CA2652151C - Potassium monopersulfate solutions - Google Patents
Potassium monopersulfate solutions Download PDFInfo
- Publication number
- CA2652151C CA2652151C CA2652151A CA2652151A CA2652151C CA 2652151 C CA2652151 C CA 2652151C CA 2652151 A CA2652151 A CA 2652151A CA 2652151 A CA2652151 A CA 2652151A CA 2652151 C CA2652151 C CA 2652151C
- Authority
- CA
- Canada
- Prior art keywords
- active oxygen
- solution
- potassium
- content
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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- HJKYXKSLRZKNSI-UHFFFAOYSA-I pentapotassium;hydrogen sulfate;oxido sulfate;sulfuric acid Chemical compound [K+].[K+].[K+].[K+].[K+].OS([O-])(=O)=O.[O-]S([O-])(=O)=O.OS(=O)(=O)O[O-].OS(=O)(=O)O[O-] HJKYXKSLRZKNSI-UHFFFAOYSA-I 0.000 title claims abstract description 48
- 239000012425 OXONE® Substances 0.000 title claims abstract description 43
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 122
- 239000001301 oxygen Substances 0.000 claims abstract description 122
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 122
- 238000000034 method Methods 0.000 claims abstract description 33
- 239000000203 mixture Substances 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 24
- 238000002360 preparation method Methods 0.000 claims abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 57
- 229910001868 water Inorganic materials 0.000 claims description 48
- 239000007787 solid Substances 0.000 claims description 43
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 34
- 229910000343 potassium bisulfate Inorganic materials 0.000 claims description 30
- CHKVPAROMQMJNQ-UHFFFAOYSA-M potassium bisulfate Chemical compound [K+].OS([O-])(=O)=O CHKVPAROMQMJNQ-UHFFFAOYSA-M 0.000 claims description 26
- 239000002002 slurry Substances 0.000 claims description 26
- 229910052939 potassium sulfate Inorganic materials 0.000 claims description 22
- 238000002156 mixing Methods 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 14
- 238000005498 polishing Methods 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000002253 acid Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000002671 adjuvant Substances 0.000 claims description 5
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 4
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 claims description 4
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 4
- 238000011068 loading method Methods 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 claims description 2
- 229910001863 barium hydroxide Inorganic materials 0.000 claims description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 2
- 239000000347 magnesium hydroxide Substances 0.000 claims description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 2
- 235000012254 magnesium hydroxide Nutrition 0.000 claims description 2
- 235000010755 mineral Nutrition 0.000 claims description 2
- 239000011707 mineral Substances 0.000 claims description 2
- 239000003607 modifier Substances 0.000 claims description 2
- 150000007524 organic acids Chemical class 0.000 claims description 2
- 239000011736 potassium bicarbonate Substances 0.000 claims description 2
- 235000015497 potassium bicarbonate Nutrition 0.000 claims description 2
- 229910000028 potassium bicarbonate Inorganic materials 0.000 claims description 2
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 2
- 235000011181 potassium carbonates Nutrition 0.000 claims description 2
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 claims description 2
- 229910000030 sodium bicarbonate Inorganic materials 0.000 claims description 2
- 235000017557 sodium bicarbonate Nutrition 0.000 claims description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 2
- 235000017550 sodium carbonate Nutrition 0.000 claims description 2
- 239000003381 stabilizer Substances 0.000 claims description 2
- 239000004094 surface-active agent Substances 0.000 claims description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims 2
- 238000006386 neutralization reaction Methods 0.000 abstract description 7
- 239000000243 solution Substances 0.000 description 104
- OKBMCNHOEMXPTM-UHFFFAOYSA-M potassium peroxymonosulfate Chemical compound [K+].OOS([O-])(=O)=O OKBMCNHOEMXPTM-UHFFFAOYSA-M 0.000 description 28
- 239000000706 filtrate Substances 0.000 description 23
- 150000003839 salts Chemical class 0.000 description 22
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 16
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 12
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 11
- 239000008367 deionised water Substances 0.000 description 11
- 229910021641 deionized water Inorganic materials 0.000 description 11
- 239000012047 saturated solution Substances 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 9
- -1 salt potassium monopersulfate Chemical class 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- 238000003828 vacuum filtration Methods 0.000 description 7
- 230000008901 benefit Effects 0.000 description 6
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 239000007800 oxidant agent Substances 0.000 description 5
- 239000002244 precipitate Substances 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 4
- 230000002829 reductive effect Effects 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 238000010790 dilution Methods 0.000 description 3
- 239000012895 dilution Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 235000011151 potassium sulphates Nutrition 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- ZKQDCIXGCQPQNV-UHFFFAOYSA-N Calcium hypochlorite Chemical compound [Ca+2].Cl[O-].Cl[O-] ZKQDCIXGCQPQNV-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 238000013019 agitation Methods 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-M hydrogensulfate Chemical compound OS([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-M 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000003472 neutralizing effect Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000010186 staining Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- JTNCEQNHURODLX-UHFFFAOYSA-N 2-phenylethanimidamide Chemical compound NC(=N)CC1=CC=CC=C1 JTNCEQNHURODLX-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- QDHHCQZDFGDHMP-UHFFFAOYSA-N Chloramine Chemical class ClN QDHHCQZDFGDHMP-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 230000000845 anti-microbial effect Effects 0.000 description 1
- 150000003851 azoles Chemical class 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 238000004061 bleaching Methods 0.000 description 1
- 239000007844 bleaching agent Substances 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000010908 decantation Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000003467 diminishing effect Effects 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000002635 electroconvulsive therapy Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000012065 filter cake Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 230000000813 microbial effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- HDMGAZBPFLDBCX-UHFFFAOYSA-M potassium;sulfooxy sulfate Chemical compound [K+].OS(=O)(=O)OOS([O-])(=O)=O HDMGAZBPFLDBCX-UHFFFAOYSA-M 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229940087596 sodium phenolsulfonate Drugs 0.000 description 1
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 1
- 235000019345 sodium thiosulphate Nutrition 0.000 description 1
- BLXAGSNYHSQSRC-UHFFFAOYSA-M sodium;2-hydroxybenzenesulfonate Chemical compound [Na+].OC1=CC=CC=C1S([O-])(=O)=O BLXAGSNYHSQSRC-UHFFFAOYSA-M 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000012430 stability testing Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B15/00—Peroxides; Peroxyhydrates; Peroxyacids or salts thereof; Superoxides; Ozonides
- C01B15/055—Peroxyhydrates; Peroxyacids or salts thereof
- C01B15/06—Peroxyhydrates; Peroxyacids or salts thereof containing sulfur
- C01B15/08—Peroxysulfates
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B15/00—Peroxides; Peroxyhydrates; Peroxyacids or salts thereof; Superoxides; Ozonides
- C01B15/055—Peroxyhydrates; Peroxyacids or salts thereof
- C01B15/06—Peroxyhydrates; Peroxyacids or salts thereof containing sulfur
- C01B15/08—Peroxysulfates
- C01B15/085—Stabilisation of the solid compounds, subsequent to the preparation or to the crystallisation, by additives or by coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
- C23F3/06—Heavy metals with acidic solutions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Detergent Compositions (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Agricultural Chemicals And Associated Chemicals (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Treatment Of Water By Oxidation Or Reduction (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Weting (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/445,610 | 2006-06-02 | ||
| US11/445,610 US7442323B2 (en) | 2006-06-02 | 2006-06-02 | Potassium monopersulfate solutions |
| PCT/US2007/012995 WO2007143127A1 (en) | 2006-06-02 | 2007-06-01 | Potassium monopersulfate solutions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2652151A1 CA2652151A1 (en) | 2007-12-13 |
| CA2652151C true CA2652151C (en) | 2015-08-04 |
Family
ID=38566311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2652151A Active CA2652151C (en) | 2006-06-02 | 2007-06-01 | Potassium monopersulfate solutions |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US7442323B2 (enExample) |
| EP (1) | EP2024281B1 (enExample) |
| JP (1) | JP5292285B2 (enExample) |
| KR (1) | KR101397363B1 (enExample) |
| CN (1) | CN101460397B (enExample) |
| CA (1) | CA2652151C (enExample) |
| DE (1) | DE602007008400D1 (enExample) |
| MY (2) | MY142427A (enExample) |
| TW (1) | TWI349648B (enExample) |
| WO (1) | WO2007143127A1 (enExample) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20100239678A1 (en) * | 2006-07-18 | 2010-09-23 | Ali Razavi | Ionically functionalized nanodiamonds |
| WO2009026324A2 (en) | 2007-08-20 | 2009-02-26 | Advanced Technology Materials, Inc. | Composition and method for removing ion-implanted photoresist |
| KR20100133507A (ko) * | 2008-05-01 | 2010-12-21 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | 고밀도 주입된 레지스트의 제거를 위한 저 ｐｈ 혼합물 |
| TWI480360B (zh) | 2009-04-03 | 2015-04-11 | Du Pont | 蝕刻劑組成物及方法 |
| JP5340071B2 (ja) * | 2009-08-03 | 2013-11-13 | 株式会社Ａｄｅｋａ | 安定剤を含むペルオキシ一硫酸水溶液の製造方法 |
| US10383894B2 (en) * | 2010-03-17 | 2019-08-20 | Lutran Industries, Inc. | Human medicinal treatment using salt of peroxymonosulfuric acid |
| US20120074014A1 (en) * | 2010-09-27 | 2012-03-29 | Lutran Industries, Inc. | Product typically based on salt of peroxymonosulfuric acid and suitable for medicinal usage, and associated product fabrication |
| MX2012010730A (es) * | 2010-03-18 | 2012-12-17 | Dow Global Technologies Llc | Proceso para preparar dioxidos de divinilareno. |
| CN102296293B (zh) * | 2011-06-24 | 2015-01-07 | 李沛泓 | 印刷线路板微蚀刻剂 |
| JP5885971B2 (ja) * | 2011-09-08 | 2016-03-16 | 関東化學株式会社 | 銅および銅合金のエッチング液 |
| US20150104938A1 (en) * | 2013-10-16 | 2015-04-16 | United Microelectronics Corporation | Method for forming damascene opening and applications thereof |
| JP2016104474A (ja) * | 2014-08-22 | 2016-06-09 | 有限会社情報科学研究所 | 共鳴発泡と真空キャビテーションによるウルトラファインバブル製造方法及びウルトラファインバブル水製造装置。 |
| PL3218317T3 (pl) | 2014-11-13 | 2019-03-29 | Gerresheimer Glas Gmbh | Filtr cząstek urządzenia do wytwarzania szkła, jednostka tłoka, głowica dmuchu, wspornik głowicy dmuchu i urządzenie do wytwarzania szkła, przystosowane lub zawierające filtr |
| CN108950558A (zh) * | 2018-08-27 | 2018-12-07 | 深圳市星扬高新科技有限公司 | 一种铜制件表面粗化剂 |
| CN110172349B (zh) * | 2019-05-08 | 2020-11-20 | 厦门大学 | 一种氮化镓半导体光电化学刻蚀液及加工方法 |
| FR3102008B1 (fr) * | 2019-10-10 | 2021-09-24 | Commissariat Energie Atomique | Procede de recyclage des batteries li-ion |
| CN111039309A (zh) * | 2019-12-31 | 2020-04-21 | 中船重工（邯郸）派瑞特种气体有限公司 | 一种分离硫酸氢钾和硫酸钾混合物的装置及方法 |
| CN111662641B (zh) * | 2020-06-30 | 2021-10-26 | 中国科学院上海微系统与信息技术研究所 | 一种高选择比的化学机械抛光液及其应用 |
| KR102581261B1 (ko) * | 2021-03-04 | 2023-09-21 | 우석대학교 산학협력단 | 습윤 옥손을 이용한 비시날 트라이카보닐 화합물의 제조방법 |
| CN115124204A (zh) * | 2022-06-16 | 2022-09-30 | 安徽省交通航务工程有限公司 | 一种实现疏浚泥浆快速泥水分离的处理方法 |
| CN116235863A (zh) * | 2023-01-04 | 2023-06-09 | 四川省畜牧科学研究院 | 一种耐分解的消毒剂 |
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| US3555147A (en) * | 1967-12-19 | 1971-01-12 | Fmc Corp | Peroxydiphosphate neutralizer for hair waving |
| US3805809A (en) * | 1972-10-02 | 1974-04-23 | Procter & Gamble | Hair setting process |
| EP0149329B1 (en) * | 1983-12-30 | 1992-04-15 | E.I. Du Pont De Nemours And Company | Potassium monopersulfate compositions and process for preparing them |
| DE4014655A1 (de) * | 1990-05-08 | 1991-11-14 | Behringwerke Ag | Peptidamide, verfahren zu deren herstellung und diese enthaltende mittel als fibrin/thrombin-gerinnungsinhibitoren |
| DE4020856A1 (de) * | 1990-06-29 | 1992-01-09 | Degussa | Verfahren zur herstellung von lagerstabilen waessrigen natriumperoxomonosulfatloesungen |
| US5139763A (en) * | 1991-03-06 | 1992-08-18 | E. I. Du Pont De Nemours And Company | Class of stable potassium monopersulfate compositions |
| DE19503900C1 (de) | 1995-02-07 | 1995-11-23 | Degussa | Verfahren zur Herstellung des Kaliumperoxomonosulfat-Tripelsalzes 2 KHSO¶5¶ . KHSO¶4¶ . K¶2¶SO¶4¶ |
| JP4767401B2 (ja) * | 2000-10-30 | 2011-09-07 | ルネサスエレクトロニクス株式会社 | 半導体記憶装置及びその製造方法 |
| US6974777B2 (en) * | 2002-06-07 | 2005-12-13 | Cabot Microelectronics Corporation | CMP compositions for low-k dielectric materials |
| TW200417628A (en) * | 2002-09-09 | 2004-09-16 | Shipley Co Llc | Improved cleaning composition |
| US6818142B2 (en) * | 2003-03-31 | 2004-11-16 | E. I. Du Pont De Nemours And Company | Potassium hydrogen peroxymonosulfate solutions |
| US20050063895A1 (en) * | 2003-09-23 | 2005-03-24 | Martin Perry L. | Production of potassium monopersulfate triple salt using oleum |
| US7090820B2 (en) * | 2003-09-23 | 2006-08-15 | Truox, Inc. | Potassium monopersulfate triple salt with increased active oxygen content and substantially no K2S2O8 |
| US20060013750A1 (en) * | 2004-07-16 | 2006-01-19 | Martin Perry L | Solvent-activated reactor |
| CN1778669A (zh) * | 2004-11-22 | 2006-05-31 | 上海嘉源实业有限公司 | 一种单过硫酸氢钾的制备方法 |
-
2006
- 2006-06-02 US US11/445,610 patent/US7442323B2/en active Active
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- 2007-05-08 MY MYPI20070707A patent/MY142427A/en unknown
- 2007-05-08 MY MYPI2010001723A patent/MY156749A/en unknown
- 2007-05-14 TW TW096117073A patent/TWI349648B/zh active
- 2007-06-01 CA CA2652151A patent/CA2652151C/en active Active
- 2007-06-01 CN CN200780020437XA patent/CN101460397B/zh active Active
- 2007-06-01 DE DE602007008400T patent/DE602007008400D1/de active Active
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- 2007-06-01 JP JP2009513306A patent/JP5292285B2/ja active Active
- 2007-06-01 EP EP07777364A patent/EP2024281B1/en active Active
- 2007-06-01 KR KR1020087031909A patent/KR101397363B1/ko active Active
-
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2009539740A (ja) | 2009-11-19 |
| DE602007008400D1 (de) | 2010-09-23 |
| MY156749A (en) | 2016-03-31 |
| TWI349648B (en) | 2011-10-01 |
| KR20090016003A (ko) | 2009-02-12 |
| US8123970B2 (en) | 2012-02-28 |
| US20090008601A1 (en) | 2009-01-08 |
| MY142427A (en) | 2010-11-30 |
| US20070278182A1 (en) | 2007-12-06 |
| JP5292285B2 (ja) | 2013-09-18 |
| US7442323B2 (en) | 2008-10-28 |
| EP2024281A1 (en) | 2009-02-18 |
| CN101460397B (zh) | 2011-07-06 |
| HK1133420A1 (en) | 2010-03-26 |
| EP2024281B1 (en) | 2010-08-11 |
| CN101460397A (zh) | 2009-06-17 |
| TW200804174A (en) | 2008-01-16 |
| CA2652151A1 (en) | 2007-12-13 |
| KR101397363B1 (ko) | 2014-05-19 |
| WO2007143127A1 (en) | 2007-12-13 |
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