MY142427A - Potassium monopersulfate solutions - Google Patents
Potassium monopersulfate solutionsInfo
- Publication number
- MY142427A MY142427A MYPI20070707A MYPI20070707A MY142427A MY 142427 A MY142427 A MY 142427A MY PI20070707 A MYPI20070707 A MY PI20070707A MY PI20070707 A MYPI20070707 A MY PI20070707A MY 142427 A MY142427 A MY 142427A
- Authority
- MY
- Malaysia
- Prior art keywords
- potassium monopersulfate
- monopersulfate solutions
- solutions
- potassium
- composition
- Prior art date
Links
- 239000012425 OXONE® Substances 0.000 title abstract 2
- HJKYXKSLRZKNSI-UHFFFAOYSA-I pentapotassium;hydrogen sulfate;oxido sulfate;sulfuric acid Chemical compound [K+].[K+].[K+].[K+].[K+].OS([O-])(=O)=O.[O-]S([O-])(=O)=O.OS(=O)(=O)O[O-].OS(=O)(=O)O[O-] HJKYXKSLRZKNSI-UHFFFAOYSA-I 0.000 title abstract 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000006386 neutralization reaction Methods 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B15/00—Peroxides; Peroxyhydrates; Peroxyacids or salts thereof; Superoxides; Ozonides
- C01B15/055—Peroxyhydrates; Peroxyacids or salts thereof
- C01B15/06—Peroxyhydrates; Peroxyacids or salts thereof containing sulfur
- C01B15/08—Peroxysulfates
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B15/00—Peroxides; Peroxyhydrates; Peroxyacids or salts thereof; Superoxides; Ozonides
- C01B15/055—Peroxyhydrates; Peroxyacids or salts thereof
- C01B15/06—Peroxyhydrates; Peroxyacids or salts thereof containing sulfur
- C01B15/08—Peroxysulfates
- C01B15/085—Stabilisation of the solid compounds, subsequent to the preparation or to the crystallisation, by additives or by coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
- C23F3/06—Heavy metals with acidic solutions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Detergent Compositions (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Agricultural Chemicals And Associated Chemicals (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Treatment Of Water By Oxidation Or Reduction (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/445,610 US7442323B2 (en) | 2006-06-02 | 2006-06-02 | Potassium monopersulfate solutions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY142427A true MY142427A (en) | 2010-11-30 |
Family
ID=38566311
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI20070707A MY142427A (en) | 2006-06-02 | 2007-05-08 | Potassium monopersulfate solutions |
| MYPI2010001723A MY156749A (en) | 2006-06-02 | 2007-05-08 | Potassium monopersulfate solutions |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2010001723A MY156749A (en) | 2006-06-02 | 2007-05-08 | Potassium monopersulfate solutions |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US7442323B2 (enExample) |
| EP (1) | EP2024281B1 (enExample) |
| JP (1) | JP5292285B2 (enExample) |
| KR (1) | KR101397363B1 (enExample) |
| CN (1) | CN101460397B (enExample) |
| CA (1) | CA2652151C (enExample) |
| DE (1) | DE602007008400D1 (enExample) |
| MY (2) | MY142427A (enExample) |
| TW (1) | TWI349648B (enExample) |
| WO (1) | WO2007143127A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102995021A (zh) * | 2011-09-08 | 2013-03-27 | 关东化学株式会社 | 铜及铜合金的蚀刻液组合物及蚀刻方法 |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100239678A1 (en) * | 2006-07-18 | 2010-09-23 | Ali Razavi | Ionically functionalized nanodiamonds |
| WO2009026324A2 (en) | 2007-08-20 | 2009-02-26 | Advanced Technology Materials, Inc. | Composition and method for removing ion-implanted photoresist |
| KR20100133507A (ko) * | 2008-05-01 | 2010-12-21 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | 고밀도 주입된 레지스트의 제거를 위한 저 ph 혼합물 |
| TWI480360B (zh) | 2009-04-03 | 2015-04-11 | Du Pont | 蝕刻劑組成物及方法 |
| JP5340071B2 (ja) * | 2009-08-03 | 2013-11-13 | 株式会社Adeka | 安定剤を含むペルオキシ一硫酸水溶液の製造方法 |
| US10383894B2 (en) * | 2010-03-17 | 2019-08-20 | Lutran Industries, Inc. | Human medicinal treatment using salt of peroxymonosulfuric acid |
| US20120074014A1 (en) * | 2010-09-27 | 2012-03-29 | Lutran Industries, Inc. | Product typically based on salt of peroxymonosulfuric acid and suitable for medicinal usage, and associated product fabrication |
| MX2012010730A (es) * | 2010-03-18 | 2012-12-17 | Dow Global Technologies Llc | Proceso para preparar dioxidos de divinilareno. |
| CN102296293B (zh) * | 2011-06-24 | 2015-01-07 | 李沛泓 | 印刷线路板微蚀刻剂 |
| US20150104938A1 (en) * | 2013-10-16 | 2015-04-16 | United Microelectronics Corporation | Method for forming damascene opening and applications thereof |
| JP2016104474A (ja) * | 2014-08-22 | 2016-06-09 | 有限会社情報科学研究所 | 共鳴発泡と真空キャビテーションによるウルトラファインバブル製造方法及びウルトラファインバブル水製造装置。 |
| PL3218317T3 (pl) | 2014-11-13 | 2019-03-29 | Gerresheimer Glas Gmbh | Filtr cząstek urządzenia do wytwarzania szkła, jednostka tłoka, głowica dmuchu, wspornik głowicy dmuchu i urządzenie do wytwarzania szkła, przystosowane lub zawierające filtr |
| CN108950558A (zh) * | 2018-08-27 | 2018-12-07 | 深圳市星扬高新科技有限公司 | 一种铜制件表面粗化剂 |
| CN110172349B (zh) * | 2019-05-08 | 2020-11-20 | 厦门大学 | 一种氮化镓半导体光电化学刻蚀液及加工方法 |
| FR3102008B1 (fr) * | 2019-10-10 | 2021-09-24 | Commissariat Energie Atomique | Procede de recyclage des batteries li-ion |
| CN111039309A (zh) * | 2019-12-31 | 2020-04-21 | 中船重工(邯郸)派瑞特种气体有限公司 | 一种分离硫酸氢钾和硫酸钾混合物的装置及方法 |
| CN111662641B (zh) * | 2020-06-30 | 2021-10-26 | 中国科学院上海微系统与信息技术研究所 | 一种高选择比的化学机械抛光液及其应用 |
| KR102581261B1 (ko) * | 2021-03-04 | 2023-09-21 | 우석대학교 산학협력단 | 습윤 옥손을 이용한 비시날 트라이카보닐 화합물의 제조방법 |
| CN115124204A (zh) * | 2022-06-16 | 2022-09-30 | 安徽省交通航务工程有限公司 | 一种实现疏浚泥浆快速泥水分离的处理方法 |
| CN116235863A (zh) * | 2023-01-04 | 2023-06-09 | 四川省畜牧科学研究院 | 一种耐分解的消毒剂 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3555147A (en) * | 1967-12-19 | 1971-01-12 | Fmc Corp | Peroxydiphosphate neutralizer for hair waving |
| US3805809A (en) * | 1972-10-02 | 1974-04-23 | Procter & Gamble | Hair setting process |
| EP0149329B1 (en) * | 1983-12-30 | 1992-04-15 | E.I. Du Pont De Nemours And Company | Potassium monopersulfate compositions and process for preparing them |
| DE4014655A1 (de) * | 1990-05-08 | 1991-11-14 | Behringwerke Ag | Peptidamide, verfahren zu deren herstellung und diese enthaltende mittel als fibrin/thrombin-gerinnungsinhibitoren |
| DE4020856A1 (de) * | 1990-06-29 | 1992-01-09 | Degussa | Verfahren zur herstellung von lagerstabilen waessrigen natriumperoxomonosulfatloesungen |
| US5139763A (en) * | 1991-03-06 | 1992-08-18 | E. I. Du Pont De Nemours And Company | Class of stable potassium monopersulfate compositions |
| DE19503900C1 (de) | 1995-02-07 | 1995-11-23 | Degussa | Verfahren zur Herstellung des Kaliumperoxomonosulfat-Tripelsalzes 2 KHSO¶5¶ . KHSO¶4¶ . K¶2¶SO¶4¶ |
| JP4767401B2 (ja) * | 2000-10-30 | 2011-09-07 | ルネサスエレクトロニクス株式会社 | 半導体記憶装置及びその製造方法 |
| US6974777B2 (en) * | 2002-06-07 | 2005-12-13 | Cabot Microelectronics Corporation | CMP compositions for low-k dielectric materials |
| TW200417628A (en) * | 2002-09-09 | 2004-09-16 | Shipley Co Llc | Improved cleaning composition |
| US6818142B2 (en) * | 2003-03-31 | 2004-11-16 | E. I. Du Pont De Nemours And Company | Potassium hydrogen peroxymonosulfate solutions |
| US20050063895A1 (en) * | 2003-09-23 | 2005-03-24 | Martin Perry L. | Production of potassium monopersulfate triple salt using oleum |
| US7090820B2 (en) * | 2003-09-23 | 2006-08-15 | Truox, Inc. | Potassium monopersulfate triple salt with increased active oxygen content and substantially no K2S2O8 |
| US20060013750A1 (en) * | 2004-07-16 | 2006-01-19 | Martin Perry L | Solvent-activated reactor |
| CN1778669A (zh) * | 2004-11-22 | 2006-05-31 | 上海嘉源实业有限公司 | 一种单过硫酸氢钾的制备方法 |
-
2006
- 2006-06-02 US US11/445,610 patent/US7442323B2/en active Active
-
2007
- 2007-05-08 MY MYPI20070707A patent/MY142427A/en unknown
- 2007-05-08 MY MYPI2010001723A patent/MY156749A/en unknown
- 2007-05-14 TW TW096117073A patent/TWI349648B/zh active
- 2007-06-01 CA CA2652151A patent/CA2652151C/en active Active
- 2007-06-01 CN CN200780020437XA patent/CN101460397B/zh active Active
- 2007-06-01 DE DE602007008400T patent/DE602007008400D1/de active Active
- 2007-06-01 WO PCT/US2007/012995 patent/WO2007143127A1/en not_active Ceased
- 2007-06-01 JP JP2009513306A patent/JP5292285B2/ja active Active
- 2007-06-01 EP EP07777364A patent/EP2024281B1/en active Active
- 2007-06-01 KR KR1020087031909A patent/KR101397363B1/ko active Active
-
2008
- 2008-09-10 US US12/207,733 patent/US8123970B2/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102995021A (zh) * | 2011-09-08 | 2013-03-27 | 关东化学株式会社 | 铜及铜合金的蚀刻液组合物及蚀刻方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009539740A (ja) | 2009-11-19 |
| DE602007008400D1 (de) | 2010-09-23 |
| MY156749A (en) | 2016-03-31 |
| TWI349648B (en) | 2011-10-01 |
| KR20090016003A (ko) | 2009-02-12 |
| US8123970B2 (en) | 2012-02-28 |
| US20090008601A1 (en) | 2009-01-08 |
| US20070278182A1 (en) | 2007-12-06 |
| CA2652151C (en) | 2015-08-04 |
| JP5292285B2 (ja) | 2013-09-18 |
| US7442323B2 (en) | 2008-10-28 |
| EP2024281A1 (en) | 2009-02-18 |
| CN101460397B (zh) | 2011-07-06 |
| HK1133420A1 (en) | 2010-03-26 |
| EP2024281B1 (en) | 2010-08-11 |
| CN101460397A (zh) | 2009-06-17 |
| TW200804174A (en) | 2008-01-16 |
| CA2652151A1 (en) | 2007-12-13 |
| KR101397363B1 (ko) | 2014-05-19 |
| WO2007143127A1 (en) | 2007-12-13 |
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