CN101460397B - 单过硫酸氢钾溶液 - Google Patents

单过硫酸氢钾溶液 Download PDF

Info

Publication number
CN101460397B
CN101460397B CN200780020437XA CN200780020437A CN101460397B CN 101460397 B CN101460397 B CN 101460397B CN 200780020437X A CN200780020437X A CN 200780020437XA CN 200780020437 A CN200780020437 A CN 200780020437A CN 101460397 B CN101460397 B CN 101460397B
Authority
CN
China
Prior art keywords
solution
khso
active oxygen
potassium monopersulfate
potassium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200780020437XA
Other languages
English (en)
Chinese (zh)
Other versions
CN101460397A (zh
Inventor
R·J·杜兰特
H·J·小博恩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of CN101460397A publication Critical patent/CN101460397A/zh
Application granted granted Critical
Publication of CN101460397B publication Critical patent/CN101460397B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B15/00—Peroxides; Peroxyhydrates; Peroxyacids or salts thereof; Superoxides; Ozonides
    • C01B15/055—Peroxyhydrates; Peroxyacids or salts thereof
    • C01B15/06—Peroxyhydrates; Peroxyacids or salts thereof containing sulfur
    • C01B15/08—Peroxysulfates
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B15/00—Peroxides; Peroxyhydrates; Peroxyacids or salts thereof; Superoxides; Ozonides
    • C01B15/055—Peroxyhydrates; Peroxyacids or salts thereof
    • C01B15/06—Peroxyhydrates; Peroxyacids or salts thereof containing sulfur
    • C01B15/08—Peroxysulfates
    • C01B15/085—Stabilisation of the solid compounds, subsequent to the preparation or to the crystallisation, by additives or by coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • C23F3/06—Heavy metals with acidic solutions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Detergent Compositions (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Treatment Of Water By Oxidation Or Reduction (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Weting (AREA)
CN200780020437XA 2006-06-02 2007-06-01 单过硫酸氢钾溶液 Active CN101460397B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/445,610 2006-06-02
US11/445,610 US7442323B2 (en) 2006-06-02 2006-06-02 Potassium monopersulfate solutions
PCT/US2007/012995 WO2007143127A1 (en) 2006-06-02 2007-06-01 Potassium monopersulfate solutions

Publications (2)

Publication Number Publication Date
CN101460397A CN101460397A (zh) 2009-06-17
CN101460397B true CN101460397B (zh) 2011-07-06

Family

ID=38566311

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200780020437XA Active CN101460397B (zh) 2006-06-02 2007-06-01 单过硫酸氢钾溶液

Country Status (10)

Country Link
US (2) US7442323B2 (enExample)
EP (1) EP2024281B1 (enExample)
JP (1) JP5292285B2 (enExample)
KR (1) KR101397363B1 (enExample)
CN (1) CN101460397B (enExample)
CA (1) CA2652151C (enExample)
DE (1) DE602007008400D1 (enExample)
MY (2) MY142427A (enExample)
TW (1) TWI349648B (enExample)
WO (1) WO2007143127A1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100239678A1 (en) * 2006-07-18 2010-09-23 Ali Razavi Ionically functionalized nanodiamonds
WO2009026324A2 (en) 2007-08-20 2009-02-26 Advanced Technology Materials, Inc. Composition and method for removing ion-implanted photoresist
KR20100133507A (ko) * 2008-05-01 2010-12-21 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 고밀도 주입된 레지스트의 제거를 위한 저 ｐｈ 혼합물
TWI480360B (zh) 2009-04-03 2015-04-11 Du Pont 蝕刻劑組成物及方法
JP5340071B2 (ja) * 2009-08-03 2013-11-13 株式会社Ａｄｅｋａ 安定剤を含むペルオキシ一硫酸水溶液の製造方法
US10383894B2 (en) * 2010-03-17 2019-08-20 Lutran Industries, Inc. Human medicinal treatment using salt of peroxymonosulfuric acid
US20120074014A1 (en) * 2010-09-27 2012-03-29 Lutran Industries, Inc. Product typically based on salt of peroxymonosulfuric acid and suitable for medicinal usage, and associated product fabrication
MX2012010730A (es) * 2010-03-18 2012-12-17 Dow Global Technologies Llc Proceso para preparar dioxidos de divinilareno.
CN102296293B (zh) * 2011-06-24 2015-01-07 李沛泓 印刷线路板微蚀刻剂
JP5885971B2 (ja) * 2011-09-08 2016-03-16 関東化學株式会社 銅および銅合金のエッチング液
US20150104938A1 (en) * 2013-10-16 2015-04-16 United Microelectronics Corporation Method for forming damascene opening and applications thereof
JP2016104474A (ja) * 2014-08-22 2016-06-09 有限会社情報科学研究所 共鳴発泡と真空キャビテーションによるウルトラファインバブル製造方法及びウルトラファインバブル水製造装置。
PL3218317T3 (pl) 2014-11-13 2019-03-29 Gerresheimer Glas Gmbh Filtr cząstek urządzenia do wytwarzania szkła, jednostka tłoka, głowica dmuchu, wspornik głowicy dmuchu i urządzenie do wytwarzania szkła, przystosowane lub zawierające filtr
CN108950558A (zh) * 2018-08-27 2018-12-07 深圳市星扬高新科技有限公司 一种铜制件表面粗化剂
CN110172349B (zh) * 2019-05-08 2020-11-20 厦门大学 一种氮化镓半导体光电化学刻蚀液及加工方法
FR3102008B1 (fr) * 2019-10-10 2021-09-24 Commissariat Energie Atomique Procede de recyclage des batteries li-ion
CN111039309A (zh) * 2019-12-31 2020-04-21 中船重工（邯郸）派瑞特种气体有限公司 一种分离硫酸氢钾和硫酸钾混合物的装置及方法
CN111662641B (zh) * 2020-06-30 2021-10-26 中国科学院上海微系统与信息技术研究所 一种高选择比的化学机械抛光液及其应用
KR102581261B1 (ko) * 2021-03-04 2023-09-21 우석대학교 산학협력단 습윤 옥손을 이용한 비시날 트라이카보닐 화합물의 제조방법
CN115124204A (zh) * 2022-06-16 2022-09-30 安徽省交通航务工程有限公司 一种实现疏浚泥浆快速泥水分离的处理方法
CN116235863A (zh) * 2023-01-04 2023-06-09 四川省畜牧科学研究院 一种耐分解的消毒剂

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0502703A1 (en) * 1991-03-06 1992-09-09 E.I. Du Pont De Nemours And Company New class of stable potassium monopersulfate compositions
US20040197261A1 (en) * 2003-03-31 2004-10-07 Tufano Thomas Peter Potassium hydrogen peroxymonosulfate solutions
US20050062017A1 (en) * 2003-09-23 2005-03-24 Martin Perry L. Potassium monopersulfate triple salt with increased active oxygen content and substantially no K2S2O8
CN1778669A (zh) * 2004-11-22 2006-05-31 上海嘉源实业有限公司 一种单过硫酸氢钾的制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3555147A (en) * 1967-12-19 1971-01-12 Fmc Corp Peroxydiphosphate neutralizer for hair waving
US3805809A (en) * 1972-10-02 1974-04-23 Procter & Gamble Hair setting process
EP0149329B1 (en) * 1983-12-30 1992-04-15 E.I. Du Pont De Nemours And Company Potassium monopersulfate compositions and process for preparing them
DE4014655A1 (de) * 1990-05-08 1991-11-14 Behringwerke Ag Peptidamide, verfahren zu deren herstellung und diese enthaltende mittel als fibrin/thrombin-gerinnungsinhibitoren
DE4020856A1 (de) * 1990-06-29 1992-01-09 Degussa Verfahren zur herstellung von lagerstabilen waessrigen natriumperoxomonosulfatloesungen
DE19503900C1 (de) 1995-02-07 1995-11-23 Degussa Verfahren zur Herstellung des Kaliumperoxomonosulfat-Tripelsalzes 2 KHSO¶5¶ . KHSO¶4¶ . K¶2¶SO¶4¶
JP4767401B2 (ja) * 2000-10-30 2011-09-07 ルネサスエレクトロニクス株式会社 半導体記憶装置及びその製造方法
US6974777B2 (en) * 2002-06-07 2005-12-13 Cabot Microelectronics Corporation CMP compositions for low-k dielectric materials
TW200417628A (en) * 2002-09-09 2004-09-16 Shipley Co Llc Improved cleaning composition
US20050063895A1 (en) * 2003-09-23 2005-03-24 Martin Perry L. Production of potassium monopersulfate triple salt using oleum
US20060013750A1 (en) * 2004-07-16 2006-01-19 Martin Perry L Solvent-activated reactor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0502703A1 (en) * 1991-03-06 1992-09-09 E.I. Du Pont De Nemours And Company New class of stable potassium monopersulfate compositions
US20040197261A1 (en) * 2003-03-31 2004-10-07 Tufano Thomas Peter Potassium hydrogen peroxymonosulfate solutions
US20050062017A1 (en) * 2003-09-23 2005-03-24 Martin Perry L. Potassium monopersulfate triple salt with increased active oxygen content and substantially no K2S2O8
CN1778669A (zh) * 2004-11-22 2006-05-31 上海嘉源实业有限公司 一种单过硫酸氢钾的制备方法

Also Published As

Publication number Publication date
JP2009539740A (ja) 2009-11-19
DE602007008400D1 (de) 2010-09-23
MY156749A (en) 2016-03-31
TWI349648B (en) 2011-10-01
KR20090016003A (ko) 2009-02-12
US8123970B2 (en) 2012-02-28
US20090008601A1 (en) 2009-01-08
MY142427A (en) 2010-11-30
US20070278182A1 (en) 2007-12-06
CA2652151C (en) 2015-08-04
JP5292285B2 (ja) 2013-09-18
US7442323B2 (en) 2008-10-28
EP2024281A1 (en) 2009-02-18
HK1133420A1 (en) 2010-03-26
EP2024281B1 (en) 2010-08-11
CN101460397A (zh) 2009-06-17
TW200804174A (en) 2008-01-16
CA2652151A1 (en) 2007-12-13
KR101397363B1 (ko) 2014-05-19
WO2007143127A1 (en) 2007-12-13

Similar Documents

Publication Publication Date Title
CN101460397B (zh) 单过硫酸氢钾溶液
CN1331736C (zh) 过一硫酸氢钾溶液
JP2819065B2 (ja) 二酸化塩素の製造方法
JP2009539740A5 (enExample)
RU2002100252A (ru) Химическая композиция и способ
KR101086931B1 (ko) 황산 산성 동전해액의 제조 방법 및 그 제조 방법을 이용하여 제조한 황산 산성 동전해액, 그리고 전해석출 동피막
TW418595B (en) Microetching and cleaning of printed wiring boards
US4698124A (en) Method of regenerating permanganate etch bath
JP2006522003A5 (enExample)
TW201538795A (zh) 在銅蝕刻溶液中藉由氧氣和/或空氣作為氧化劑進行銅之氧化
US4915776A (en) Process for etching copper with ammoniacal etchant solution and reconditioning the used etchant solution
EP0204399B1 (en) Method of regenerating permanganate etch bath
HK1133420B (en) Potassium monopersulfate solutions
HK1091191A (en) Potassium hydrogen peroxymonosulfate solutions
JPH10251876A (ja) エッチング液
JP3970589B2 (ja) 亜酸化銅を製造する方法
JP2005255447A (ja) 亜酸化銅粉末及びその製造方法
CN119710702A (zh) 铜钼金属蚀刻液及其制备方法和应用
JP2003165724A (ja) 亜酸化銅の製造方法
HK1141564B (en) A method for etching copper and recovery of the spent etching solution
HK1141564A1 (en) A method for etching copper and recovery of the spent etching solution
JP2009215639A (ja) 銅および銅合金用のエッチング液

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1133420

Country of ref document: HK

C14 Grant of patent or utility model
GR01 Patent grant
REG Reference to a national code

Ref country code: HK

Ref legal event code: GR

Ref document number: 1133420

Country of ref document: HK