KR20090072969A - 반도체 발광장치 - Google Patents

반도체 발광장치 Download PDF

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Publication number
KR20090072969A
KR20090072969A KR1020080129294A KR20080129294A KR20090072969A KR 20090072969 A KR20090072969 A KR 20090072969A KR 1020080129294 A KR1020080129294 A KR 1020080129294A KR 20080129294 A KR20080129294 A KR 20080129294A KR 20090072969 A KR20090072969 A KR 20090072969A
Authority
KR
South Korea
Prior art keywords
insulating substrate
circuit board
light emitting
semiconductor light
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020080129294A
Other languages
English (en)
Korean (ko)
Inventor
마사키 오다와라
다이 아오키
Original Assignee
스탠리 일렉트릭 컴퍼니, 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스탠리 일렉트릭 컴퍼니, 리미티드 filed Critical 스탠리 일렉트릭 컴퍼니, 리미티드
Publication of KR20090072969A publication Critical patent/KR20090072969A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Led Device Packages (AREA)
KR1020080129294A 2007-12-28 2008-12-18 반도체 발광장치 Withdrawn KR20090072969A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-339330 2007-12-28
JP2007339330A JP2009164176A (ja) 2007-12-28 2007-12-28 半導体発光装置

Publications (1)

Publication Number Publication Date
KR20090072969A true KR20090072969A (ko) 2009-07-02

Family

ID=40828655

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080129294A Withdrawn KR20090072969A (ko) 2007-12-28 2008-12-18 반도체 발광장치

Country Status (3)

Country Link
JP (1) JP2009164176A (https=)
KR (1) KR20090072969A (https=)
CN (1) CN101471415B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9172019B2 (en) 2013-02-14 2015-10-27 Samsung Electronics Co., Ltd. Light emitting device package and method of manufacturing the same
KR101971436B1 (ko) * 2017-12-22 2019-04-23 주식회사 에이유이 탑뷰 및 사이드뷰 실장이 가능한 cob 타입 엘이디 패키지 및 그 제조 방법

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6219586B2 (ja) 2012-05-09 2017-10-25 ローム株式会社 半導体発光装置
JP2017076809A (ja) * 2016-12-05 2017-04-20 大日本印刷株式会社 樹脂付リードフレーム、半導体装置、照明装置
CN108807652B (zh) 2017-04-28 2023-03-21 日亚化学工业株式会社 发光装置
CN118507605B (zh) * 2024-05-14 2025-03-04 东莞市欧思科光电科技有限公司 Led灯珠、制备方法及电子设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3447139B2 (ja) * 1995-03-06 2003-09-16 株式会社シチズン電子 チップ型発光ダイオード
JP3797636B2 (ja) * 1997-02-21 2006-07-19 シチズン電子株式会社 表面実装型発光ダイオード及びその製造方法
JP2000036621A (ja) * 1998-07-16 2000-02-02 Shichizun Denshi:Kk 側面型電子部品の電極構造
JP3886306B2 (ja) * 1999-10-13 2007-02-28 ローム株式会社 チップ型半導体発光装置
CN1377045A (zh) * 2001-03-27 2002-10-30 佳邦科技股份有限公司 表面粘着型可复式过电流保护元件端电极结构及其制法
JP3939145B2 (ja) * 2001-12-18 2007-07-04 シャープ株式会社 側面発光型の表面実装型発光ダイオード

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9172019B2 (en) 2013-02-14 2015-10-27 Samsung Electronics Co., Ltd. Light emitting device package and method of manufacturing the same
KR101971436B1 (ko) * 2017-12-22 2019-04-23 주식회사 에이유이 탑뷰 및 사이드뷰 실장이 가능한 cob 타입 엘이디 패키지 및 그 제조 방법

Also Published As

Publication number Publication date
CN101471415A (zh) 2009-07-01
CN101471415B (zh) 2013-09-11
JP2009164176A (ja) 2009-07-23

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Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000