘着型可复式过电流保护元件端电极结构及其制法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3447139B2 (ja) * 1995-03-06 2003-09-16 株式会社シチズン電子 チップ型発光ダイオード
JP3797636B2 (ja) * 1997-02-21 2006-07-19 シチズン電子株式会社 表面実装型発光ダイオード及びその製造方法
JP2000036621A (ja) * 1998-07-16 2000-02-02 Shichizun Denshi:Kk 側面型電子部品の電極構造
JP3886306B2 (ja) * 1999-10-13 2007-02-28 ローム株式会社 チップ型半導体発光装置
JP3939145B2 (ja) * 2001-12-18 2007-07-04 シャープ株式会社 側面発光型の表面実装型発光ダイオード

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1377045A (zh) * 2001-03-27 2002-10-30 佳邦科技股份有限公司 表面粘着型可复式过电流保护元件端电极结构及其制法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP特开平8-242019A 1996.09.17
JP特开平9-214002A 1997.08.15

Also Published As

Publication number Publication date
CN101471415A (zh) 2009-07-01
KR20090072969A (ko) 2009-07-02
JP2009164176A (ja) 2009-07-23

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Granted publication date: 20130911

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CF01 Termination of patent right due to non-payment of annual fee