JP2009188005A - Surface-mounted semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface-mounted semiconductor device capable of obtaining high connection reliability by preventing failures of connection. <P>SOLUTION: A light-emitting device 1 includes two mounted light-emitting elements, an insulation substrate 21 having the light-emitting elements mounted on a mounting surface, and a first terminal 224, a second terminal 225 and a third terminal 226, provided on respective side faces 21a and 21b of the substrate 21. A lower terminal 224c of the first terminal, which is the lowest one of the first, second and third terminals 224, 225 and 226 and the second terminal 225 have the same area and are formed at the same height from the lower end of the insulation substrate 21. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a surface-mount semiconductor device including an insulating substrate on which a semiconductor element is mounted and a total of three or more odd terminals provided on both side surfaces of the insulating substrate.

  As a conventional surface mount semiconductor device, for example, one described in Patent Document 1 is known. The chip type light emitting diode described in Patent Document 1 is a side view type formed by cutting a large substrate into individual chips along a cut line with a dicing machine or the like, on both sides of the insulating substrate, One U-shaped terminal is provided for each.

  Since the chip type light emitting diode described in Patent Document 1 has only one light emitting element mounted thereon, the terminals are two terminals of an anode and a cathode. For example, if two light emitting elements are mounted on an insulating substrate and are lit separately, the anode or cathode of each light emitting element is used in common, so that a total of three terminals are required.

In the conventional light emitting device 100 shown in FIGS. 4A and 4B, the first anode terminal 102a is provided on one side surface 101a of the insulating substrate 101, and the terminal is shared on the upper side of the other side surface 101b. The cathode terminal 102b is provided, and the second anode terminal 102c is provided below the other side surface 101b. The cathode terminal 102b extends from the other side surface 101b to the center of the back surface (the surface opposite to the mounting surface on which the light emitting element (not shown) is mounted), and bends downward at the center to extend to the lower end. Yes.
Japanese Patent Laid-Open No. 8-242019

  When mounting the conventional light emitting device 100 on the mounting substrate, first, cream solder is applied to the connection terminals provided on the mounting substrate, and the conventional light emitting device 100 is placed thereon to perform a reflow process. Then, the conventional light emitting device 100 is fixed to the wiring pattern.

  However, since the amount of cream solder adhering to the first anode terminal 102a provided on the one side surface 101a increases, the entire conventional light emitting device 100 is pulled in the direction toward the one side surface 101a. If so, the amount of cream solder adhering to the second anode terminal 102c provided at the lower part of the other side surface 101b becomes smaller than usual, which may cause a connection failure with the mounting substrate.

  Accordingly, an object of the present invention is to provide a surface-mount type semiconductor device that can obtain high connection reliability by preventing connection failure.

  The surface-mount type semiconductor device of the present invention has two lowermost terminals located on the both side surfaces of the odd-numbered terminals in total of three or more provided on both side surfaces of the insulating substrate. Are formed in the same area.

  In the present invention, the amount of cream solder adhering to the lowermost terminal provided on both side surfaces can be made the same amount, so that it is not pulled in any direction. Accordingly, since connection failure can be prevented, a surface mount semiconductor device with high connection reliability can be obtained.

  1st invention of this application is provided with the semiconductor element, the insulated substrate with which the semiconductor element was mounted in the mounting surface, and the odd-numbered terminal with a total of three or more provided in the both sides | surfaces of an insulated substrate, and three or more Among the odd-numbered terminals, the two lowest terminals located on both side surfaces are located in the same area.

  The surface-mount type semiconductor device of the present invention has an odd number of terminals of three or more in total provided on both side surfaces of the insulating substrate. Of the three or more odd-numbered terminals, the lowest two lowest terminals provided on both side surfaces are formed in the same area. Therefore, when the surface-mount type semiconductor device of the present invention is mounted on the mounting substrate with cream solder, the amount of cream solder attached to the lowermost terminals provided on both side surfaces can be made the same amount. It is not pulled in the direction.

  The second invention of the present application is characterized in that, in the first invention, the two lowest terminals are formed at the same height.

  In 2nd invention of this application, the adhesion amount of the cream solder to a lowermost terminal can be made the same more reliably by forming two lowermost terminals in the same height.

  The third invention of the present application is characterized in that the two lowermost terminals extend from the lower end of the insulating substrate to the back surface opposite to the mounting surface at the same height.

  In the third invention of the present application, the lowermost terminal extended not only on the side surface but also on the back surface has the same height from the lower end of the insulating substrate, so that the amount of cream solder adhered can be kept uniform even on the back surface side. Can do.

(Embodiment)
A light-emitting device that is an example of a mountable semiconductor device according to an embodiment of the present invention will be described with reference to the drawings. 1A and 1B are diagrams showing a light-emitting device according to an embodiment of the present invention, in which FIG. 1A is a perspective view seen from one side, and FIG. 1B is a perspective view seen from the other side. FIG. 2 is a plan view of the light-emitting device shown in FIG.

  As shown in FIGS. 1 and 2, a light emitting device 1 includes a printed wiring board 2, two light emitting elements 3 and 3 mounted on a mounting surface that is a surface of the printed wiring board 2, and the light emitting element 3 is sealed. It is a side view type LED provided with the resin package 4 to perform.

  On the printed wiring board 2, an insulating substrate 21, a wiring pattern 22 that is provided on the insulating substrate 21, and a metal thin film such as a copper foil film is subjected to metal plating, and a resist film 23 are formed.

  The wiring pattern 22 includes a mounting portion 221 on which the light emitting elements 3 and 3 are mounted, wire bonding portions 222 and 223, a first terminal (anode terminal) 224 connected to one wire bonding portion 222, and the other wire. A second terminal (anode terminal) 225 connected to the bonding part 223 and a third terminal 226 (cathode terminal) connected to the mounting part 221 are provided.

  The mounting portion 221 is formed in a rectangular shape, and is electrically connected to the n electrode by mounting the light emitting elements 3 and 3. The wire bonding portions 222 and 223 are electrically connected to the p electrodes of the light emitting elements 3 and 3 by the wire 5.

  The first terminal 224 is formed in a U-shaped cross section on one side surface 21a of the insulating substrate 21, and a hollow portion 224a is provided in the center from the front surface to the back surface, so that the upper terminal 224b passing through the upper portion of the side surface 21a A lower terminal 224c that passes through the lower portion of the side surface 21a and a connecting portion 224d that connects the upper terminal 224b and the lower terminal 224c on the back surface side are formed.

  The second terminal 225 is formed in a U-shaped cross section on the other side surface 21b of the insulating substrate 21, and is formed at the same height H from the lower end of the lower terminal 224c and the insulating substrate 21, so that the lower terminal 224c is formed. The side surface 21a portion of the second terminal 225 and the side surface 21b portion of the second terminal 225 are formed so as to have the same area (the portion indicated by hatching in FIGS. 1A and 1B).

  The lower terminal 224c extending from the side surface 21a is formed to have a height H from the lower end of the insulating substrate 21 at the back surface portion, and at the back surface portion of the lower terminal 224c extending from the side surface 21b portion. Also, the height H is formed from the lower end of the insulating substrate 21.

  The third terminal 226 includes a wiring portion 226a extending from the front surface to the center of the back surface, and a connection portion 226b formed in a substantially rectangular shape at the center portion.

  The resin package 4 is formed of a light transmissive resin and is formed so as to cover the entire mounting surface of the printed wiring board 2.

  The light emitting device 1 is manufactured as follows. First, a collective substrate on which wiring patterns 22 are continuously formed in a row is prepared. The light emitting elements 3 and 3 are mounted on the mounting portion 221 of the wiring pattern 22, and the wire 5 is connected from the light emitting elements 3 and 3 to the wire bonding portions 222 and 223, respectively. And after forming the resin package 4, the light-emitting device 1 is obtained by dicing the collective board | substrate at the division | segmentation location and dividing it into pieces. Accordingly, the first and second terminals 224, 225 and 226 are formed by dicing the wiring pattern 22 continuously formed on the collective substrate and dividing the wiring pattern 22 with the other adjacent light emitting devices 1. Is done. Further, when the light emitting device 1 is mounted on a mounting substrate or the like, the light emitting device 1 is mounted toward the mounting substrate side with a cut surface obtained by cutting the collective substrate as a mounting surface.

  The usage state of the light emitting device according to the embodiment of the present invention configured as described above will be described with reference to FIG. FIG. 3 is a diagram illustrating a usage state of the light emitting device illustrated in FIG. 1.

  As shown in FIG. 3, in the present embodiment, a case where the light emitting device 1 is mounted on the mounting substrate 10 will be described.

  The mounting substrate 10 is provided with connection terminals 12a to 12c on an insulating substrate 11 such as glass epoxy resin. The connection terminal 12a is a pattern that is conductively connected to the lower terminal 224c of the first terminal 224 that is the lowest terminal located on the side surface 21a side. The connection terminal 12b is a pattern that is conductively connected to the second terminal 225 that is the lowest terminal provided on the other side surface 21b side. The connection terminal 12 c is a pattern that is conductively connected to the connection portion 226 b of the third terminal 226.

  When mounting the light emitting device 1 on the mounting substrate 10, first, an appropriate amount of cream solder is applied to the connection terminals 12a to 12c. Next, the light emitting device 1 is placed with the position of each terminal aligned with each of the connection terminals 12a to 12c. And the mounting board | substrate 10 in the state which mounted the light-emitting device 1 is put into a reflow furnace, and heat processing is performed. By performing the heat treatment, the cream solder is melted to form a solder fillet and spreads like a mountain skirt to the lower terminal 224c, the second terminal 225, and the connection portion 226b.

  Since the lower terminal 224c and the second terminal 225 have the same area on the side surfaces 21a and 21b and are formed at the same height from the lower end, the solder attached to the lower terminal 224c and the second terminal 225 The fillet is restricted in height and spreads in the horizontal direction, so that the same amount of solder is attached. Therefore, since the stress pulled by the solder fillet is the same in the direction toward the one side surface 21a and the direction toward the other side surface 21b, the light emitting device 1 is pulled in either direction, and the lower terminal 224c. It is possible to prevent a bias from occurring in the amount of solder fillet that adheres to the side surface 21a portion of the second terminal 225 and the side surface 21b portion of the second terminal 225.

  In addition, since the lower terminal 224c and the second terminal 225 extend at the same height in the back surface portion, the amount of solder attached to the back surface portion of the lower terminal 224c and the back surface portion of the second terminal 225, respectively. Can be even. Therefore, the stress acting on the lower terminal 224c and the second terminal 225 can be equalized also in the rear surface direction.

  In this way, the stress pulled by the solder fillet is prevented from being biased between the one side surface 21a side and the other side surface 21b side, so that wetting failure of the solder can be prevented. can do.

  In addition, since the light emitting device 1 can be prevented from being laterally displaced or moved in the direction of rotation on the mounting substrate 10, the optical axis can be prevented from being displaced.

  In the present embodiment, two light emitting elements 3 and 3 (see FIG. 2) are mounted on the printed wiring board 2 and a common cathode is used so that one terminal is provided on one side 21a and the other side 21b. 3 is a surface-mount type semiconductor device provided with two or more odd terminals on one side and the other side, respectively. The invention can be applied.

  According to the present invention, since high connection reliability is obtained by preventing connection failure, an insulating substrate on which a semiconductor element is mounted on a mounting surface, and a total of three or more odd numbers provided on both side surfaces of the insulating substrate. It is suitable for a surface mount type semiconductor device provided with a terminal.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the light-emitting device which concerns on embodiment of this invention, (A) is the perspective view seen from one side surface side, (B) is the perspective view seen from the other side surface side. FIG. 1 is a plan view of the light emitting device shown in FIG. The figure which shows the use condition of the light-emitting device shown in FIG. A perspective view showing a conventional light emitting device

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light emitting device 2 Printed wiring board 3 Light emitting element 4 Resin package 5 Wire 10 Mounting board 11 Insulating board 12a, 12b, 12c Connection terminal 21 Insulating board 21a, 21b Side surface 22 Wiring pattern 23 Resist film 221 Mounting part 222, 223 Wire bonding part 224 1st terminal (Anode terminal)
224a Cavity 224b Upper terminal 224c Lower terminal 224d Connection part 225 Second terminal (anode terminal)
226 Third terminal (cathode terminal)
226a Wiring part 226b Connection part

Claims (3)

A semiconductor element, an insulating substrate on which the semiconductor element is mounted, and a total of three or more odd terminals provided on both side surfaces of the insulating substrate;
Of the three or more odd-numbered terminals, the two lowest-most terminals provided on the both side surfaces are formed in the same area. The surface-mount type semiconductor device according to claim 1, wherein the two lowermost terminals are formed at the same height. 3. The surface-mount type semiconductor device according to claim 1, wherein the two lowermost terminals extend from the lower end of the insulating substrate to the back surface opposite to the mounting surface at the same height.

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