MY142427A - Potassium monopersulfate solutions - Google Patents

Potassium monopersulfate solutions

Info

Publication number
MY142427A
MY142427A MYPI20070707A MYPI20070707A MY142427A MY 142427 A MY142427 A MY 142427A MY PI20070707 A MYPI20070707 A MY PI20070707A MY PI20070707 A MYPI20070707 A MY PI20070707A MY 142427 A MY142427 A MY 142427A
Authority
MY
Malaysia
Prior art keywords
potassium monopersulfate
monopersulfate solutions
solutions
potassium
composition
Prior art date
Application number
MYPI20070707A
Other languages
English (en)
Inventor
Robert Jeffrey Durante
Harvey James Bohn Jr
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of MY142427A publication Critical patent/MY142427A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B15/00—Peroxides; Peroxyhydrates; Peroxyacids or salts thereof; Superoxides; Ozonides
    • C01B15/055—Peroxyhydrates; Peroxyacids or salts thereof
    • C01B15/06—Peroxyhydrates; Peroxyacids or salts thereof containing sulfur
    • C01B15/08—Peroxysulfates
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B15/00—Peroxides; Peroxyhydrates; Peroxyacids or salts thereof; Superoxides; Ozonides
    • C01B15/055—Peroxyhydrates; Peroxyacids or salts thereof
    • C01B15/06—Peroxyhydrates; Peroxyacids or salts thereof containing sulfur
    • C01B15/08—Peroxysulfates
    • C01B15/085—Stabilisation of the solid compounds, subsequent to the preparation or to the crystallisation, by additives or by coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • C23F3/06—Heavy metals with acidic solutions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Detergent Compositions (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
  • Treatment Of Water By Oxidation Or Reduction (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Weting (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
MYPI20070707A 2006-06-02 2007-05-08 Potassium monopersulfate solutions MY142427A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/445,610 US7442323B2 (en) 2006-06-02 2006-06-02 Potassium monopersulfate solutions

Publications (1)

Publication Number Publication Date
MY142427A true MY142427A (en) 2010-11-30

Family

ID=38566311

Family Applications (2)

Application Number Title Priority Date Filing Date
MYPI20070707A MY142427A (en) 2006-06-02 2007-05-08 Potassium monopersulfate solutions
MYPI2010001723A MY156749A (en) 2006-06-02 2007-05-08 Potassium monopersulfate solutions

Family Applications After (1)

Application Number Title Priority Date Filing Date
MYPI2010001723A MY156749A (en) 2006-06-02 2007-05-08 Potassium monopersulfate solutions

Country Status (10)

Country Link
US (2) US7442323B2 (enExample)
EP (1) EP2024281B1 (enExample)
JP (1) JP5292285B2 (enExample)
KR (1) KR101397363B1 (enExample)
CN (1) CN101460397B (enExample)
CA (1) CA2652151C (enExample)
DE (1) DE602007008400D1 (enExample)
MY (2) MY142427A (enExample)
TW (1) TWI349648B (enExample)
WO (1) WO2007143127A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102995021A (zh) * 2011-09-08 2013-03-27 关东化学株式会社 铜及铜合金的蚀刻液组合物及蚀刻方法

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US20100239678A1 (en) * 2006-07-18 2010-09-23 Ali Razavi Ionically functionalized nanodiamonds
KR20100056537A (ko) * 2007-08-20 2010-05-27 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 이온-주입된 포토레지스트를 제거하기 위한 조성물 및 방법
WO2009135102A2 (en) * 2008-05-01 2009-11-05 Advanced Technology Materials, Inc. Low ph mixtures for the removal of high density implanted resist
TWI480360B (zh) 2009-04-03 2015-04-11 杜邦股份有限公司 蝕刻劑組成物及方法
JP5340071B2 (ja) * 2009-08-03 2013-11-13 株式会社Ａｄｅｋａ 安定剤を含むペルオキシ一硫酸水溶液の製造方法
US10383894B2 (en) * 2010-03-17 2019-08-20 Lutran Industries, Inc. Human medicinal treatment using salt of peroxymonosulfuric acid
US20120074014A1 (en) * 2010-09-27 2012-03-29 Lutran Industries, Inc. Product typically based on salt of peroxymonosulfuric acid and suitable for medicinal usage, and associated product fabrication
CN102869653A (zh) * 2010-03-18 2013-01-09 陶氏环球技术有限责任公司 制备二乙烯基芳烃二氧化物的方法
CN102296293B (zh) * 2011-06-24 2015-01-07 李沛泓 印刷线路板微蚀刻剂
US20150104938A1 (en) * 2013-10-16 2015-04-16 United Microelectronics Corporation Method for forming damascene opening and applications thereof
JP2016104474A (ja) * 2014-08-22 2016-06-09 有限会社情報科学研究所 共鳴発泡と真空キャビテーションによるウルトラファインバブル製造方法及びウルトラファインバブル水製造装置。
US10308541B2 (en) 2014-11-13 2019-06-04 Gerresheimer Glas Gmbh Glass forming machine particle filter, a plunger unit, a blow head, a blow head support and a glass forming machine adapted to or comprising said filter
CN108950558A (zh) * 2018-08-27 2018-12-07 深圳市星扬高新科技有限公司 一种铜制件表面粗化剂
CN110172349B (zh) * 2019-05-08 2020-11-20 厦门大学 一种氮化镓半导体光电化学刻蚀液及加工方法
FR3102008B1 (fr) * 2019-10-10 2021-09-24 Commissariat Energie Atomique Procede de recyclage des batteries li-ion
CN111039309A (zh) * 2019-12-31 2020-04-21 中船重工（邯郸）派瑞特种气体有限公司 一种分离硫酸氢钾和硫酸钾混合物的装置及方法
CN111662641B (zh) * 2020-06-30 2021-10-26 中国科学院上海微系统与信息技术研究所 一种高选择比的化学机械抛光液及其应用
KR102581261B1 (ko) * 2021-03-04 2023-09-21 우석대학교 산학협력단 습윤 옥손을 이용한 비시날 트라이카보닐 화합물의 제조방법
CN115124204A (zh) * 2022-06-16 2022-09-30 安徽省交通航务工程有限公司 一种实现疏浚泥浆快速泥水分离的处理方法
CN116235863A (zh) * 2023-01-04 2023-06-09 四川省畜牧科学研究院 一种耐分解的消毒剂

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Publication number Priority date Publication date Assignee Title
US3555147A (en) * 1967-12-19 1971-01-12 Fmc Corp Peroxydiphosphate neutralizer for hair waving
US3805809A (en) * 1972-10-02 1974-04-23 Procter & Gamble Hair setting process
EP0149329B1 (en) * 1983-12-30 1992-04-15 E.I. Du Pont De Nemours And Company Potassium monopersulfate compositions and process for preparing them
DE4014655A1 (de) * 1990-05-08 1991-11-14 Behringwerke Ag Peptidamide, verfahren zu deren herstellung und diese enthaltende mittel als fibrin/thrombin-gerinnungsinhibitoren
DE4020856A1 (de) * 1990-06-29 1992-01-09 Degussa Verfahren zur herstellung von lagerstabilen waessrigen natriumperoxomonosulfatloesungen
US5139763A (en) * 1991-03-06 1992-08-18 E. I. Du Pont De Nemours And Company Class of stable potassium monopersulfate compositions
DE19503900C1 (de) 1995-02-07 1995-11-23 Degussa Verfahren zur Herstellung des Kaliumperoxomonosulfat-Tripelsalzes 2 KHSO¶5¶ . KHSO¶4¶ . K¶2¶SO¶4¶
JP4767401B2 (ja) * 2000-10-30 2011-09-07 ルネサスエレクトロニクス株式会社 半導体記憶装置及びその製造方法
US6974777B2 (en) * 2002-06-07 2005-12-13 Cabot Microelectronics Corporation CMP compositions for low-k dielectric materials
TW200417628A (en) * 2002-09-09 2004-09-16 Shipley Co Llc Improved cleaning composition
US6818142B2 (en) * 2003-03-31 2004-11-16 E. I. Du Pont De Nemours And Company Potassium hydrogen peroxymonosulfate solutions
US7090820B2 (en) * 2003-09-23 2006-08-15 Truox, Inc. Potassium monopersulfate triple salt with increased active oxygen content and substantially no K2S2O8
US20050063895A1 (en) * 2003-09-23 2005-03-24 Martin Perry L. Production of potassium monopersulfate triple salt using oleum
US20060013750A1 (en) * 2004-07-16 2006-01-19 Martin Perry L Solvent-activated reactor
CN1778669A (zh) * 2004-11-22 2006-05-31 上海嘉源实业有限公司 一种单过硫酸氢钾的制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102995021A (zh) * 2011-09-08 2013-03-27 关东化学株式会社 铜及铜合金的蚀刻液组合物及蚀刻方法

Also Published As

Publication number Publication date
DE602007008400D1 (de) 2010-09-23
CN101460397A (zh) 2009-06-17
KR20090016003A (ko) 2009-02-12
CA2652151C (en) 2015-08-04
US20090008601A1 (en) 2009-01-08
WO2007143127A1 (en) 2007-12-13
EP2024281B1 (en) 2010-08-11
TWI349648B (en) 2011-10-01
TW200804174A (en) 2008-01-16
US8123970B2 (en) 2012-02-28
CA2652151A1 (en) 2007-12-13
JP5292285B2 (ja) 2013-09-18
MY156749A (en) 2016-03-31
JP2009539740A (ja) 2009-11-19
US7442323B2 (en) 2008-10-28
KR101397363B1 (ko) 2014-05-19
EP2024281A1 (en) 2009-02-18
CN101460397B (zh) 2011-07-06
HK1133420A1 (en) 2010-03-26
US20070278182A1 (en) 2007-12-06

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