CN101449347A - 具有单晶硅电极的电容性微机电传感器 - Google Patents
具有单晶硅电极的电容性微机电传感器 Download PDFInfo
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- CN101449347A CN101449347A CNA2007800178712A CN200780017871A CN101449347A CN 101449347 A CN101449347 A CN 101449347A CN A2007800178712 A CNA2007800178712 A CN A2007800178712A CN 200780017871 A CN200780017871 A CN 200780017871A CN 101449347 A CN101449347 A CN 101449347A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
- G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0242—Gyroscopes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0264—Pressure sensors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
- G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
- G01P2015/0831—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type having the pivot axis between the longitudinal ends of the mass, e.g. see-saw configuration
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Micromachines (AREA)
- Gyroscopes (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US79179006P | 2006-04-13 | 2006-04-13 | |
US60/791,790 | 2006-04-13 | ||
US11/707,347 US7539003B2 (en) | 2005-12-01 | 2007-02-16 | Capacitive micro-electro-mechanical sensors with single crystal silicon electrodes |
US11/707,347 | 2007-02-16 | ||
PCT/US2007/008599 WO2007120576A2 (en) | 2006-04-13 | 2007-04-04 | Capacitive micro- electro-mechanical sensors with single crystal silicon electrodes |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101449347A true CN101449347A (zh) | 2009-06-03 |
CN101449347B CN101449347B (zh) | 2013-07-17 |
Family
ID=38610099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007800178712A Active CN101449347B (zh) | 2006-04-13 | 2007-04-04 | 具有单晶硅电极的电容性微机电传感器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7539003B2 (zh) |
EP (1) | EP2011132B1 (zh) |
JP (3) | JP5331678B2 (zh) |
CN (1) | CN101449347B (zh) |
WO (1) | WO2007120576A2 (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103552980A (zh) * | 2013-11-15 | 2014-02-05 | 安徽北方芯动联科微系统技术有限公司 | Mems芯片圆片级封装方法及其单片超小型mems芯片 |
CN104101367A (zh) * | 2013-04-09 | 2014-10-15 | 霍尼韦尔国际公司 | 具有隔离隔膜的传感器 |
CN105084296A (zh) * | 2014-04-25 | 2015-11-25 | 无锡华润上华半导体有限公司 | Mems电容式压力传感器的制作方法 |
CN105980293A (zh) * | 2014-02-25 | 2016-09-28 | 诺思罗普·格鲁曼·利特夫有限责任公司 | 用于制造构件的方法和构件 |
CN106030315A (zh) * | 2014-02-26 | 2016-10-12 | 株式会社村田制作所 | 具有框的微机电结构 |
CN108051134A (zh) * | 2017-11-23 | 2018-05-18 | 胡波 | 闭环工作方式的电容式压力传感器 |
CN108680138A (zh) * | 2018-05-09 | 2018-10-19 | 中交第公路勘察设计研究院有限公司 | 软土地基路基大变形沉降自动监测系统及其方法 |
CN109724744A (zh) * | 2013-11-06 | 2019-05-07 | 应美盛股份有限公司 | 压力传感器 |
Families Citing this family (44)
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US7741964B2 (en) * | 2007-05-31 | 2010-06-22 | Schrader Electronics Ltd. | Tire pressure detector having reduced power consumption mechanism |
JP5260155B2 (ja) * | 2008-06-16 | 2013-08-14 | 株式会社堀場エステック | 静電容量型圧力センサ及びその製造方法 |
US8238073B2 (en) * | 2008-07-18 | 2012-08-07 | Synaptics, Inc. | In-molded capacitive sensors |
US8499629B2 (en) * | 2008-10-10 | 2013-08-06 | Honeywell International Inc. | Mounting system for torsional suspension of a MEMS device |
ITBO20080079U1 (it) * | 2008-10-30 | 2010-04-30 | Lorenzo Peretto | Sistema costruttivo per un sensore capacitivo. |
US8710599B2 (en) * | 2009-08-04 | 2014-04-29 | Fairchild Semiconductor Corporation | Micromachined devices and fabricating the same |
US8421168B2 (en) * | 2009-11-17 | 2013-04-16 | Fairchild Semiconductor Corporation | Microelectromechanical systems microphone packaging systems |
US8490495B2 (en) | 2010-05-05 | 2013-07-23 | Consensic, Inc. | Capacitive pressure sensor with vertical electrical feedthroughs and method to make the same |
KR101443730B1 (ko) | 2010-09-18 | 2014-09-23 | 페어차일드 세미컨덕터 코포레이션 | 미세기계화 다이, 및 직교 오차가 작은 서스펜션을 제조하는 방법 |
EP2616771B8 (en) | 2010-09-18 | 2018-12-19 | Fairchild Semiconductor Corporation | Micromachined monolithic 6-axis inertial sensor |
KR101779998B1 (ko) | 2010-09-18 | 2017-09-19 | 페어차일드 세미컨덕터 코포레이션 | 단일 구동 모드를 가진 미세기계화 모노리식 3축 자이로스코프 |
US9156673B2 (en) | 2010-09-18 | 2015-10-13 | Fairchild Semiconductor Corporation | Packaging to reduce stress on microelectromechanical systems |
US9278845B2 (en) | 2010-09-18 | 2016-03-08 | Fairchild Semiconductor Corporation | MEMS multi-axis gyroscope Z-axis electrode structure |
US9095072B2 (en) | 2010-09-18 | 2015-07-28 | Fairchild Semiconductor Corporation | Multi-die MEMS package |
CN103209922B (zh) | 2010-09-20 | 2014-09-17 | 快捷半导体公司 | 具有减小的并联电容的硅通孔 |
CN103221795B (zh) | 2010-09-20 | 2015-03-11 | 快捷半导体公司 | 包括参考电容器的微机电压力传感器 |
JP5649474B2 (ja) * | 2011-01-26 | 2015-01-07 | ローム株式会社 | 静電容量型圧力センサおよび静電容量型圧力センサの製造方法 |
US8673756B2 (en) * | 2011-04-14 | 2014-03-18 | Robert Bosch Gmbh | Out-of-plane spacer defined electrode |
CN103733304B (zh) * | 2011-06-29 | 2016-08-17 | 因文森斯公司 | 其中一部分暴露在环境下并且带有竖直集成电子器件的气密封mems设备 |
US9062972B2 (en) | 2012-01-31 | 2015-06-23 | Fairchild Semiconductor Corporation | MEMS multi-axis accelerometer electrode structure |
US8978475B2 (en) | 2012-02-01 | 2015-03-17 | Fairchild Semiconductor Corporation | MEMS proof mass with split z-axis portions |
US8714021B2 (en) | 2012-02-27 | 2014-05-06 | Amphenol Thermometrics, Inc. | Catheter die and method of fabricating the same |
US8857264B2 (en) | 2012-03-30 | 2014-10-14 | Amphenol Thermometrics, Inc. | Catheter die |
US8754694B2 (en) | 2012-04-03 | 2014-06-17 | Fairchild Semiconductor Corporation | Accurate ninety-degree phase shifter |
US8742964B2 (en) | 2012-04-04 | 2014-06-03 | Fairchild Semiconductor Corporation | Noise reduction method with chopping for a merged MEMS accelerometer sensor |
US9488693B2 (en) | 2012-04-04 | 2016-11-08 | Fairchild Semiconductor Corporation | Self test of MEMS accelerometer with ASICS integrated capacitors |
KR102058489B1 (ko) | 2012-04-05 | 2019-12-23 | 페어차일드 세미컨덕터 코포레이션 | 멤스 장치 프론트 엔드 전하 증폭기 |
US9069006B2 (en) | 2012-04-05 | 2015-06-30 | Fairchild Semiconductor Corporation | Self test of MEMS gyroscope with ASICs integrated capacitors |
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US9625272B2 (en) | 2012-04-12 | 2017-04-18 | Fairchild Semiconductor Corporation | MEMS quadrature cancellation and signal demodulation |
US9094027B2 (en) | 2012-04-12 | 2015-07-28 | Fairchild Semiconductor Corporation | Micro-electro-mechanical-system (MEMS) driver |
DE102013014881B4 (de) | 2012-09-12 | 2023-05-04 | Fairchild Semiconductor Corporation | Verbesserte Silizium-Durchkontaktierung mit einer Füllung aus mehreren Materialien |
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CN104101367A (zh) * | 2013-04-09 | 2014-10-15 | 霍尼韦尔国际公司 | 具有隔离隔膜的传感器 |
CN104101367B (zh) * | 2013-04-09 | 2018-07-24 | 霍尼韦尔国际公司 | 具有隔离隔膜的传感器 |
CN109724744A (zh) * | 2013-11-06 | 2019-05-07 | 应美盛股份有限公司 | 压力传感器 |
CN103552980A (zh) * | 2013-11-15 | 2014-02-05 | 安徽北方芯动联科微系统技术有限公司 | Mems芯片圆片级封装方法及其单片超小型mems芯片 |
CN105980293A (zh) * | 2014-02-25 | 2016-09-28 | 诺思罗普·格鲁曼·利特夫有限责任公司 | 用于制造构件的方法和构件 |
CN105980293B (zh) * | 2014-02-25 | 2019-01-04 | 诺思罗普·格鲁曼·利特夫有限责任公司 | 用于制造构件的方法和构件 |
CN106030315A (zh) * | 2014-02-26 | 2016-10-12 | 株式会社村田制作所 | 具有框的微机电结构 |
CN106030315B (zh) * | 2014-02-26 | 2020-06-09 | 株式会社村田制作所 | 具有框的微机电结构 |
CN105084296A (zh) * | 2014-04-25 | 2015-11-25 | 无锡华润上华半导体有限公司 | Mems电容式压力传感器的制作方法 |
CN105084296B (zh) * | 2014-04-25 | 2017-02-08 | 无锡华润上华半导体有限公司 | Mems电容式压力传感器的制作方法 |
CN108051134A (zh) * | 2017-11-23 | 2018-05-18 | 胡波 | 闭环工作方式的电容式压力传感器 |
CN108680138A (zh) * | 2018-05-09 | 2018-10-19 | 中交第公路勘察设计研究院有限公司 | 软土地基路基大变形沉降自动监测系统及其方法 |
Also Published As
Publication number | Publication date |
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EP2011132A4 (en) | 2014-07-16 |
JP5331678B2 (ja) | 2013-10-30 |
JP5956644B2 (ja) | 2016-07-27 |
JP5806254B2 (ja) | 2015-11-10 |
US20070279832A1 (en) | 2007-12-06 |
US7539003B2 (en) | 2009-05-26 |
CN101449347B (zh) | 2013-07-17 |
WO2007120576A2 (en) | 2007-10-25 |
JP2009533866A (ja) | 2009-09-17 |
WO2007120576A3 (en) | 2008-10-30 |
EP2011132B1 (en) | 2016-06-29 |
EP2011132A2 (en) | 2009-01-07 |
JP2015180521A (ja) | 2015-10-15 |
JP2013198979A (ja) | 2013-10-03 |
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