CN101471415B - Semiconductor light-emitting device - Google Patents
Semiconductor light-emitting device Download PDFInfo
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- CN101471415B CN101471415B CN 200810185048 CN200810185048A CN101471415B CN 101471415 B CN101471415 B CN 101471415B CN 200810185048 CN200810185048 CN 200810185048 CN 200810185048 A CN200810185048 A CN 200810185048A CN 101471415 B CN101471415 B CN 101471415B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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Abstract
The present invention provides a semiconductor light emitter, specifically, the invention provides a side-view type LED lamp which has strong soldering strength to the soldering welding of installed circuit substrate, welding strength increase that can widely adaptive for the bigger dimension and lower dimension and can be manufactured with low cost. An electrode part (4d) and an electrode part (5d) are installed on the substrate (2) for installing the LED component of side-view type LED lamp (1). The electrode part (4d) and the electrode part (5d) extends into an insulation substrate (6) from the electrode (4) and the electrode (5) installed at two ends of insulation substrate (6) in the directions opposing with each other. When the side-view type LED lamp (1) is installed on the circuitsubstrate (7), the end plane (4e) of electrode part (4d) and the end plane (5e) of electrode part (5d) help to increase the welding strength of soldering welding.
Description
Technical field
The present invention relates to semiconductor light-emitting apparatus, in detail, relate under the circuit substrate installment state illumination and penetrate the semiconductor light-emitting apparatus that direction is roughly parallel to this real estate.
Background technology
Penetrate the semiconductor light-emitting apparatus (looking type LED light fixture hereinafter referred to as the limit) that direction is roughly parallel to this real estate as illumination under the circuit substrate installment state, the semiconductor light-emitting apparatus of the structure of Fig. 8～shown in Figure 10 is arranged.Fig. 8 looks type LED light fixture (being designated hereinafter simply as the LED light fixture) is observed this LED light fixture from this LED component side and circuit substrate installation side figure at the limit that 1 LED element is installed, Fig. 9 is that Figure 10 is the figure that observes this LED light fixture from opposition side and the circuit substrate installation side of this LED element at the LED light fixture that 2 LED elements are installed from the figure of the LED light fixture of the opposition side of LED element and circuit substrate installation side observation Fig. 8.
As Fig. 8 and shown in Figure 9, LED light fixture 50 mainly is made of LED element mounting substrate 51, LED element 52 and sealing resin 53, is to use 53 pairs of sealing resins with light transmission to be installed in LED element 52 on the LED element mounting substrate 51 and carries out LED light fixture after resin-sealed.
Specifically, LED element mounting substrate 51 is formed with the 55a of pair of electrodes portion, 56a at a face of insulated substrate 54, be formed with the 55b of pair of electrodes portion, 56b at another face, connect via the 55c of electrode portion, 56c on the opposed end face that is formed on insulated substrate 54 respectively between the opposed electrode 55a of portion, 55b and the 56a of electrode portion, the 56b across insulated substrate 54.
Then, on the 56a of electrode portion, place LED element 52 via conductive component (not illustrating) and realize the lower electrode of LED element 52 and conducting of the 56a of electrode portion, and use closing line 57 that the upper electrode of LED element 52 is connected to realize conducting with the 55a of electrode portion, use 53 pairs of LED elements 52 of sealing resin and closing line 57 with light transmission to carry out resin-sealed.
At this moment, different end face 58a, the 58b of end face with being formed with the described electrode 55c of portion, 56c of LED element mounting substrate 51 is the sections when a plurality of from the installation of finishing LED element 52 and after using sealing resin 53 resin-sealed are taken into substrate (getting the り substrate) monolithic and change into each LED light fixture.
Therefore, end face 56d, the 56e of end face 55d, the 55e of the electrode 55 that is made of the 55a of electrode portion, 55b, 55c and the electrode 56 that is made of the 56a of electrode portion, 56b, 56c is because the section of electrode 55 and electrode 56 still exposes separately, thereby the soakage of solder is bad when solder is welded.Therefore, carry out producing following problem under the situation of solder welding above-mentioned limit being looked type LED light fixture and circuit substrate.
The solder of 50 pairs of circuit substrates of LED light fixture welding is only to use solder leg welding by 3 electrodes that constitute 55 of the 55a of electrode portion, 55b, 55c with by 3 electrodes that constitute 56 of the 56a of electrode portion, 56b, 56c the LED element mounting substrate 51 of the electrode pad of circuit substrate and the LED light fixture 50 that is approximately perpendicular to circuit substrate.Therefore, has the weak shortcoming of weld strength.
And, under the situation of the LED light fixture 50 that 2 LED elements are installed, as shown in figure 10, be necessary between electrode 55 and electrode 56, to arrange by 1 another electrode 59 that constitutes.So in the solder of 50 pairs of circuit substrates of LED light fixture welding, the solder bonding area of electrode 59 is than electrode 55,56 little, thereby weld strength is also than electrode 55,56 more weak.
Then, along with the mounted LEDs number of elements increases, number of electrodes also increases, and the area of per 1 electrode reduces, and the solder weld strength is more weak.
And, as mentioned above, end face 55d, the 55e of the electrode 55 of LED element mounting substrate 51 and end face 56d, the 56e of electrode 56 are because the soakage of solder is bad, thereby the weld strength of solder welding is stable bad, and area is also little, thereby can not go far towards the raising of weld strength.
And along with the miniaturization of LED light fixture 50, the area of electrode is more and more littler, has the small quantization of following the solder coating weight and the more weak tendency of weld strength.
Therefore, following scheme has been proposed, that is: by with electrode 55,56 together on end face 56d, the 56e of end face 55d, the 55e of electrode 55 and electrode 56 with electrode 55, the 56 the same 3-tier architectures that copper plate/nickel coating/Gold plated Layer is set, realize the raising (for example, with reference to patent documentation 1) of the weld strength of solder welding.
[patent documentation 1] Japanese kokai publication hei 8-242019 communique
But, actual conditions are, above-mentioned proposition in end face 55d, the 55e of electrode 55 and the end face 56d of electrode 56, the method that 56e arranges Gold plated Layer, when being installed in LED light fixture 50 on the circuit substrate to this Gold plated Layer part most do not implement solder, almost can not expect the raising effect of weld strength.
Summary of the invention
Therefore, the present invention finishes just in view of the above problems, the purpose of this invention is to provide strong and enhancing weld strength of a kind of weld strength of the solder welding to circuit substrate and can tackle the LED light fixture of far-ranging size from the large-size to the miniature dimensions and can look type LED light fixture with the limit of low cost manufacturing.
In order to solve above-mentioned problem, the invention of invention 1 record of the present invention is a kind of semiconductor light-emitting apparatus, it is used as light source with semiconductor light-emitting elements, illumination is penetrated direction and is roughly parallel to this circuit substrate face under the circuit substrate installment state, it is characterized in that, described semiconductor light-emitting apparatus is formed with a plurality of conductor layers that are connected with another face from a face of the insulated substrate end face by described insulated substrate, a plurality of at least in the described conductor layer have a conductor layer that extends to described insulated substrate from the described conductor layer that is arranged in described end face side, and the face that exposes from described insulated substrate of the conductor layer in extending to described insulated substrate is provided with for the electrodeposited coating that is made of conductive component that improves the solder soakage, when being installed in described semiconductor light-emitting apparatus on the described circuit substrate, between described electrodeposited coating and described circuit substrate, carry out the solder welding.
And the invention of invention of the present invention 2 records is characterized in that, in invention 1, extends to the centre position that conductor layer in the described insulated substrate is formed on the conductor layer on two faces that are positioned at the described insulated substrate that this conductor layer connects.
And, the invention of invention 3 records of the present invention is a kind of semiconductor light-emitting apparatus, it is used as light source with semiconductor light-emitting elements, illumination is penetrated direction and is roughly parallel to this circuit substrate face under the circuit substrate installment state, it is characterized in that, described semiconductor light-emitting apparatus is formed with a plurality of conductor layers that are connected with another face from a face of the insulated substrate end face by described insulated substrate, described insulated substrate is formed with the through slot from the face side that is provided with described conductor layer of this insulated substrate to another face side, inner peripheral surface at described through slot is provided with the electrodeposited coating that is made of conductive component, when being installed in described semiconductor light-emitting apparatus on the described circuit substrate, between described electrodeposited coating and described circuit substrate, carry out the solder welding.
And, the invention of invention 4 records of the present invention is a kind of semiconductor light-emitting apparatus, it is used as light source with semiconductor light-emitting elements, illumination is penetrated direction and is roughly parallel to this circuit substrate face under the circuit substrate installment state, it is characterized in that, described semiconductor light-emitting apparatus is formed with a plurality of conductor layers that are connected with another face from a face of the insulated substrate end face by described insulated substrate, described insulated substrate is formed with the through slot from the face side that is provided with described conductor layer of this insulated substrate to another face side, inner peripheral surface at described through slot is provided with the electrodeposited coating that is made of conductive component, and the filled conductive parts implement to fill out groove in described through slot, when being installed in described semiconductor light-emitting apparatus on the described circuit substrate, described electrodeposited coating and described circuit substrate carry out the solder welding via the described channel parts of filling out.
And, the invention of invention 5 records of the present invention is a kind of semiconductor light-emitting apparatus, it is used as light source with semiconductor light-emitting elements, illumination is penetrated direction and is roughly parallel to this circuit substrate face under the circuit substrate installment state, it is characterized in that, described semiconductor light-emitting apparatus is formed with a plurality of conductor layers that are connected with another face from a face of the insulated substrate end face by described insulated substrate, described insulated substrate is formed with the non-through slot midway from the face side that is provided with described conductor layer of this insulated substrate to another face side, inner peripheral surface at described non-through slot is provided with the electrodeposited coating that is made of conductive component, when being installed in described semiconductor light-emitting apparatus on the described circuit substrate, between described electrodeposited coating and described circuit substrate, carry out the solder welding.
And, the invention of invention 6 records of the present invention is a kind of semiconductor light-emitting apparatus, it is used as light source with semiconductor light-emitting elements, illumination is penetrated direction and is roughly parallel to this circuit substrate face under the circuit substrate installment state, it is characterized in that, described semiconductor light-emitting apparatus is formed with a plurality of conductor layers that are connected with another face from a face of the insulated substrate end face by described insulated substrate, described insulated substrate is formed with the non-through slot midway from the face side that is provided with described conductor layer of this insulated substrate to another face side, inner peripheral surface at described non-through slot is provided with the electrodeposited coating that is made of conductive component, and the filled conductive parts implement to fill out groove in described non-through slot, when being installed in described semiconductor light-emitting apparatus on the described circuit substrate, described electrodeposited coating and described circuit substrate carry out the solder welding via the described channel parts of filling out.
Semiconductor light-emitting apparatus of the present invention is formed with a plurality of conductor layers that are connected with another face from a face of the insulated substrate end face by described insulated substrate, and be provided with from the end face side of conductor layer and extend to conductor layer the insulated substrate, the face that exposes from insulated substrate of the conductor layer in extending to insulated substrate is provided with the electrodeposited coating that is made of conductive component.
Perhaps, semiconductor light-emitting apparatus of the present invention is formed with a plurality of conductor layers that are connected with another face from a face of the insulated substrate end face by described insulated substrate, and be formed with a face side that is provided with conductor layer from insulated substrate to the through slot of another face side or the non-through slot midway from a face side to another face side, be provided with the electrodeposited coating that is constituted by conductive component at the inner peripheral surface of groove.
Then, when being installed in semiconductor light-emitting apparatus on the circuit substrate, between the electrodeposited coating of semiconductor light-emitting apparatus and circuit substrate, carry out the solder welding.
As a result, can realize that strong and enhancing weld strength of a kind of weld strength of the solder welding to circuit substrate can tackle the semiconductor light-emitting apparatus of far-ranging size from the large-size to the miniature dimensions and can look the type semiconductor light-emitting apparatus with the limit of low cost manufacturing.
Description of drawings
Fig. 1 is the skeleton diagram of observing embodiments of the invention 1 from the rightabout of LED element installation direction.
Fig. 2 is the skeleton diagram that the state on the circuit substrate that embodiments of the invention 1 are installed in is shown.
Fig. 3 is the skeleton diagram of observing embodiments of the invention 2 from the rightabout of LED element installation direction.
Fig. 4 is the skeleton diagram that the state on the circuit substrate that embodiments of the invention 2 are installed in is shown.
Fig. 5 is the skeleton diagram of observing embodiments of the invention 3 from the rightabout of LED element installation direction.
Fig. 6 is the skeleton diagram that the state on the circuit substrate that embodiments of the invention 3 are installed in is shown.
Fig. 7 is the skeleton diagram of observing embodiments of the invention 4 from the rightabout of LED element installation direction.
Fig. 8 is the skeleton diagram of observing conventional example from LED element installation direction.
Fig. 9 is the skeleton diagram of observing conventional example from the rightabout of LED element installation direction.
Figure 10 observes the skeleton diagram of another conventional example from the rightabout of LED element installation direction.
Label declaration
1: type (side view type) LED light fixture is looked on the limit; The 2:LED element mounting substrate; 3: sealing resin; 4: electrode; 4a, 4b, 4c, 4d: electrode portion; 4e, 4f: end face; 5: electrode; 5a, 5b, 5c, 5d: electrode portion; 5e, 5f: end face; 6: insulated substrate; 7: circuit substrate; 7a, 7b, 7c: electrode pad; 8a: solder leg; 8b: solder; 9: electrode; 9b, 9e: electrode portion; 10: slot part; 10e: end face; 10g: inner peripheral surface; 11: slot part; 11e: end face; 11g: inner peripheral surface.
Embodiment
Below, describe preferred implementation of the present invention (same section is enclosed same numeral) in detail with reference to Fig. 1～Fig. 7.In addition, the execution mode of the following stated is owing to be preferred concrete example of the present invention, thereby additional preferred various restriction technically arranged, and scope of the present invention just is not limited to these execution modes as long as be not particularly limited record of the present invention in the following description.
[embodiment 1]
Fig. 1 is the stereogram of embodiments of the invention 1, is opposition side and the observed figure of circuit substrate installation side from LED element one side is installed.The limit of present embodiment is looked type (side view type) LED light fixture (being designated hereinafter simply as the LED light fixture) 1 and mainly is made of LED element mounting substrate 2, LED element (not illustrating) and sealing resin 3, is to use 3 pairs of sealing resins with light transmission to be installed in LED element on the LED element mounting substrate 2 and carries out LED light fixture after resin-sealed.In addition, present embodiment is the embodiment that 1 LED element is installed.
Then, although do not illustrate, yet place the LED element via conductive component on pair of electrodes 4 on the LED element mounting substrate 2,5 the electrode 5 and realize the lower electrode of LED element and conducting of electrode 5 being arranged in, and use closing line that the upper electrode of LED element is connected to realize conducting with electrode 4, use 3 pairs of LED elements of sealing resin and closing line to carry out resin-sealed.
LED element mounting substrate 2 is formed with the 4a of pair of electrodes portion, 5a at a face of insulated substrate 6, be formed with the 4b of pair of electrodes portion, 5b at another face, connect via the 4c of electrode portion, 5c on the opposed end face that is formed on insulated substrate 6 respectively between the opposed electrode 4a of portion, 4b and the 5a of electrode portion, the 5b across insulated substrate 6.
Then, the 4d of electrode portion and the 5d of electrode portion extend to the insulated substrate 6 towards mutual opposed direction from the each side of the 4c of electrode portion and the 5c of electrode portion.At this moment, the 4d of electrode portion is in the centre position of the 4a of electrode portion and 4b, and the 5d of electrode portion is in the centre position of the 5a of electrode portion and 5b.
By more than, the 4a of electrode portion, 4b, 4c, 4d interconnect to constitute electrode 4, the 5a of electrode portion, 5b, 5c, 5d interconnect to constitute electrode 5.Electrode 5 is electrically connected with the lower electrode of LED element, and electrode 4 is electrically connected with the upper electrode of LED element.
At this moment, a pair of end face 5e, the 5f of a pair of end face 4e, the 4f of electrode 4 and electrode 5 all are the sections when a plurality of from the installation of finishing the LED element and after using sealing resin 3 resin-sealed are taken into the substrate monolithic and change into each LED light fixture 1.Therefore, when end face 5e, the 5f of end face 4e, the 4f of electrode 4 and electrode 5 did not implement end face and handle, the section of electrode 4 and electrode 5 still was in the state that exposes.
But, electrode 4 and electrode 5 constitute by the metallic film with conductivity, use Copper Foil usually mostly.Copper Foil generally uses the above Copper Foil of thickness 10 μ m, can reach the thickness with the pre-preg material that becomes insulated substrate and the maximum same degree of bonding thin plate.When the thickness thickening, the possibility that produces the space increases.
Constitute the Copper Foil self of electrode 4 and electrode 5 because the soakage of solder is bad, thereby a little less than the weld strength of solder welding.Therefore, form nickel coating at Copper Foil, and form Gold plated Layer or silver coating at this nickel coating.Identical therewith, on end face 5e, the 5f of end face 4e, the 4f of electrode 4 and electrode 5, also form copper plate/nickel coating/Gold plated Layer or silver coating.
Thus, on whole of the part of exposing from insulated substrate 6 of electrode 4 and electrode 5, the superiors become Gold plated Layer or silver coating, have guaranteed the soakage good state of solder.
Fig. 2 (use Fig. 1 A-A cross section) illustrates LED light fixture 1 with said structure by the state of solder welded and installed on circuit substrate.The circuit substrate 7 that LED light fixture 1 is installed on the face that LED light fixture 1 one sides are installed, when LED light fixture 1 is installed with the LED element mounting substrate 2 that is located at this LED light fixture 1 on the corresponding position of electrode 4 and the each side of electrode 5 be provided with electrode pad 7a, 7b.
Then, LED light fixture 1 is placed to the illumination that makes this LED light fixture 1 at circuit substrate 7 and penetrates direction and be roughly parallel to circuit substrate 7.At this moment, the electrode 4 of LED element mounting substrate 2 is positioned on the electrode pad 7a of circuit substrate 7, and the electrode 5 of LED element mounting substrate 2 is positioned on the electrode pad 7b of circuit substrate 7.
Electrode 4 carries out the solder welding with electrode pad 7a and electrode 5 respectively with electrode pad 7b, and the lower electrode of LED element is electrically connected with electrode pad 7b via electrode 5, and the upper electrode of LED element is electrically connected with electrode pad 7a via electrode 4.
The part at electrode pad 7a enforcement solder welding of electrode 4 is perpendicular to the 4a of electrode portion, 4b, 4c and the level of electrode pad 7a in the end face 4e of electrode pad 7a, wherein use solder leg 8a to weld at the 4a of electrode portion, 4b, 4c, at end face 4e use and electrode pad 7a between solder 8b weld.
Equally, the part at electrode pad 7b enforcement solder welding of electrode 5 is perpendicular to the 5a of electrode portion, 5b, 5c and the level of electrode pad 7b in the end face 5e of electrode pad 7b, wherein use solder leg 8a to weld at the 5a of electrode portion, 5b, 5c, at end face 5e use and electrode pad 7b between solder 8b weld.
In existing solder connects, the part at electrode pad 7a enforcement solder welding of electrode 4 is only to use the solder leg to weld at the 4a of electrode portion, 4b, 4c perpendicular to electrode pad 7a, and the part at electrode pad 7b enforcement solder welding of electrode 5 is only to weld at the 5a of electrode portion, 5b, 5c use solder leg perpendicular to electrode pad 7b.
Relative therewith, in LED light fixture of the present invention, except above-mentioned solder weld part, electrode 4,5 end face 4e, 5e separately also helps the solder welding.Particularly, constituting the 4d of electrode portion of electrode 4 and the 5d of electrode portion of formation electrode 5 is the electrode portions that are not located in the existing LED light fixture, because end face 4e, the 5e of these newly-installed electrode 4d of portion, 5d relate to the solder welding, thereby can obtain than the more strong weld strength of existing LED light fixture at circuit substrate 7.
And, end face 4e, the 5e of the 4d of electrode portion, 5d be owing to lay respectively at the electrode pad 7a of circuit substrate 7, the central portion of 7b, thereby go far towards the solder welding of the 4d of intensifier electrode portion and electrode pad 7a and the solder of the 5d of electrode portion and electrode pad 7b is welded.
For forming electrode 4,5 Copper Foil, the thicker weld strength that improves the solder welding of thickness, but, because end face 4e, the 5e of the 4d of electrode portion, 5d lay respectively at the electrode pad 7a of circuit substrate 7, the central portion of 7b, even thereby the thinner weld strength that also can obtain high solder welding of thickness.
[embodiment 2]
Fig. 3 is the stereogram of embodiments of the invention 2, is opposition side and the observed figure of circuit substrate installation side from LED element one side is installed.Present embodiment is the LED light fixture that 2 LED elements are installed.
Present embodiment is compared with above-described embodiment 1, and the 9b of electrode portion and the 9d of electrode portion lay respectively between the 5c of electrode portion of the 4c of electrode portion of the electrode 4 on the LED element mounting substrate 2 that is formed on LED light fixture 1 and electrode 5 and between the 5d of electrode portion of the 4d of electrode portion of electrode 4 and electrode 5.In addition, the 9b of electrode portion is connected to constitute electrode 9 with the 9d of electrode portion in insulated substrate 6.
Generally, electrode 9 uses the 3-tier architecture of copper foil layer/nickel coating/Gold plated Layer to constitute, and end face 9e, the 9f of the 9b of electrode portion of electrode 9 and end face 9e, the 9f of the 9d of electrode portion all use the 3-tier architecture of copper plate/nickel coating/Gold plated Layer to constitute.
Fig. 4 (use Fig. 3 B-B cross section) illustrates LED light fixture 1 with present embodiment and is installed in state on the circuit substrate 7.In advance on the face that LED light fixture 1 one sides are installed of circuit substrate 7, when LED light fixture 1 is installed with the LED element mounting substrate 2 that is located at this LED light fixture 1 on the corresponding position of electrode 4 and the each side of electrode 5 be provided with electrode pad 7a, 7b, and also be provided with electrode pad 7c in the position corresponding with electrode 9.
So, the same with electrode pad 7b with electrode pad 7a and electrode 5 with electrode 4 when being installed in LED light fixture 1 on the circuit substrate 7, electrode 9 is carried out the solder welding with electrode pad 7c.Specifically, electrode 9 use solder leg 8a (illustrate) and electrode pad 7c to weld perpendicular to the 9b of electrode portion of electrode pad 7c, at the end face 9e use that is parallel to electrode pad 7c and electrode pad 7a between solder 8b weld.
As a result, the weld strength of the solder of 1 pair of circuit substrate 7 of LED light fixture welding is stronger than above-described embodiment 1.In addition, the electrode structure of the LED light fixture of present embodiment constitutes by 3 layers, and this is identical with embodiment 1.
[embodiment 3]
Fig. 5 is the stereogram of embodiments of the invention 3, is opposition side and the observed figure of circuit substrate installation side from LED element one side is installed.
Present embodiment is compared with above-described embodiment 1, and near the end face 4e side the 4c of electrode portion that is formed at the electrode 4 on the LED element mounting substrate 2 of LED light fixture 1 is formed with the circular-arc or elliptoid slot part 10 in cross section of the 4a of through electrode portion and the 4b of electrode portion.
Equally, near the end face 5e side the 5c of electrode portion that is formed at the electrode 5 on the LED element mounting substrate 2 of LED light fixture 1 is formed with the circular-arc or elliptoid slot part 11 in cross section of the 5a of through electrode portion and the 5b of electrode portion.
Fig. 6 (use Fig. 5 C-C cross section) illustrates LED light fixture 1 with present embodiment and is installed in state on the circuit substrate 7.The inner peripheral surface 10g of the electrodeposited coating that is formed with 3-tier architecture of slot part 10 and end face 10e are when being installed in LED light fixture 1 on the circuit substrate 7, carry out the solder welding with the electrode pad 7a of circuit substrate 7, the inner peripheral surface 11g of slot part 11 and end face 11e carry out the solder welding with the electrode pad 7b of circuit substrate 7 when being installed in LED light fixture 1 on the circuit substrate 7.
The weld strength of the solder welding when as a result, being formed on slot part 10 on the LED element mounting substrate 2 and slot part 11 and helping to strengthen LED light fixture 1 and be installed on the circuit substrate 7.
In addition, slot part 10 and slot part 11 form with the identical shaped same size in cross section, so that the weld strength equilibrium of solder welding.And slot part 10 and slot part 11 are formed on the identical faces side of insulated substrate 6 at least from being installed on viewpoint on the circuit substrate 7.
Meanwhile, owing to must avoid slot part 10,11 sealing resin 3 is set, thereby has the structure of the LED light fixture that can tackle large-size.
[embodiment 4]
Fig. 7 is the stereogram of embodiments of the invention 4, is opposition side and the observed figure of circuit substrate installation side from LED element one side is installed.Present embodiment is compared with above-described embodiment 3, difference be have be formed on slot part 10 on the LED element mounting substrate 2 of LED light fixture 1,11 be provided with the structure that sealing resin 3 one sides are stopped up.Identical with embodiment 3 in addition, thereby omit explanation.
In the present embodiment, slot part 10,11 can stop up through slot and formation easily by laser processing or with Copper Foil or insulating element.Therefore, the cost of LED element mounting substrate 2 is significantly risen.
Meanwhile, owing to sealing resin 3 can be arranged on slot part 10,11 blocking portion, thereby can realize the miniaturization of LED light fixture, form can tackle in the size structure of undersized LED light fixture extremely.Owing to making a plurality of numbers that are taken into that are taken into substrate, the miniaturization of LED light fixture increases.The advantage that also has the manufacturing cost reduction of per 1 LED light fixture.
In addition, about embodiment 3 and embodiment 4, electroconductive component can also be filled in the slot part 10 and in the slot part 11.And, can also tackle the LED light fixture that a plurality of LED elements are installed.And, can also adopt the structure behind the textural association with embodiment 1 and embodiment 2.
As above detailed description, according to the present invention, can realize that a kind of and existing LED light fixture of the same type compares the manufacturing process with difficulty and make the limit of the structure that the bonding area to the solder welding of the circuit substrate installed increases look type LED light fixture.
As a result, can realize a kind of LED of making light fixture to the weld strength of the solder of circuit substrate welding strong and enhancing energy range weld strength tackle large-size widely to miniature dimensions and can look type LED light fixture with the limit of low cost manufacturing.
Claims (1)
1. semiconductor light-emitting apparatus, as light source, illumination is penetrated direction and is roughly parallel to this circuit substrate face under the circuit substrate installment state with semiconductor light-emitting elements for it, it is characterized in that,
Described semiconductor light-emitting apparatus is formed with the pair of conductors layer that is connected with another face from a face of the insulated substrate that described semiconductor light-emitting elements the is installed end face by described insulated substrate,
Described conductor layer has the intermediate conductor layer that extends to described insulated substrate from the described conductor layer that is arranged in described end face side, and the face that exposes from described insulated substrate of the intermediate conductor layer in extending to described insulated substrate is provided with for the electrodeposited coating that is made of conductive component that improves the solder soakage
The intermediate conductor layer that is formed with described electrodeposited coating is positioned at a described face of insulated substrate and the centre of described another face, and the face that exposes intermediate conductor layer is to penetrate the parallel face of direction with illumination,
When being installed in described semiconductor light-emitting apparatus on the described circuit substrate, between described electrodeposited coating and described circuit substrate, carry out the solder welding,
On the face that the intermediate conductor layer of described insulated substrate is exposed, between described a pair of intermediate conductor layer, be formed with electrode portion,
Described electrode portion links to each other in described insulated substrate, and is formed with electrodeposited coating.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-339330 | 2007-12-28 | ||
| JP2007339330A JP2009164176A (en) | 2007-12-28 | 2007-12-28 | Semiconductor light-emitting apparatus |
| JP2007339330 | 2007-12-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101471415A CN101471415A (en) | 2009-07-01 |
| CN101471415B true CN101471415B (en) | 2013-09-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810185048 Expired - Fee Related CN101471415B (en) | 2007-12-28 | 2008-12-26 | Semiconductor light-emitting device |
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| Country | Link |
|---|---|
| JP (1) | JP2009164176A (en) |
| KR (1) | KR20090072969A (en) |
| CN (1) | CN101471415B (en) |
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| JP6219586B2 (en) * | 2012-05-09 | 2017-10-25 | ローム株式会社 | Semiconductor light emitting device |
| KR101974354B1 (en) | 2013-02-14 | 2019-05-02 | 삼성전자주식회사 | Light emitting device package and method of manufacturing the same |
| JP2017076809A (en) * | 2016-12-05 | 2017-04-20 | 大日本印刷株式会社 | Lead frame with resin, semiconductor device, and lighting device |
| CN108807652B (en) | 2017-04-28 | 2023-03-21 | 日亚化学工业株式会社 | Light emitting device |
| KR101971436B1 (en) * | 2017-12-22 | 2019-04-23 | 주식회사 에이유이 | COB type LED package capable of top view and side view mounting and manufacturing method thereof |
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| CN1377045A (en) * | 2001-03-27 | 2002-10-30 | 佳邦科技股份有限公司 | Surface adhered end electrode for over-current protecting element and its preparing process |
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|---|---|---|---|---|
| JP3447139B2 (en) * | 1995-03-06 | 2003-09-16 | 株式会社シチズン電子 | Chip type light emitting diode |
| JP3797636B2 (en) * | 1997-02-21 | 2006-07-19 | シチズン電子株式会社 | Surface mount type light emitting diode and manufacturing method thereof |
| JP2000036621A (en) * | 1998-07-16 | 2000-02-02 | Shichizun Denshi:Kk | Electrode structure of side-surface electronic component |
| JP3886306B2 (en) * | 1999-10-13 | 2007-02-28 | ローム株式会社 | Chip-type semiconductor light-emitting device |
| JP3939145B2 (en) * | 2001-12-18 | 2007-07-04 | シャープ株式会社 | Side-emitting surface-mount light-emitting diode |
-
2007
- 2007-12-28 JP JP2007339330A patent/JP2009164176A/en active Pending
-
2008
- 2008-12-18 KR KR20080129294A patent/KR20090072969A/en not_active Application Discontinuation
- 2008-12-26 CN CN 200810185048 patent/CN101471415B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1377045A (en) * | 2001-03-27 | 2002-10-30 | 佳邦科技股份有限公司 | Surface adhered end electrode for over-current protecting element and its preparing process |
Non-Patent Citations (2)
| Title |
|---|
| JP特开平8-242019A 1996.09.17 |
| JP特开平9-214002A 1997.08.15 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101471415A (en) | 2009-07-01 |
| KR20090072969A (en) | 2009-07-02 |
| JP2009164176A (en) | 2009-07-23 |
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