JP2009164176A - Semiconductor light-emitting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a side-view type LED lamp capable of increasing the strength of solder bonding to a circuit board on which the LED lamp is mounted, capable of making the high bonding strength available in a wide range from comparatively large size lamps to small size lamps, the LED lamp enabling low-cost manufacturing. <P>SOLUTION: An LED element mounting substrate 2 of a side view type LED lamp 1 is equipped with electrode portions 4d and 5d that extend into the insulating substrate 6 oppositely towards each other from each of the electrodes 4 and 5 provided on both ends of an insulating substrate 6. When the side-view type LED lamp 1 is mounted on a circuit board 7, the end surface 4e of the electrode portion 4d and the end surface 5e of the electrode portion 5d contribute to the increase of the strength of solder bonding. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a semiconductor light-emitting device, and more particularly to a semiconductor light-emitting device in which a light irradiation direction is substantially parallel to the substrate surface when mounted on a circuit board.

  As a semiconductor light emitting device (hereinafter referred to as a side view type LED lamp) whose light irradiation direction is substantially parallel to the substrate surface in a circuit board mounted state, it has a structure as shown in FIGS. There is. FIG. 8 is a view of a side view type LED lamp (hereinafter abbreviated as “LED lamp”) on which one LED element is mounted as viewed from the LED element side and the circuit board mounting side, and FIG. 9 shows the LED lamp of FIG. FIG. 10 is a diagram viewed from the side opposite to the LED element and the circuit board mounting side, and FIG. 10 is a diagram illustrating the LED lamp on which two LED elements are mounted viewed from the side opposite to the LED element and the circuit board mounting side.

  As shown in FIGS. 8 and 9, the LED lamp 50 is mainly composed of an LED element mounting substrate 51, an LED element 52, and a sealing resin 53, and the LED element 52 mounted on the LED element mounting substrate 51. Is sealed with a sealing resin 53 having translucency.

  Specifically, the LED element mounting substrate 51 has a pair of electrode portions 55a and 56a formed on one surface of the insulating substrate 54, and a pair of electrode portions 55b and 56b formed on the other surface. The electrode portions 55a and 55b and the electrode portions 56a and 56b opposed to each other are connected to each other through electrode portions 55c and 56c formed on the opposing end surfaces of the insulating substrate 54, respectively.

  Then, the LED element 52 is placed on the electrode portion 56a via a conductive member (not shown), and the lower electrode of the LED element 52 and the electrode portion 56a are electrically connected, and the upper electrode of the LED element 52 is also provided. And the electrode portion 55a are connected by a bonding wire 57 to achieve electrical conduction, and the LED element 52 and the bonding wire 57 are resin-sealed with a sealing resin 53 having translucency.

  At this time, the end surfaces 58a and 58b of the LED element mounting substrate 51, which are different from the end surfaces on which the electrode portions 55c and 56c are formed, are a large number of the LED elements 52 mounted and the resin sealing with the sealing resin 53 completed. It is a cut surface when dividing into individual LED lamps from a pick-up board.

  Therefore, the end surfaces 55d and 55e of the electrode 55 constituted by the electrode portions 55a, 55b and 55c and the end surfaces 56d and 56e of the electrode 56 constituted by the electrode portions 56a, 56b and 56c are cut surfaces of the electrode 55 and the electrode 56, respectively. It is exposed as it is, and the solder wettability is not good when soldering. Therefore, when soldering the side-view type LED lamp to the circuit board, the following problems occur.

  The soldering of the LED lamp 50 to the circuit board is performed by three electrodes 55a, 55b, and 55c of the LED element mounting board 51 of the LED lamp 50 that are substantially perpendicular to the circuit board. And the electrode 56 which consists of three surfaces of electrode part 56a, 56b, 56c is joined only by a solder fillet. Therefore, there is a drawback that the bonding strength is weak.

  In the case of the LED lamp 50 on which two LED elements are mounted, it is necessary to provide another electrode 59 consisting of one surface between the electrode 55 and the electrode 56 as shown in FIG. Then, in the solder bonding of the LED lamp 50 to the circuit board, since the solder bonding area of the electrode 59 is smaller than that of the electrodes 55 and 56, the bonding strength is further weaker than that of the electrodes 55 and 56.

  As the number of LED elements to be mounted increases, the number of electrodes also increases, the area per electrode decreases, and the solder joint strength becomes weaker.

  Further, as described above, the end faces 55d and 55e of the electrode 55 of the LED element mounting substrate 51 and the end faces 56d and 56e of the electrode 56 are poor in solder wettability, so that the solder joint strength is poor, Since the area is small, it does not greatly contribute to the improvement of the bonding strength.

  Further, as the LED lamp 50 is reduced in size, the area of the electrode is further reduced, and the bonding strength tends to be further reduced as the amount of applied solder is reduced.

Therefore, in addition to the electrodes 55 and 56, the end surfaces 55d and 55e of the electrode 55 and the end surfaces 56d and 56e of the electrode 56 are provided with a three-layer structure of copper plating layer / nickel plating layer / gold plating layer in the same manner as the electrodes 55 and 56. Proposals have been made to improve the bonding strength of solder bonding (see, for example, Patent Document 1).
Japanese Patent Laid-Open No. 8-242019

  By the way, the method of providing a gold plating layer on the end faces 55d and 55e of the electrode 55 and the end faces 56d and 56e of the electrode 56 proposed above is that most of the gold plating layer is soldered when the LED lamp 50 is mounted on the circuit board. In fact, the effect of improving the bonding strength is hardly expected.

  Accordingly, the present invention was devised in view of the above problems, and the object of the present invention is to provide a wide range of sizes from a large size to a small size, which has a strong bonding strength for solder bonding to a circuit board and a relatively high bonding strength. It is possible to provide a side-view type LED lamp that can be manufactured at a low cost.

  In order to solve the above-mentioned problem, the invention described in claim 1 of the present invention uses a semiconductor light-emitting element as a light source, and the light irradiation direction is substantially parallel to the circuit board surface when mounted on the circuit board. A semiconductor light emitting device, wherein the semiconductor light emitting device is formed with a plurality of conductor layers connected from one surface of the insulating substrate to the other surface through an end surface of the insulating substrate, and at least a plurality of the conductor layers are the end surfaces A conductive member having a conductor layer extended into the insulating substrate from the conductor layer positioned on the side and improving the solder wettability on the surface of the conductor layer extended into the insulating substrate exposed from the insulating substrate A plating layer is provided, and solder bonding is performed between the plating layer and the circuit board when the circuit board is mounted in the semiconductor light emitting device.

  According to a second aspect of the present invention, in the first aspect, the conductor layer extended into the insulating substrate is a conductor layer located on both sides of the insulating substrate, to which the conductor layer is connected. It is characterized by being formed at an intermediate position.

  According to a third aspect of the present invention, there is provided a semiconductor light emitting device using a semiconductor light emitting element as a light source and having a light emission direction substantially parallel to the surface of the circuit board when mounted on the circuit board. The semiconductor light emitting device has a plurality of conductor layers connected from one surface of the insulating substrate through the end surface of the insulating substrate to the other surface, and the insulating substrate is provided with the conductor layer of the insulating substrate. A through groove extending from one surface side to the other surface side is formed, and a plated layer made of a conductive member is provided on an inner peripheral surface of the through groove, and the plated layer and the circuit are mounted when the circuit board of the semiconductor light emitting device is mounted. Solder bonding is performed between the substrates.

  According to a fourth aspect of the present invention, there is provided a semiconductor light emitting device using a semiconductor light emitting element as a light source and having a light irradiation direction substantially parallel to the surface of the circuit board when mounted on the circuit board. The semiconductor light emitting device has a plurality of conductor layers connected from one surface of the insulating substrate through the end surface of the insulating substrate to the other surface, and the insulating substrate is provided with the conductor layer of the insulating substrate. A through groove extending from one surface side to the other surface side is formed, a plated layer made of a conductive member is provided on the inner peripheral surface of the through groove, and the through groove is filled with a conductive member to fill the groove. The plating layer and the circuit board are solder-bonded via the groove filling member when the circuit board is mounted on the semiconductor light emitting device.

  According to a fifth aspect of the present invention, there is provided a semiconductor light emitting device using a semiconductor light emitting element as a light source and having a light irradiation direction substantially parallel to the surface of the circuit board when mounted on the circuit board. The semiconductor light emitting device has a plurality of conductor layers connected from one surface of the insulating substrate through the end surface of the insulating substrate to the other surface, and the insulating substrate is provided with the conductor layer of the insulating substrate. A non-penetrating groove extending from the surface side to the other surface side is formed, and a plating layer made of a conductive member is provided on an inner peripheral surface of the non-penetrating groove, and the plating is performed when the circuit board is mounted on the semiconductor light emitting device. Solder bonding is performed between the layer and the circuit board.

  According to a sixth aspect of the present invention, there is provided a semiconductor light emitting device using a semiconductor light emitting element as a light source and having a light irradiation direction substantially parallel to the surface of the circuit board when mounted on the circuit board. The semiconductor light emitting device has a plurality of conductor layers connected from one surface of the insulating substrate through the end surface of the insulating substrate to the other surface, and the insulating substrate is provided with the conductor layer of the insulating substrate. A non-penetrating groove extending from the surface side to the other surface side is formed, a plating layer made of a conductive member is provided on the inner peripheral surface of the non-penetrating groove, and the non-penetrating groove is filled with a conductive member. The groove is filled, and the plating layer and the circuit board are solder-bonded via the groove filling member when the circuit board is mounted on the semiconductor light emitting device.

  The semiconductor light-emitting device of the present invention has a plurality of conductor layers connected from one surface of the insulating substrate to the other surface through the end surface of the insulating substrate, and a conductor layer extending into the insulating substrate from the end surface side of the conductor layer. A plated layer made of a conductive member was provided on the surface of the conductive layer extended in the insulating substrate and exposed from the insulating substrate.

  Alternatively, a plurality of conductive layers connected from one surface of the insulating substrate to the other surface through the end surface of the insulating substrate are formed and from one surface side where the conductive layer of the insulating substrate is provided to the other surface side. A through groove or a non-through groove extending from one surface side to the other surface side was formed, and a plating layer made of a conductive member was provided on the inner peripheral surface of the groove.

  Then, when the semiconductor light emitting device is mounted on the circuit board, solder bonding is performed between the plating layer of the semiconductor light emitting device and the circuit board.

  As a result, the bonding strength of the solder bonding to the circuit board is strong, and the bonding strength can be strengthened for a wide range of semiconductor light emitting devices from a relatively large size to a small size, and can be manufactured at low cost. A side-view type semiconductor light emitting device could be realized.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to FIGS. 1 to 7 (the same parts are given the same reference numerals). The embodiments described below are preferable specific examples of the present invention, and thus various technically preferable limitations are given. However, the scope of the present invention particularly limits the present invention in the following description. Unless stated to the effect, the present invention is not limited to these embodiments.

  FIG. 1 is a perspective view of Example 1 according to the present invention, as viewed from the side opposite to the side on which the LED element is mounted and from the circuit board mounting side. A side view type LED lamp (hereinafter abbreviated as LED lamp) 1 of this embodiment is mainly composed of an LED element mounting substrate 2, an LED element (not shown), and a sealing resin 3. The LED element mounted on the substrate 2 is resin-sealed with a sealing resin 3 having translucency. In this embodiment, one LED element is mounted.

  Although not shown, the LED element is placed on one electrode 5 of the pair of electrodes 4 and 5 located on the LED element mounting substrate 2 via a conductive member, and the lower electrode and the electrode of the LED element 5, the upper electrode of the LED element and the electrode 4 are connected by a bonding wire to achieve electrical conduction, and the LED element and the bonding wire are sealed with a sealing resin 3.

  In the LED lamp 1 of the present invention, the structure of the LED element mounting substrate 2 constituting the LED lamp 1 is devised so that a high bonding strength can be obtained when the LED lamp 1 is mounted on a circuit board by solder bonding. It is a thing. Hereinafter, the LED element mounting substrate 2 will be described in detail.

  The LED element mounting substrate 2 has a pair of electrode portions 4a and 5a formed on one surface of an insulating substrate 6, and a pair of electrode portions 4b and 5b formed on the other surface. The parts 4a and 4b and the electrode parts 5a and 5b are connected to each other via electrode parts 4c and 5c formed on the opposing end surfaces of the insulating substrate 6, respectively.

  And the electrode part 4d and the electrode part 5d are extended in the insulated substrate 6 toward the mutually opposing direction from each of the electrode part 4c and the electrode part 5c. At this time, the electrode part 4d is at an intermediate position between the electrode parts 4a and 4b, and the electrode part 5d is at an intermediate position between the electrode part 5a and the electrode part 5b.

  As described above, the electrode parts 4a, 4b, 4c, and 4d are connected to each other to form the electrode 4, and the electrode parts 5a, 5b, 5c, and 5d are connected to each other to form the electrode 5. The electrode 5 is electrically connected to the lower electrode of the LED element, and the electrode 4 is electrically connected to the upper electrode of the LED element.

  At this time, each of the pair of end faces 4e, 4f of the electrode 4 and the pair of end faces 5e, 5f of the electrode 5 is an individual LED lamp from a multi-chip substrate in which mounting of the LED element and resin sealing with the sealing resin 3 is completed. It is a cut surface when dividing into 1 piece. Therefore, the end surfaces 4e and 4f of the electrode 4 and the end surfaces 5e and 5f of the electrode 5 are in a state where the cut surfaces of the electrode 4 and the electrode 5 are exposed as they are unless the end surface treatment is performed.

  By the way, both the electrode 4 and the electrode 5 are comprised with the metal thin film which has electroconductivity, and a copper foil is normally used in many cases. The copper foil generally has a film thickness of 10 μm or more, and has a maximum thickness equivalent to that of a prepreg material or an adhesive sheet serving as an insulating substrate. As the film thickness increases, the possibility of voids increases.

  Since the copper foil itself constituting the electrode 4 and the electrode 5 does not have good solder wettability, the bonding strength of solder bonding is weak. Therefore, a nickel plating layer is formed on the copper foil, and a gold plating layer or a silver plating layer is further formed thereon. Similarly, the copper plating layer / nickel plating layer / gold plating layer or silver plating layer is also formed on the end surfaces 4e and 4f of the electrode 4 and the end surfaces 5e and 5f of the electrode 5.

  Thereby, the uppermost layer is a gold plating layer or a silver plating layer over the entire surface of the electrode 4 and the electrode 5 exposed from the insulating substrate 6, and a state in which the solder wettability is good is ensured.

  FIG. 2 (using the AA cross section of FIG. 1) shows a state in which the LED lamp 1 having the above structure is mounted on a circuit board by solder bonding. The circuit board 7 on which the LED lamp 1 is mounted includes an electrode 4 and an electrode provided on the LED element mounting board 2 of the LED lamp 1 when the LED lamp 1 is mounted on the surface on which the LED lamp 1 is mounted. Electrode pads 7 a and 7 b are provided at positions corresponding to the respective positions 5.

  The LED lamp 1 is placed on the circuit board 7 so that the light irradiation direction of the LED lamp 1 is substantially parallel to the circuit board 7. At this time, the electrode 4 of the LED element mounting board 2 is positioned on the electrode pad 7 a of the circuit board 7, and the electrode 5 of the LED element mounting board 2 is positioned on the electrode pad 7 b of the circuit board 7.

  The electrode 4 and the electrode pad 7a, the electrode 5 and the electrode pad 7b are solder-bonded, respectively, and the lower electrode of the LED element is electrically connected to the electrode pad 7b via the electrode 5, and the upper electrode of the LED element is the electrode 4 is electrically connected to the electrode pad 7a.

  The portions of the electrode 4 that are soldered to the electrode pad 7a are electrode portions 4a, 4b, and 4c perpendicular to the electrode pad 7a and an end face 4e that is horizontal to the electrode pad 7a, of which the electrode portions 4a and 4b 4c is joined by a solder fillet 8a, and the end face 4e is joined by a solder 8b positioned between the electrode pad 7a.

  Similarly, portions of the electrode 5 where solder bonding is performed to the electrode pad 7b are electrode portions 5a, 5b, 5c perpendicular to the electrode pad 7b and an end surface 5e horizontal to the electrode pad 7b, of which the electrode portion 5a, 5b and 5c are joined by a solder fillet 8a, and the end face 5e is joined by a solder 8b positioned between the electrode pad 7b.

  In the conventional solder connection, the portion of the electrode 4 where the solder bonding is performed with respect to the electrode pad 7a is the bonding by the solder fillet of only the electrode portions 4a, 4b, 4c perpendicular to the electrode pad 7a. The portion where solder bonding is performed on the electrode pad 7b is bonding by the solder fillet of only the electrode portions 5a, 5b, and 5c perpendicular to the electrode pad 7b.

  On the other hand, in the LED lamp of the present invention, the end faces 4e and 5e of the electrodes 4 and 5 contribute to the solder joint in addition to the solder joint portion. In particular, the electrode portion 4d constituting the electrode 4 and the electrode portion 5d constituting the electrode 5 are electrode portions not provided in the conventional LED lamp, and the end faces 4e, 5e of the newly provided electrode portions 4d, 5d are provided. As a result of solder bonding, stronger bonding strength than the conventional LED lamp can be obtained with respect to the circuit board 7.

  Further, since the end faces 4e and 5e of the electrode portions 4d and 5d are located at the center portions of the electrode pads 7a and 7b of the circuit board 7, respectively, solder bonding between the electrode portions 4d and the electrode pads 7a and between the electrode portions 5d and 7b. This greatly contributes to the strengthening of solder joints.

  The copper foil that forms the electrodes 4 and 5 can have higher solder joint strength when the film thickness is thicker, but the end faces 4e and 5e of the electrode portions 4d and 5d are electrode pads 7a and 7b of the circuit board 7, respectively. Therefore, it is possible to obtain a high solder joint strength even if the film thickness is small.

  FIG. 3 is a perspective view of Example 2 according to the present invention, as viewed from the side opposite to the side on which the LED element is mounted and from the circuit board mounting side. The present embodiment is an LED lamp on which two LED elements are mounted.

  The present embodiment is different from the first embodiment in that the electrode portion 4c of the electrode 4 and the electrode portion 5c of the electrode 5 formed on the LED element mounting substrate 2 of the LED lamp 1 and the electrode portion 4d of the electrode 4 Between the electrode part 5d of the electrode 5, the electrode part 9b and the electrode part 9d are located, respectively. The electrode portion 9b and the electrode portion 9d are connected in the insulating substrate 6 to constitute the electrode 9.

  In general, the electrode 9 has a three-layer structure of copper foil layer / nickel plating layer / gold plating layer, and the end surfaces 9e and 9f of the electrode portion 9b of the electrode 9 and the end surfaces 9e and 9f of the electrode portion 9d are both copper plated layer / It has a three-layer structure of nickel plating layer / gold plating layer.

  A state in which the LED lamp 1 of this embodiment is mounted on the circuit board 7 is shown in FIG. 4 (using the BB cross section of FIG. 3). Corresponding to the electrodes 4 and 5 provided on the LED element mounting substrate 2 of the LED lamp 1 when the LED lamp 1 is mounted on the surface of the circuit board 7 on the side where the LED lamp 1 is mounted in advance. Electrode pads 7 a and 7 b are provided at positions where the electrodes are to be disposed, and electrode pads 7 c are also provided at positions corresponding to the electrodes 9.

  Then, when the LED lamp 1 is mounted on the circuit board 7, the electrode 9 and the electrode pad 7c are solder-bonded in the same manner as the electrode 4 and the electrode pad 7a and the electrode 5 and the electrode pad 7b. Specifically, the electrode portion 9b of the electrode 9 perpendicular to the electrode pad 7c is joined to the electrode pad 7c by a solder fillet 8a (not shown), and the electrode 9 is connected to the end face 9e parallel to the electrode pad 7c. Joined by solder 8b located between the pads 7a.

  As a result, the bonding strength of the LED lamp 1 with respect to the circuit board 7 is stronger than that of the first embodiment. In addition, it is the same as that of Example 1 that the electrode structure of the LED lamp of a present Example consists of three layers.

  FIG. 5 is a perspective view of Example 3 according to the present invention, as viewed from the side opposite to the side on which the LED element is mounted and from the circuit board mounting side.

  This embodiment is a cross-sectional circle that penetrates the electrode portion 4a and the electrode portion 4b on the end face 4e side in the vicinity of the electrode portion 4c of the electrode 4 formed on the LED element mounting substrate 2 of the LED lamp 1 with respect to the first embodiment. An arcuate or elliptical groove 10 is formed.

  Similarly, on the side of the end surface 5e of the electrode 5 formed on the LED element mounting substrate 2 of the LED lamp 1 in the vicinity of the electrode surface 5c, a groove portion 11 having an arcuate or elliptical cross section passing through the electrode portion 5a and the electrode portion 5b is formed. Has been.

  Both the groove portion 10 and the groove portion 11 are coated with a conductor on the inner peripheral surface, and the coating is generally constituted by a three-layer structure of copper plating layer / nickel plating layer / gold plating layer. The end portions 10e and 11e of the groove portion 10 and the groove portion 11 are also generally configured by a three-layer structure of copper plating layer / nickel plating layer / gold plating layer.

  A state where the LED lamp 1 of the present embodiment is mounted on the circuit board 7 is shown in FIG. 6 (using the CC cross section of FIG. 5). The inner peripheral surface 10g and the end surface 10e of the groove portion 10 on which the plating layer having the three-layer structure is formed are soldered to the electrode pads 7a of the circuit board 7 when the LED lamp 1 is mounted on the circuit board 7. The peripheral surface 11g and the end surface 11e are soldered to the electrode pads 7b of the circuit board 7 when the LED lamp 1 is mounted on the circuit board 7.

  As a result, the groove portion 10 and the groove portion 11 formed on the LED element mounting substrate 2 contribute to strengthening the bonding strength of the solder joint when the LED lamp 1 is mounted on the circuit board 7.

  In addition, the groove part 10 and the groove part 11 are formed with the same cross-sectional shape and the same size so that the balance of the bonding strength of the solder bonding is balanced. Further, the groove 10 and the groove 11 are formed at least on the same surface side of the insulating substrate 6 from the viewpoint of mounting the circuit board 7.

  The groove portions 10 and 11 do not significantly increase the cost of the LED element mounting substrate 2 because the processing method is simple. By increasing the groove diameter or the number of grooves, the area of the solder joint surface is increased. The bonding strength of solder bonding can be strengthened.

  At the same time, since the sealing resin 3 must be provided so as to avoid the grooves 10 and 11, the structure can be adapted to a relatively large size LED lamp.

  FIG. 7 is a perspective view of Example 4 according to the present invention, as viewed from the side opposite to the side on which the LED element is mounted and from the circuit board mounting side. Compared with the third embodiment, the present embodiment has a structure in which the sealing resin 3 of the grooves 10 and 11 formed on the LED element mounting substrate 2 of the LED lamp 1 is provided and the side is closed. Is different. Since other than that is the same as that of Example 3, description is abbreviate | omitted.

  In the present embodiment, the groove portions 10 and 11 can be easily formed by laser processing or by closing the through groove with a copper foil or an insulating member. Therefore, the cost of the LED element mounting board 2 is not significantly increased.

  At the same time, since the sealing resin 3 can be provided in the portion where the groove portions 10 and 11 are blocked, the LED lamp can be reduced in size, and the structure can be adapted to an LED lamp of a medium size to a small size. . The downsizing of the LED lamp increases the number of multi-pieces, which has the advantage of reducing the manufacturing cost per LED lamp.

  In addition, regarding Example 3 and Example 4, it is also possible to fill the groove part 10 and the groove part 11 with a conductive member. Moreover, it can respond also to the LED lamp which mounts a some LED element. Furthermore, a structure combined with the structures of the first and second embodiments may be used.

  As described above in detail, according to the present invention, there is no difficult manufacturing process compared to the conventional LED lamp of the same type, and the side of the structure in which the bonding area of the solder bonding to the circuit board to be mounted is increased. A view-type LED lamp could be realized.

  As a result, the bonding strength of the LED lamp soldering to the circuit board is strong, and the strengthening of the bonding strength can be widely handled from a relatively large size to a small size, and a side view type LED lamp that can be manufactured at low cost is realized. It became possible to do.

It is the schematic which looked at Example 1 of this invention from the opposite direction to the LED element mounting direction. It is the schematic which shows the state which mounted Example 1 of this invention on the circuit board. It is the schematic which looked at Example 2 of this invention from the opposite direction to the LED element mounting direction. It is the schematic which shows the state which mounted Example 2 of this invention on the circuit board. It is the schematic which looked at Example 3 of this invention from the opposite direction to the LED element mounting direction. It is the schematic which shows the state which mounted Example 3 of this invention on the circuit board. It is the schematic which looked at Example 4 of this invention from the opposite direction to the LED element mounting direction. It is the schematic which looked at the prior art example from the LED element mounting direction. It is the schematic which looked at the prior art example from the opposite direction to the LED element mounting direction. It is the schematic which looked at the other prior art example from the direction opposite to the LED element mounting direction.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Side view type LED lamp 2 LED element mounting board 3 Sealing resin 4 Electrode 4a, 4b, 4c, 4d Electrode part 4e, 4f End face 5 Electrode 5a, 5b, 5c, 5d Electrode part 5e, 5b End face 6 Insulating board 7 Circuit board 7a, 7b, 7c Electrode pad 8a Solder fillet 8b Solder 9 Electrode 9b, 9e Electrode portion 10 Groove portion 10e End surface 10g Inner peripheral surface 11 Groove portion 11e End surface 11g Inner peripheral surface

Claims (6)

  A semiconductor light emitting device having a semiconductor light emitting element as a light source and having a light irradiation direction substantially parallel to the circuit board surface when mounted on the circuit board, wherein the semiconductor light emitting device is insulated from one surface of the insulating substrate. A plurality of conductor layers connected to the other surface through the end face of the substrate are formed, and at least a plurality of the conductor layers have a conductor layer extended from the conductor layer located on the end face side into the insulating substrate. A plating layer made of a conductive member for improving solder wettability is provided on a surface of the conductor layer extended into the insulating substrate, which is exposed from the insulating substrate, and the plating layer is mounted when the circuit board of the semiconductor light emitting device is mounted. A semiconductor light emitting device, wherein solder bonding is performed between the circuit board and the circuit board.   2. The semiconductor light emitting device according to claim 1, wherein the conductor layer extended in the insulating substrate is formed at an intermediate position between the conductor layers connected to the conductor layer and located on both surfaces of the insulating substrate. apparatus.   A semiconductor light emitting device having a semiconductor light emitting element as a light source and having a light irradiation direction substantially parallel to the circuit board surface when mounted on the circuit board, wherein the semiconductor light emitting device is insulated from one surface of the insulating substrate. A plurality of conductor layers connected to the other surface through the end surface of the substrate are formed, and the insulating substrate has a through groove extending from one surface side of the insulating substrate on which the conductor layer is provided to the other surface side. And a plating layer made of a conductive member is provided on the inner peripheral surface of the through groove, and the semiconductor light emitting device is solder-bonded between the plating layer and the circuit board when the circuit board is mounted. Light emitting device.   A semiconductor light emitting device having a semiconductor light emitting element as a light source and having a light irradiation direction substantially parallel to the circuit board surface when mounted on the circuit board, wherein the semiconductor light emitting device is insulated from one surface of the insulating substrate. A plurality of conductor layers connected to the other surface through the end surface of the substrate are formed, and the insulating substrate has a through groove extending from one surface side of the insulating substrate on which the conductor layer is provided to the other surface side. A plating layer made of a conductive member is provided on the inner peripheral surface of the through groove, and the through groove is filled with a conductive member to fill the groove, and the plating layer is mounted when the circuit board of the semiconductor light emitting device is mounted. And the circuit board are solder-bonded via the groove filling member.   A semiconductor light emitting device having a semiconductor light emitting element as a light source and having a light irradiation direction substantially parallel to the circuit board surface when mounted on the circuit board, wherein the semiconductor light emitting device is insulated from one surface of the insulating substrate. A plurality of conductor layers connected to the other surface through the end surface of the substrate are formed, and the insulating substrate is a non-penetrating groove extending from one surface side of the insulating substrate on which the conductor layer is provided to the other surface side And a plating layer made of a conductive member is provided on the inner peripheral surface of the non-through groove, and solder bonding is performed between the plating layer and the circuit board when the circuit board is mounted on the semiconductor light emitting device. A semiconductor light emitting device.   A semiconductor light emitting device having a semiconductor light emitting element as a light source and having a light irradiation direction substantially parallel to the circuit board surface when mounted on the circuit board, wherein the semiconductor light emitting device is insulated from one surface of the insulating substrate. A plurality of conductor layers connected to the other surface through the end surface of the substrate are formed, and the insulating substrate is a non-penetrating groove extending from one surface side of the insulating substrate on which the conductor layer is provided to the other surface side And a plating layer made of a conductive member is provided on the inner peripheral surface of the non-penetrating groove, and the non-penetrating groove is filled with a conductive member to fill the groove. A semiconductor light-emitting device, wherein the plated layer and the circuit board are soldered together via the groove filling member when mounted.

Images