JP2006522003A5 - - Google Patents
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- JP2006522003A5 JP2006522003A5 JP2006509586A JP2006509586A JP2006522003A5 JP 2006522003 A5 JP2006522003 A5 JP 2006522003A5 JP 2006509586 A JP2006509586 A JP 2006509586A JP 2006509586 A JP2006509586 A JP 2006509586A JP 2006522003 A5 JP2006522003 A5 JP 2006522003A5
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- JP
- Japan
- Prior art keywords
- solution
- composition
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- etched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000012425 OXONE® Substances 0.000 claims description 28
- HJKYXKSLRZKNSI-UHFFFAOYSA-I pentapotassium;hydrogen sulfate;oxido sulfate;sulfuric acid Chemical compound [K+].[K+].[K+].[K+].[K+].OS([O-])(=O)=O.[O-]S([O-])(=O)=O.OS(=O)(=O)O[O-].OS(=O)(=O)O[O-] HJKYXKSLRZKNSI-UHFFFAOYSA-I 0.000 claims description 23
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 16
- 239000001301 oxygen Substances 0.000 claims description 16
- 229910052760 oxygen Inorganic materials 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 13
- OKBMCNHOEMXPTM-UHFFFAOYSA-M potassium peroxymonosulfate Chemical compound [K+].OOS([O-])(=O)=O OKBMCNHOEMXPTM-UHFFFAOYSA-M 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 7
- 239000002002 slurry Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 4
- 239000002671 adjuvant Substances 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- -1 heterocyclic azoles Chemical class 0.000 claims description 2
- 150000003839 salts Chemical class 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims 4
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 claims 2
- 229910052500 inorganic mineral Inorganic materials 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 239000011707 mineral Substances 0.000 claims 2
- 239000003607 modifier Substances 0.000 claims 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims 2
- 239000003381 stabilizer Substances 0.000 claims 2
- 239000004094 surface-active agent Substances 0.000 claims 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- 239000012141 concentrate Substances 0.000 claims 1
- 125000000623 heterocyclic group Chemical group 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- NESLWCLHZZISNB-UHFFFAOYSA-M sodium phenolate Chemical compound [Na+].[O-]C1=CC=CC=C1 NESLWCLHZZISNB-UHFFFAOYSA-M 0.000 claims 1
- 229940087596 sodium phenolsulfonate Drugs 0.000 claims 1
- BLXAGSNYHSQSRC-UHFFFAOYSA-M sodium;2-hydroxybenzenesulfonate Chemical compound [Na+].OC1=CC=CC=C1S([O-])(=O)=O BLXAGSNYHSQSRC-UHFFFAOYSA-M 0.000 claims 1
- 230000000087 stabilizing effect Effects 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims 1
- 239000000243 solution Substances 0.000 description 21
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 6
- 239000000706 filtrate Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000004480 active ingredient Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000001692 EU approved anti-caking agent Substances 0.000 description 1
- YZCKVEUIGOORGS-UHFFFAOYSA-N Hydrogen atom Chemical class [H] YZCKVEUIGOORGS-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 description 1
- 229910052939 potassium sulfate Inorganic materials 0.000 description 1
- 235000011151 potassium sulphates Nutrition 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 1
- 235000019345 sodium thiosulphate Nutrition 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/404,200 US6818142B2 (en) | 2003-03-31 | 2003-03-31 | Potassium hydrogen peroxymonosulfate solutions |
| US10/404,200 | 2003-03-31 | ||
| PCT/US2004/010043 WO2004089817A1 (en) | 2003-03-31 | 2004-03-31 | Potassium hydrogen peroxymonosulfate solutions |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006522003A JP2006522003A (ja) | 2006-09-28 |
| JP2006522003A5 true JP2006522003A5 (enExample) | 2010-09-02 |
| JP4745221B2 JP4745221B2 (ja) | 2011-08-10 |
Family
ID=33096896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006509586A Expired - Lifetime JP4745221B2 (ja) | 2003-03-31 | 2004-03-31 | ペルオキシモノ硫酸水素カリウム溶液 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6818142B2 (enExample) |
| EP (1) | EP1608591A1 (enExample) |
| JP (1) | JP4745221B2 (enExample) |
| KR (1) | KR101069113B1 (enExample) |
| CN (1) | CN1331736C (enExample) |
| CA (1) | CA2517511A1 (enExample) |
| MY (1) | MY138355A (enExample) |
| TW (1) | TWI348993B (enExample) |
| WO (1) | WO2004089817A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7329365B2 (en) * | 2004-08-25 | 2008-02-12 | Samsung Electronics Co., Ltd. | Etchant composition for indium oxide layer and etching method using the same |
| KR101191405B1 (ko) * | 2005-07-13 | 2012-10-16 | 삼성디스플레이 주식회사 | 식각액 및 이를 이용한 액정 표시 장치의 제조 방법 |
| US20070023364A1 (en) * | 2005-07-28 | 2007-02-01 | Felkner I C | Tetrasilver Tetraoxide as Disinfective Agent for Cryptosporidium |
| US20070138109A1 (en) * | 2005-12-21 | 2007-06-21 | Tufano Thomas P | Oxidizing composition for salt water |
| US7442323B2 (en) * | 2006-06-02 | 2008-10-28 | E. I. Du Pont De Nemours And Company | Potassium monopersulfate solutions |
| WO2009026324A2 (en) * | 2007-08-20 | 2009-02-26 | Advanced Technology Materials, Inc. | Composition and method for removing ion-implanted photoresist |
| KR20100133507A (ko) * | 2008-05-01 | 2010-12-21 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | 고밀도 주입된 레지스트의 제거를 위한 저 ｐｈ 혼합물 |
| US20100252530A1 (en) * | 2009-04-03 | 2010-10-07 | E. I. Du Pont De Nemours And Company | Etchant composition and method |
| TWI480360B (zh) * | 2009-04-03 | 2015-04-11 | Du Pont | 蝕刻劑組成物及方法 |
| JP5340071B2 (ja) * | 2009-08-03 | 2013-11-13 | 株式会社Ａｄｅｋａ | 安定剤を含むペルオキシ一硫酸水溶液の製造方法 |
| CN102260871A (zh) * | 2011-06-24 | 2011-11-30 | 李沛泓 | 印刷线路板微蚀刻剂 |
| EP2572776A1 (en) * | 2011-09-21 | 2013-03-27 | Evonik Degussa GmbH | Device for mixing and cooling two reactive liquids and method of making peroxomonosulphuric acid with the device |
| EP2572781A1 (en) | 2011-09-21 | 2013-03-27 | Evonik Degussa GmbH | Device and method for making a dilute aqueous solution of peroxomonosulphuric acid |
| CN110172349B (zh) * | 2019-05-08 | 2020-11-20 | 厦门大学 | 一种氮化镓半导体光电化学刻蚀液及加工方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE106331C (enExample) | ||||
| US2500881A (en) * | 1949-05-10 | 1950-03-14 | Stader William | Hanger support |
| BE579110A (enExample) | 1958-05-29 | |||
| US3048546A (en) | 1959-02-24 | 1962-08-07 | Du Pont | Bleaching compositions |
| US3041139A (en) * | 1960-06-24 | 1962-06-26 | Du Pont | Method of preparing monopersulfate composition containing the triple salt khso4?k2so4?2khso5 |
| EP0149329B1 (en) * | 1983-12-30 | 1992-04-15 | E.I. Du Pont De Nemours And Company | Potassium monopersulfate compositions and process for preparing them |
| US4579725A (en) | 1983-12-30 | 1986-04-01 | E. I. Du Pont De Nemours And Company | Potassium monopersulfate compositions and process for preparing them |
| DE3427119A1 (de) | 1984-07-23 | 1986-01-23 | Peroxid-Chemie GmbH, 8023 Höllriegelskreuth | Verfahren zur herstellung von kaliumpermonosulfat-tripelsalz |
| DE3914827C2 (de) | 1989-05-05 | 1995-06-14 | Schuelke & Mayr Gmbh | Flüssiges Desinfektionsmittelkonzentrat |
| US5139763A (en) * | 1991-03-06 | 1992-08-18 | E. I. Du Pont De Nemours And Company | Class of stable potassium monopersulfate compositions |
| DE19503900C1 (de) | 1995-02-07 | 1995-11-23 | Degussa | Verfahren zur Herstellung des Kaliumperoxomonosulfat-Tripelsalzes 2 KHSO¶5¶ . KHSO¶4¶ . K¶2¶SO¶4¶ |
| WO1998004646A1 (en) * | 1996-07-25 | 1998-02-05 | Ekc Technology, Inc. | Chemical mechanical polishing composition and process |
| US5855805A (en) * | 1996-08-08 | 1999-01-05 | Fmc Corporation | Microetching and cleaning of printed wiring boards |
| JP3094392B2 (ja) * | 1997-12-10 | 2000-10-03 | 株式会社荏原電産 | エッチング液 |
| US6200454B1 (en) | 1997-12-24 | 2001-03-13 | Mitsubishi Gas Chemical Company, Inc. | Process for producing sodium persulfate |
| JP2000064067A (ja) * | 1998-06-09 | 2000-02-29 | Ebara Densan Ltd | エッチング液および銅表面の粗化処理方法 |
| US6255117B1 (en) | 1999-06-04 | 2001-07-03 | Lamotte Company | Method and device for determining monopersulfate |
| JP3974305B2 (ja) * | 1999-06-18 | 2007-09-12 | エルジー フィリップス エルシーディー カンパニー リミテッド | エッチング剤及びこれを用いた電子機器用基板の製造方法と電子機器 |
-
2003
- 2003-03-31 US US10/404,200 patent/US6818142B2/en not_active Expired - Lifetime
-
2004
- 2004-03-05 TW TW093105892A patent/TWI348993B/zh not_active IP Right Cessation
- 2004-03-30 MY MYPI20041139A patent/MY138355A/en unknown
- 2004-03-31 CN CNB2004800088248A patent/CN1331736C/zh not_active Expired - Lifetime
- 2004-03-31 CA CA002517511A patent/CA2517511A1/en not_active Abandoned
- 2004-03-31 JP JP2006509586A patent/JP4745221B2/ja not_active Expired - Lifetime
- 2004-03-31 WO PCT/US2004/010043 patent/WO2004089817A1/en not_active Ceased
- 2004-03-31 EP EP04749617A patent/EP1608591A1/en not_active Withdrawn
- 2004-03-31 KR KR1020057018493A patent/KR101069113B1/ko not_active Expired - Lifetime
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