CN101471415A - Semiconductor light-emitting device - Google Patents
Semiconductor light-emitting device Download PDFInfo
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- CN101471415A CN101471415A CNA2008101850489A CN200810185048A CN101471415A CN 101471415 A CN101471415 A CN 101471415A CN A2008101850489 A CNA2008101850489 A CN A2008101850489A CN 200810185048 A CN200810185048 A CN 200810185048A CN 101471415 A CN101471415 A CN 101471415A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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Abstract
The present invention provides a semiconductor light emitter, specifically, the invention provides a side-view type LED lamp which has strong soldering strength to the soldering welding of installed circuit substrate, welding strength increase that can widely adaptive for the bigger dimension and lower dimension and can be manufactured with low cost. An electrode part (4d) and an electrode part (5d) are installed on the substrate (2) for installing the LED component of side-view type LED lamp (1). The electrode part (4d) and the electrode part (5d) extends into an insulation substrate (6) from the electrode (4) and the electrode (5) installed at two ends of insulation substrate (6) in the directions opposing with each other. When the side-view type LED lamp (1) is installed on the circuit substrate (7), the end plane (4e) of electrode part (4d) and the end plane (5e) of electrode part (5d) help to increase the welding strength of soldering welding.
Description
Technical field
The present invention relates to semiconductor light-emitting apparatus, in detail, relate to the semiconductor light-emitting apparatus that under circuit substrate installment state rayed direction is roughly parallel to this real estate.
Background technology
Be roughly parallel to the semiconductor light-emitting apparatus (looking type LED light fixture) of this real estate as rayed direction under the circuit substrate installment state, the semiconductor light-emitting apparatus of the structure of Fig. 8～shown in Figure 10 is arranged hereinafter referred to as the limit.Fig. 8 looks type LED light fixture (being designated hereinafter simply as the LED light fixture) is observed this LED light fixture from this LED component side and circuit substrate installation side figure at the limit that 1 LED element is installed, Fig. 9 is that Figure 10 is the figure that observes this LED light fixture from the opposition side and the circuit substrate installation side of this LED element at the LED light fixture that 2 LED elements are installed from the figure of the LED light fixture of the opposition side of LED element and circuit substrate installation side observation Fig. 8.
As Fig. 8 and shown in Figure 9, LED light fixture 50 mainly is made of LED element mounting substrate 51, LED element 52 and sealing resin 53, is to use 53 pairs of sealing resins with light transmission to be installed in LED element 52 on the LED element mounting substrate 51 and carries out LED light fixture after resin-sealed.
Specifically, LED element mounting substrate 51 is formed with the 55a of pair of electrodes portion, 56a on a face of insulated substrate 54, on another face, be formed with the 55b of pair of electrodes portion, 56b, connect via electrode part 55c, 56c on the opposed end face that is formed on insulated substrate 54 respectively between opposed electrode part 55a, 55b and electrode part 56a, the 56b across insulated substrate 54.
Then, on electrode part 56a, place LED element 52 and realize the lower electrode of LED element 52 and conducting of electrode part 56a via conductive component (not illustrating), and use closing line 57 that the upper electrode of LED element 52 is connected with electrode part 55a and realize conducting, use 53 pairs of LED elements 52 of sealing resin and closing line 57 to carry out resin-sealed with light transmission.
At this moment, end face 58a, 58b that the end face with being formed with described electrode part 55c, 56c of LED element mounting substrate 51 is different are the sections when a plurality of from the installation of finishing LED element 52 and after using sealing resin 53 resin-sealed are taken into substrate (getting the り substrate) monolithic and change into each LED light fixture.
Therefore, end face 56d, the 56e of end face 55d, the 55e of the electrode 55 that is made of electrode part 55a, 55b, 55c and the electrode 56 that is made of electrode part 56a, 56b, 56c is because the section of electrode 55 and electrode 56 still exposes separately, thereby the soakage of solder is bad when solder is welded.Therefore, carry out producing following problem under the situation of solder welding above-mentioned limit being looked type LED light fixture and circuit substrate.
The solder of 50 pairs of circuit substrates of LED light fixture welding is only to use solder leg welding by 3 electrodes that constitute 55 of electrode part 55a, 55b, 55c with by 3 electrodes that constitute 56 of electrode part 56a, 56b, 56c the LED element mounting substrate 51 of the electrode pad of circuit substrate and the LED light fixture 50 that is approximately perpendicular to circuit substrate.Therefore, has the weak shortcoming of weld strength.
And, under the situation of the LED light fixture 50 that 2 LED elements are installed, as shown in figure 10, be necessary between electrode 55 and electrode 56, to be provided with by 1 another electrode 59 that constitutes.So in the solder welding of 50 pairs of circuit substrates of LED light fixture, the solder bonding area of electrode 59 is littler than electrode 55,56, thereby weld strength is also more weak than electrode 55,56.
Then, along with the mounted LEDs number of elements increases, number of electrodes also increases, and the area of per 1 electrode reduces, and the solder weld strength is more weak.
And, as mentioned above, end face 55d, the 55e of the electrode 55 of LED element mounting substrate 51 and end face 56d, the 56e of electrode 56 are because the soakage of solder is bad, thereby the weld strength of solder welding is stable bad, and area is also little, thereby can not go far towards the raising of weld strength.
And along with the miniaturization of LED light fixture 50, the area of electrode is more and more littler, has the small quantization of following the solder coating weight and the more weak tendency of weld strength.
Therefore, following scheme has been proposed, that is: by with electrode 55,56 together on end face 56d, the 56e of end face 55d, the 55e of electrode 55 and electrode 56 with electrode 55, the 56 the same 3-tier architectures that copper plate/nickel coating/Gold plated Layer is set, realize the raising (for example, with reference to patent documentation 1) of the weld strength of solder welding.
8-No. 242019 communiques of [patent documentation 1] Japanese kokai publication hei
But, actual conditions are, the method that Gold plated Layer is set on end face 56d, the 56e of end face 55d, the 55e of electrode 55 and electrode 56 of above-mentioned proposition, when being installed in LED light fixture 50 on the circuit substrate to this Gold plated Layer part most do not implement solder, almost can not expect the raising effect of weld strength.
Summary of the invention
Therefore, the present invention finishes just in view of the above problems, the purpose of this invention is to provide strong and enhancing weld strength of a kind of weld strength of the solder welding to circuit substrate and can tackle the LED light fixture of far-ranging size from the large-size to the miniature dimensions and can look type LED light fixture with the limit of low cost manufacturing.
In order to solve above-mentioned problem, the invention of invention 1 record of the present invention is a kind of semiconductor light-emitting apparatus, it is used as light source with semiconductor light-emitting elements, the rayed direction is roughly parallel to this circuit substrate face under the circuit substrate installment state, it is characterized in that, described semiconductor light-emitting apparatus is formed with a plurality of conductor layers that are connected with another face from a face of the insulated substrate end face by described insulated substrate, a plurality of at least in the described conductor layer have a conductor layer that extends to described insulated substrate from the described conductor layer that is arranged in described end face side, and the face that exposes from described insulated substrate of the conductor layer in extending to described insulated substrate is provided with the electrodeposited coating that is made of conductive component that is used to improve the solder soakage, when being installed in described semiconductor light-emitting apparatus on the described circuit substrate, between described electrodeposited coating and described circuit substrate, carry out the solder welding.
And the invention of invention of the present invention 2 records is characterized in that, in invention 1, extends to the centre position that conductor layer in the described insulated substrate is formed on the conductor layer on two faces that are positioned at the described insulated substrate that this conductor layer connects.
And, the invention of invention 3 records of the present invention is a kind of semiconductor light-emitting apparatus, it is used as light source with semiconductor light-emitting elements, the rayed direction is roughly parallel to this circuit substrate face under the circuit substrate installment state, it is characterized in that, described semiconductor light-emitting apparatus is formed with a plurality of conductor layers that are connected with another face from a face of the insulated substrate end face by described insulated substrate, described insulated substrate is formed with the through slot from the face side that is provided with described conductor layer of this insulated substrate to another face side, on the inner peripheral surface of described through slot, be provided with the electrodeposited coating that constitutes by conductive component, when being installed in described semiconductor light-emitting apparatus on the described circuit substrate, between described electrodeposited coating and described circuit substrate, carry out the solder welding.
And, the invention of invention 4 records of the present invention is a kind of semiconductor light-emitting apparatus, it is used as light source with semiconductor light-emitting elements, the rayed direction is roughly parallel to this circuit substrate face under the circuit substrate installment state, it is characterized in that, described semiconductor light-emitting apparatus is formed with a plurality of conductor layers that are connected with another face from a face of the insulated substrate end face by described insulated substrate, described insulated substrate is formed with the through slot from the face side that is provided with described conductor layer of this insulated substrate to another face side, on the inner peripheral surface of described through slot, be provided with the electrodeposited coating that constitutes by conductive component, and the filled conductive parts implement to fill out groove in described through slot, when being installed in described semiconductor light-emitting apparatus on the described circuit substrate, described electrodeposited coating and described circuit substrate carry out the solder welding via the described channel parts of filling out.
And, the invention of invention 5 records of the present invention is a kind of semiconductor light-emitting apparatus, it is used as light source with semiconductor light-emitting elements, the rayed direction is roughly parallel to this circuit substrate face under the circuit substrate installment state, it is characterized in that, described semiconductor light-emitting apparatus is formed with a plurality of conductor layers that are connected with another face from a face of the insulated substrate end face by described insulated substrate, described insulated substrate is formed with the non-through slot midway from the face side that is provided with described conductor layer of this insulated substrate to another face side, on the inner peripheral surface of described non-through slot, be provided with the electrodeposited coating that constitutes by conductive component, when being installed in described semiconductor light-emitting apparatus on the described circuit substrate, between described electrodeposited coating and described circuit substrate, carry out the solder welding.
And, the invention of invention 6 records of the present invention is a kind of semiconductor light-emitting apparatus, it is used as light source with semiconductor light-emitting elements, the rayed direction is roughly parallel to this circuit substrate face under the circuit substrate installment state, it is characterized in that, described semiconductor light-emitting apparatus is formed with a plurality of conductor layers that are connected with another face from a face of the insulated substrate end face by described insulated substrate, described insulated substrate is formed with the non-through slot midway from the face side that is provided with described conductor layer of this insulated substrate to another face side, on the inner peripheral surface of described non-through slot, be provided with the electrodeposited coating that constitutes by conductive component, and the filled conductive parts implement to fill out groove in described non-through slot, when being installed in described semiconductor light-emitting apparatus on the described circuit substrate, described electrodeposited coating and described circuit substrate carry out the solder welding via the described channel parts of filling out.
Semiconductor light-emitting apparatus of the present invention is formed with a plurality of conductor layers that are connected with another face from a face of the insulated substrate end face by described insulated substrate, and be provided with from the end face side of conductor layer and extend to conductor layer the insulated substrate, the face that exposes from insulated substrate of the conductor layer in extending to insulated substrate is provided with the electrodeposited coating that is made of conductive component.
Perhaps, semiconductor light-emitting apparatus of the present invention is formed with a plurality of conductor layers that are connected with another face from a face of the insulated substrate end face by described insulated substrate, and be formed with a face side that is provided with conductor layer from insulated substrate to the through slot of another face side or non-through slot midway from a face side to another face side, on the inner peripheral surface of groove, be provided with the electrodeposited coating that constitutes by conductive component.
Then, when being installed in semiconductor light-emitting apparatus on the circuit substrate, between the electrodeposited coating of semiconductor light-emitting apparatus and circuit substrate, carry out the solder welding.
As a result, can realize that strong and enhancing weld strength of a kind of weld strength of the solder welding to circuit substrate can tackle the semiconductor light-emitting apparatus of far-ranging size from the large-size to the miniature dimensions and can look the N-type semiconductor N light-emitting device with the limit of low cost manufacturing.
Description of drawings
Fig. 1 is a skeleton diagram of observing embodiments of the invention 1 from the rightabout of LED element installation direction.
Fig. 2 is the skeleton diagram that the state on the circuit substrate that embodiments of the invention 1 are installed in is shown.
Fig. 3 is a skeleton diagram of observing embodiments of the invention 2 from the rightabout of LED element installation direction.
Fig. 4 is the skeleton diagram that the state on the circuit substrate that embodiments of the invention 2 are installed in is shown.
Fig. 5 is a skeleton diagram of observing embodiments of the invention 3 from the rightabout of LED element installation direction.
Fig. 6 is the skeleton diagram that the state on the circuit substrate that embodiments of the invention 3 are installed in is shown.
Fig. 7 is a skeleton diagram of observing embodiments of the invention 4 from the rightabout of LED element installation direction.
Fig. 8 is a skeleton diagram of observing conventional example from LED element installation direction.
Fig. 9 is a skeleton diagram of observing conventional example from the rightabout of LED element installation direction.
Figure 10 observes the skeleton diagram of another conventional example from the rightabout of LED element installation direction.
Label declaration
1: type (side view type) LED light fixture is looked on the limit; The 2:LED element mounting substrate; 3: sealing resin; 4: electrode; 4a, 4b, 4c, 4d: electrode part; 4e, 4f: end face; 5: electrode; 5a, 5b, 5c, 5d: electrode part; 5e, 5f: end face; 6: insulated substrate; 7: circuit substrate; 7a, 7b, 7c: electrode pad; 8a: solder leg; 8b: solder; 9: electrode; 9b, 9e: electrode part; 10: slot part; 10e: end face; 10g: inner peripheral surface; 11: slot part; 11e: end face; 11g: inner peripheral surface.
Embodiment
Below, describe preferred implementation of the present invention (same section is enclosed same numeral) in detail with reference to Fig. 1～Fig. 7.In addition, the execution mode of the following stated is owing to be preferred concrete example of the present invention, thereby additional preferred technically various qualifications arranged, and scope of the present invention just is not limited to these execution modes as long as be not particularly limited record of the present invention in the following description.
[embodiment 1]
Fig. 1 is the stereogram of embodiments of the invention 1, is opposition side and the observed figure of circuit substrate installation side from LED element one side is installed.The limit of present embodiment is looked type (side view type) LED light fixture (being designated hereinafter simply as the LED light fixture) 1 and mainly is made of LED element mounting substrate 2, LED element (not illustrating) and sealing resin 3, is to use 3 pairs of sealing resins with light transmission to be installed in LED element on the LED element mounting substrate 2 and carries out LED light fixture after resin-sealed.In addition, present embodiment is the embodiment that 1 LED element is installed.
Then, although do not illustrate, yet on an electrode 5 that is arranged in the pair of electrodes 4,5 on the LED element mounting substrate 2, place the LED element and realize the lower electrode of LED element and conducting of electrode 5 via conductive component, and use closing line that the upper electrode of LED element is connected with electrode 4 and realize conducting, use 3 pairs of LED elements of sealing resin and closing line carry out resin-sealed.
LED element mounting substrate 2 is formed with the 4a of pair of electrodes portion, 5a on a face of insulated substrate 6, on another face, be formed with the 4b of pair of electrodes portion, 5b, connect via electrode part 4c, 5c on the opposed end face that is formed on insulated substrate 6 respectively between opposed electrode part 4a, 4b and electrode part 5a, the 5b across insulated substrate 6.
Then, electrode part 4d and electrode part 5d extend to the insulated substrate 6 towards mutual opposed direction from the each side of electrode part 4c and electrode part 5c.At this moment, electrode part 4d is in the centre position of electrode part 4a and 4b, and electrode part 5d is in the centre position of electrode part 5a and 5b.
By more than, electrode part 4a, 4b, 4c, 4d interconnect and constitute electrode 4, electrode part 5a, 5b, 5c, 5d interconnect and constitute electrode 5.Electrode 5 is electrically connected with the lower electrode of LED element, and electrode 4 is electrically connected with the upper electrode of LED element.
At this moment, a pair of end face 5e, the 5f of a pair of end face 4e, the 4f of electrode 4 and electrode 5 all are the sections when a plurality of from the installation of finishing the LED element and after using sealing resin 3 resin-sealed are taken into the substrate monolithic and change into each LED light fixture 1.Therefore, when end face 5e, the 5f of end face 4e, the 4f of electrode 4 and electrode 5 did not implement end face and handle, the section of electrode 4 and electrode 5 still was in the state that exposes.
But, electrode 4 and electrode 5 constitute by the metallic film with conductivity, use Copper Foil usually mostly.Copper Foil generally uses the above Copper Foil of thickness 10 μ m, can reach the thickness with pre-preg material that becomes insulated substrate and the maximum same degree of bonding thin plate.When the thickness thickening, the possibility that produces the space increases.
Constitute the Copper Foil self of electrode 4 and electrode 5 because the soakage of solder is bad, thereby a little less than the weld strength of solder welding.Therefore, on Copper Foil, form nickel coating, and on this nickel coating, form Gold plated Layer or silver coating.Identical therewith, on end face 5e, the 5f of end face 4e, the 4f of electrode 4 and electrode 5, also form copper plate/nickel coating/Gold plated Layer or silver coating.
Thus, on whole of the part of exposing from insulated substrate 6 of electrode 4 and electrode 5, the superiors become Gold plated Layer or silver coating, have guaranteed the soakage good state of solder.
Fig. 2 (use Fig. 1 A-A cross section) illustrates LED light fixture 1 with said structure by the state of solder welded and installed on circuit substrate.The circuit substrate 7 that LED light fixture 1 is installed on the face that LED light fixture 1 one sides are installed, when LED light fixture 1 is installed with the LED element mounting substrate 2 that is located at this LED light fixture 1 on the corresponding position of the electrode 4 and the each side of electrode 5 be provided with electrode pad 7a, 7b.
Then, LED light fixture 1 is placed to the rayed direction that makes this LED light fixture 1 and is roughly parallel to circuit substrate 7 on circuit substrate 7.At this moment, the electrode 4 of LED element mounting substrate 2 is positioned on the electrode pad 7a of circuit substrate 7, and the electrode 5 of LED element mounting substrate 2 is positioned on the electrode pad 7b of circuit substrate 7.
Electrode 4 carries out the solder welding with electrode pad 7a and electrode 5 respectively with electrode pad 7b, and the lower electrode of LED element is electrically connected with electrode pad 7b via electrode 5, and the upper electrode of LED element is electrically connected with electrode pad 7a via electrode 4.
The part at electrode pad 7a enforcement solder welding of electrode 4 is perpendicular to electrode part 4a, 4b, 4c and the level of the electrode pad 7a end face 4e in electrode pad 7a, wherein use solder leg 8a to weld at electrode part 4a, 4b, 4c, at end face 4e use and electrode pad 7a between solder 8b weld.
Equally, the part at electrode pad 7b enforcement solder welding of electrode 5 is perpendicular to electrode part 5a, 5b, 5c and the level of the electrode pad 7b end face 5e in electrode pad 7b, wherein use solder leg 8a to weld at electrode part 5a, 5b, 5c, at end face 5e use and electrode pad 7b between solder 8b weld.
In existing solder connects, the part at electrode pad 7a enforcement solder welding of electrode 4 is only to use the solder leg to weld at electrode part 4a, 4b, 4c perpendicular to electrode pad 7a, and the part at electrode pad 7b enforcement solder welding of electrode 5 is only to weld at electrode part 5a, 5b, 5c use solder leg perpendicular to electrode pad 7b.
Relative therewith, in LED light fixture of the present invention, except above-mentioned solder weld part, electrode 4,5 end face 4e, 5e separately also helps the solder welding.Particularly, constituting the electrode part 4d of electrode 4 and the electrode part 5d of formation electrode 5 is the electrode part that are not located in the existing LED light fixture, because end face 4e, the 5e of these newly-installed electrode part 4d, 5d relate to the solder welding, thereby can obtain than the more strong weld strength of existing LED light fixture at circuit substrate 7.
And, end face 4e, the 5e of electrode part 4d, 5d be owing to lay respectively at the electrode pad 7a of circuit substrate 7, the central portion of 7b, thereby go far towards the solder welding of the 4d of intensifier electrode portion and electrode pad 7a and the solder of electrode part 5d and electrode pad 7b is welded.
For the Copper Foil that forms electrode 4,5, the thicker weld strength that improves the solder welding of thickness, but, because end face 4e, the 5e of electrode part 4d, 5d lay respectively at the electrode pad 7a of circuit substrate 7, the central portion of 7b, even thereby the thin weld strength that also can obtain high solder welding of thickness.
[embodiment 2]
Fig. 3 is the stereogram of embodiments of the invention 2, is opposition side and the observed figure of circuit substrate installation side from LED element one side is installed.Present embodiment is the LED light fixture that 2 LED elements are installed.
Present embodiment is compared with the foregoing description 1, and electrode part 9b and electrode part 9d lay respectively between the electrode part 5c of the electrode part 4c of the electrode 4 on the LED element mounting substrate 2 that is formed on LED light fixture 1 and electrode 5 and between the electrode part 5d of the electrode part 4d of electrode 4 and electrode 5.In addition, electrode part 9b is connected in insulated substrate 6 with electrode part 9d and constitutes electrode 9.
Generally, electrode 9 uses the 3-tier architecture of copper foil layer/nickel coating/Gold plated Layer to constitute, and end face 9e, the 9f of the electrode part 9b of electrode 9 and end face 9e, the 9f of electrode part 9d all use the 3-tier architecture of copper plate/nickel coating/Gold plated Layer to constitute.
Fig. 4 (use Fig. 3 B-B cross section) illustrates LED light fixture 1 with present embodiment and is installed in state on the circuit substrate 7.In advance on the face that LED light fixture 1 one sides are installed of circuit substrate 7, when LED light fixture 1 is installed with the LED element mounting substrate 2 that is located at this LED light fixture 1 on the corresponding position of the electrode 4 and the each side of electrode 5 be provided with electrode pad 7a, 7b, and also be provided with electrode pad 7c in the position corresponding with electrode 9.
So, the same with electrode pad 7b with electrode 4 when being installed in LED light fixture 1 on the circuit substrate 7 with electrode pad 7a and electrode 5, electrode 9 is carried out the solder welding with electrode pad 7c.Specifically, electrode 9 use solder leg 8a (illustrate) and electrode pad 7c to weld perpendicular to the electrode part 9b of electrode pad 7c, at the end face 9e use that is parallel to electrode pad 7c and electrode pad 7a between solder 8b weld.
As a result, the weld strength of the solder of 1 pair of circuit substrate 7 of LED light fixture welding is stronger than the foregoing description 1.In addition, the electrode structure of the LED light fixture of present embodiment constitutes by 3 layers, and this is identical with embodiment 1.
[embodiment 3]
Fig. 5 is the stereogram of embodiments of the invention 3, is opposition side and the observed figure of circuit substrate installation side from LED element one side is installed.
Present embodiment is compared with the foregoing description 1, and near the end face 4e side the electrode part 4c that is formed at the electrode 4 on the LED element mounting substrate 2 of LED light fixture 1 is formed with the circular-arc or elliptoid slot part 10 in cross section of 4a of through electrode portion and electrode part 4b.
Equally, near the end face 5e side the electrode part 5c that is formed at the electrode 5 on the LED element mounting substrate 2 of LED light fixture 1 is formed with the circular-arc or elliptoid slot part 11 in cross section of 5a of through electrode portion and electrode part 5b.
Fig. 6 (use Fig. 5 C-C cross section) illustrates LED light fixture 1 with present embodiment and is installed in state on the circuit substrate 7.The inner peripheral surface 10g of the electrodeposited coating that is formed with 3-tier architecture of slot part 10 and end face 10e are when being installed in LED light fixture 1 on the circuit substrate 7, carry out the solder welding with the electrode pad 7a of circuit substrate 7, the inner peripheral surface 11g of slot part 11 and end face 11e carry out the solder welding with the electrode pad 7b of circuit substrate 7 when being installed in LED light fixture 1 on the circuit substrate 7.
The weld strength of the solder welding when as a result, being formed on slot part 10 on the LED element mounting substrate 2 and slot part 11 and helping to strengthen LED light fixture 1 and be installed on the circuit substrate 7.
In addition, slot part 10 and slot part 11 form with the identical shaped same size in cross section, so that the weld strength equilibrium of solder welding.And slot part 10 and slot part 11 are formed on the identical faces side of insulated substrate 6 at least from being installed on viewpoint on the circuit substrate 7.
Meanwhile, owing to must avoid slot part 10,11 sealing resin 3 is set, thereby has the structure of the LED light fixture that can tackle large-size.
[embodiment 4]
Fig. 7 is the stereogram of embodiments of the invention 4, is opposition side and the observed figure of circuit substrate installation side from LED element one side is installed.Present embodiment is compared with the foregoing description 3, and difference is to have to be formed on the structure that sealing resin 3 one sides are stopped up that is provided with of slot part 10,11 on the LED element mounting substrate 2 of LED light fixture 1.Identical with embodiment 3 in addition, thereby omit explanation.
In the present embodiment, slot part 10,11 can stop up through slot and formation easily by laser processing or with Copper Foil or insulating element.Therefore, the cost of LED element mounting substrate 2 is significantly risen.
Meanwhile, owing to sealing resin 3 can be arranged on the blocking portion of slot part 10,11, thereby can realize the miniaturization of LED light fixture, size was to the structure of undersized LED light fixture during formation can be tackled.Owing to making a plurality of numbers that are taken into that are taken into substrate, the miniaturization of LED light fixture increases.The advantage that also has the manufacturing cost reduction of per 1 LED light fixture.
In addition, about embodiment 3 and embodiment 4, electroconductive component can also be filled in the slot part 10 and in the slot part 11.And, can also tackle the LED light fixture that a plurality of LED elements are installed.And, can also adopt the structure behind the textural association with embodiment 1 and embodiment 2.
As above detailed description, according to the present invention, can realize that a kind of and existing LED light fixture of the same type compares the manufacturing process with difficulty and make the limit of the structure that the bonding area to the solder welding of the circuit substrate installed increases look type LED light fixture.
As a result, can realize a kind of LED of making light fixture to the weld strength of the solder of circuit substrate welding strong and enhancing energy range weld strength tackle large-size widely to miniature dimensions and can look type LED light fixture with the limit of low cost manufacturing.
Claims (6)
1. semiconductor light-emitting apparatus, it is used as light source with semiconductor light-emitting elements, the rayed direction is roughly parallel to this circuit substrate face under the circuit substrate installment state, it is characterized in that, described semiconductor light-emitting apparatus is formed with a plurality of conductor layers that are connected with another face from a face of the insulated substrate end face by described insulated substrate, a plurality of at least in the described conductor layer have a conductor layer that extends to described insulated substrate from the described conductor layer that is arranged in described end face side, and the face that exposes from described insulated substrate of the conductor layer in extending to described insulated substrate is provided with the electrodeposited coating that is made of conductive component that is used to improve the solder soakage, when being installed in described semiconductor light-emitting apparatus on the described circuit substrate, between described electrodeposited coating and described circuit substrate, carry out the solder welding.
2. semiconductor light-emitting apparatus according to claim 1 is characterized in that, extends to the centre position that conductor layer in the described insulated substrate is formed on the conductor layer on two faces that are positioned at the described insulated substrate that this conductor layer connects.
3. semiconductor light-emitting apparatus, it is used as light source with semiconductor light-emitting elements, the rayed direction is roughly parallel to this circuit substrate face under the circuit substrate installment state, it is characterized in that, described semiconductor light-emitting apparatus is formed with a plurality of conductor layers that are connected with another face from a face of the insulated substrate end face by described insulated substrate, described insulated substrate is formed with the through slot from the face side that is provided with described conductor layer of this insulated substrate to another face side, on the inner peripheral surface of described through slot, be provided with the electrodeposited coating that constitutes by conductive component, when being installed in described semiconductor light-emitting apparatus on the described circuit substrate, between described electrodeposited coating and described circuit substrate, carry out the solder welding.
4. semiconductor light-emitting apparatus, it is used as light source with semiconductor light-emitting elements, the rayed direction is roughly parallel to this circuit substrate face under the circuit substrate installment state, it is characterized in that, described semiconductor light-emitting apparatus is formed with a plurality of conductor layers that are connected with another face from a face of the insulated substrate end face by described insulated substrate, described insulated substrate is formed with the through slot from the face side that is provided with described conductor layer of this insulated substrate to another face side, on the inner peripheral surface of described through slot, be provided with the electrodeposited coating that constitutes by conductive component, and the filled conductive parts implement to fill out groove in described through slot, when being installed in described semiconductor light-emitting apparatus on the described circuit substrate, described electrodeposited coating and described circuit substrate carry out the solder welding via the described channel parts of filling out.
5. semiconductor light-emitting apparatus, it is used as light source with semiconductor light-emitting elements, the rayed direction is roughly parallel to this circuit substrate face under the circuit substrate installment state, it is characterized in that, described semiconductor light-emitting apparatus is formed with a plurality of conductor layers that are connected with another face from a face of the insulated substrate end face by described insulated substrate, described insulated substrate is formed with the non-through slot midway from the face side that is provided with described conductor layer of this insulated substrate to another face side, on the inner peripheral surface of described non-through slot, be provided with the electrodeposited coating that constitutes by conductive component, when being installed in described semiconductor light-emitting apparatus on the described circuit substrate, between described electrodeposited coating and described circuit substrate, carry out the solder welding.
6. semiconductor light-emitting apparatus, it is used as light source with semiconductor light-emitting elements, the rayed direction is roughly parallel to this circuit substrate face under the circuit substrate installment state, it is characterized in that, described semiconductor light-emitting apparatus is formed with a plurality of conductor layers that are connected with another face from a face of the insulated substrate end face by described insulated substrate, described insulated substrate is formed with the non-through slot midway from the face side that is provided with described conductor layer of this insulated substrate to another face side, on the inner peripheral surface of described non-through slot, be provided with the electrodeposited coating that constitutes by conductive component, and the filled conductive parts implement to fill out groove in described non-through slot, when being installed in described semiconductor light-emitting apparatus on the described circuit substrate, described electrodeposited coating and described circuit substrate carry out the solder welding via the described channel parts of filling out.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-339330 | 2007-12-28 | ||
| JP2007339330 | 2007-12-28 | ||
| JP2007339330A JP2009164176A (en) | 2007-12-28 | 2007-12-28 | Semiconductor light-emitting apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101471415A true CN101471415A (en) | 2009-07-01 |
| CN101471415B CN101471415B (en) | 2013-09-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810185048 Expired - Fee Related CN101471415B (en) | 2007-12-28 | 2008-12-26 | Semiconductor light-emitting device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2009164176A (en) |
| KR (1) | KR20090072969A (en) |
| CN (1) | CN101471415B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6219586B2 (en) * | 2012-05-09 | 2017-10-25 | ローム株式会社 | Semiconductor light emitting device |
| KR101974354B1 (en) | 2013-02-14 | 2019-05-02 | 삼성전자주식회사 | Light emitting device package and method of manufacturing the same |
| JP2017076809A (en) * | 2016-12-05 | 2017-04-20 | 大日本印刷株式会社 | Lead frame with resin, semiconductor device, and lighting device |
| CN116031350A (en) | 2017-04-28 | 2023-04-28 | 日亚化学工业株式会社 | Light emitting device |
| KR101971436B1 (en) * | 2017-12-22 | 2019-04-23 | 주식회사 에이유이 | COB type LED package capable of top view and side view mounting and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08242019A (en) * | 1995-03-06 | 1996-09-17 | Shichizun Denshi:Kk | Chip type light emitting diode |
| JPH10242526A (en) * | 1997-02-21 | 1998-09-11 | Citizen Electron Co Ltd | Surface mount type light emitting diode and its manufacture |
| JP2001111116A (en) * | 1999-10-13 | 2001-04-20 | Rohm Co Ltd | Chip type semiconductor light emitting device |
| JP2003188424A (en) * | 2001-12-18 | 2003-07-04 | Sharp Corp | Surface-mounted light-emitting diode |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000036621A (en) * | 1998-07-16 | 2000-02-02 | Shichizun Denshi:Kk | Electrode structure of side-surface electronic component |
| CN1377045A (en) * | 2001-03-27 | 2002-10-30 | 佳邦科技股份有限公司 | Surface adhered end electrode for over-current protecting element and its preparing process |
-
2007
- 2007-12-28 JP JP2007339330A patent/JP2009164176A/en active Pending
-
2008
- 2008-12-18 KR KR20080129294A patent/KR20090072969A/en not_active Application Discontinuation
- 2008-12-26 CN CN 200810185048 patent/CN101471415B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08242019A (en) * | 1995-03-06 | 1996-09-17 | Shichizun Denshi:Kk | Chip type light emitting diode |
| JPH10242526A (en) * | 1997-02-21 | 1998-09-11 | Citizen Electron Co Ltd | Surface mount type light emitting diode and its manufacture |
| JP2001111116A (en) * | 1999-10-13 | 2001-04-20 | Rohm Co Ltd | Chip type semiconductor light emitting device |
| JP2003188424A (en) * | 2001-12-18 | 2003-07-04 | Sharp Corp | Surface-mounted light-emitting diode |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101471415B (en) | 2013-09-11 |
| JP2009164176A (en) | 2009-07-23 |
| KR20090072969A (en) | 2009-07-02 |
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