CN101445714B - 聚氨酯-酰亚胺树脂、粘合剂组合物及电路连接用粘合剂组合物 - Google Patents

聚氨酯-酰亚胺树脂、粘合剂组合物及电路连接用粘合剂组合物 Download PDF

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Publication number
CN101445714B
CN101445714B CN2009100016085A CN200910001608A CN101445714B CN 101445714 B CN101445714 B CN 101445714B CN 2009100016085 A CN2009100016085 A CN 2009100016085A CN 200910001608 A CN200910001608 A CN 200910001608A CN 101445714 B CN101445714 B CN 101445714B
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CN
China
Prior art keywords
resin
polyurethane
imide
binder composition
imide resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009100016085A
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English (en)
Chinese (zh)
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CN101445714A (zh
Inventor
杉浦实
汤佐正己
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Resonac Corp
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Hitachi Chemical Co Ltd
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Publication date
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Publication of CN101445714A publication Critical patent/CN101445714A/zh
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Publication of CN101445714B publication Critical patent/CN101445714B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/001Conductive additives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
CN2009100016085A 2004-01-08 2005-01-06 聚氨酯-酰亚胺树脂、粘合剂组合物及电路连接用粘合剂组合物 Expired - Fee Related CN101445714B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2004002923 2004-01-08
JP2004002923 2004-01-08
JP2004002922 2004-01-08
JP2004-002922 2004-01-08
JP2004-002923 2004-01-08
JP2004002922 2004-01-08

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2005100001931A Division CN1637034B (zh) 2004-01-08 2005-01-06 聚氨酯-酰亚胺树脂、粘合剂组合物及电路连接用粘合剂组合物

Publications (2)

Publication Number Publication Date
CN101445714A CN101445714A (zh) 2009-06-03
CN101445714B true CN101445714B (zh) 2013-03-20

Family

ID=34889283

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2009100016085A Expired - Fee Related CN101445714B (zh) 2004-01-08 2005-01-06 聚氨酯-酰亚胺树脂、粘合剂组合物及电路连接用粘合剂组合物
CN2005100001931A Expired - Fee Related CN1637034B (zh) 2004-01-08 2005-01-06 聚氨酯-酰亚胺树脂、粘合剂组合物及电路连接用粘合剂组合物

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2005100001931A Expired - Fee Related CN1637034B (zh) 2004-01-08 2005-01-06 聚氨酯-酰亚胺树脂、粘合剂组合物及电路连接用粘合剂组合物

Country Status (3)

Country Link
KR (2) KR100792056B1 (https=)
CN (2) CN101445714B (https=)
TW (2) TW200526710A (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2053108A4 (en) * 2006-08-04 2012-12-12 Hitachi Chemical Co Ltd FILM ADHESIVE, ADHESIVE FOIL AND MACHINE SEMI-FINISHING DEVICE
US20100243303A1 (en) * 2006-08-22 2010-09-30 Hitachi Chemical Company, Ltd. Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member
US8212370B2 (en) 2006-10-04 2012-07-03 Hitachi Chemical Company, Ltd. Resin paste for die bonding, containing a polyurethaneimide resin and thermosetting resin method for manufacturing semiconductor device, and semiconductor device, using the resin paste
JP5642961B2 (ja) * 2007-04-19 2014-12-17 株式会社カネカ 新規なポリイミド前駆体組成物及びその利用
CN101121101B (zh) * 2007-07-06 2010-06-02 清华大学 聚氨酯酰亚胺渗透汽化芳烃/烷烃分离膜的制备方法
CN102549074B (zh) * 2009-10-07 2015-11-25 日立化成株式会社 热固性树脂组合物、形成柔性配线板的保护膜的方法以及柔性配线板
TWI510521B (zh) * 2013-01-21 2015-12-01 Daxin Materials Corp 聚亞醯胺結構以及聚亞醯胺樹脂組成物
CN104031241A (zh) * 2013-03-09 2014-09-10 东莞市长安东阳光铝业研发有限公司 一种有机硅改性聚氨酯-酰亚胺材料的制备方法及其应用
JP6069153B2 (ja) * 2013-09-27 2017-02-01 デクセリアルズ株式会社 アンダーフィル材、及びこれを用いた半導体装置の製造方法
JP6578100B2 (ja) * 2014-12-25 2019-09-18 日東シンコー株式会社 絶縁紙
CN105097068B (zh) * 2015-06-25 2017-03-08 英利能源(中国)有限公司 导电胶、太阳能电池串及其制备方法
CN112789317B (zh) * 2018-10-02 2023-03-10 纳美仕有限公司 树脂组合物、带有基材的膜、金属/树脂层压体及半导体装置
CN110041212B (zh) * 2019-05-21 2020-10-02 吉林大学 一种含氟多胺单体及其制备方法、一种聚酰亚胺及其制备方法和一种聚酰亚胺膜
CN110373026B (zh) * 2019-09-02 2021-06-29 无锡创彩光学材料有限公司 聚酰亚胺树脂组合物及其制备方法和薄膜
KR102800340B1 (ko) * 2023-10-19 2025-04-23 김형승 내열성과 저온 접착성이 우수한 (메타)아크릴레이트 말단의 폴리우레탄이미드(아미드) 공중합체를 포함하는 회로접속용 접착수지

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6121553A (en) * 1997-03-03 2000-09-19 Hitachi Chemical Company, Ltd. Circuit boards using heat resistant resin for adhesive layers
CN1313023A (zh) * 1998-07-08 2001-09-12 欧洲原子能研究组织 热控制器件以及制造这种器件的方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4929358A (en) * 1989-08-09 1990-05-29 Exxon Research And Engineering Company Polyurethane-imide membranes and their use for the separation of aromatics from non-aromatics
US5098982A (en) * 1989-10-10 1992-03-24 The B. F. Goodrich Company Radiation curable thermoplastic polyurethanes
US4962271A (en) * 1989-12-19 1990-10-09 Exxon Research And Engineering Company Selective separation of multi-ring aromatic hydrocarbons from distillates by perstraction
JPH0523558A (ja) * 1989-12-19 1993-02-02 Exxon Res & Eng Co 支持薄層膜の製造
US5254659A (en) * 1990-03-27 1993-10-19 Hitachi, Ltd. Insulating coating composition, solderable insulated wires, production process of the insulated wires and flyback transformers using the insulated wires
KR970006896B1 (ko) * 1993-11-10 1997-04-30 생산기술연구원 내열성 폴리(우레탄-이미드)수지 및 그 제조방법
US6403753B1 (en) * 2000-01-18 2002-06-11 Sandia Corporation Method of making thermally removable polyurethanes
KR100545255B1 (ko) * 2003-04-29 2006-01-24 (주)애드뷰 전도성 고분자를 포함하는 액정 배향제 조성물, 이를이용한 액정 배향막, 그 제조방법 및 상기 액정 배향막을포함하는 액정 소자
JP2006241174A (ja) * 2005-02-07 2006-09-14 Hitachi Chem Co Ltd ダイボンディング用フィルム状接着剤及びこれを用いた接着シート、並びに半導体装置。

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6121553A (en) * 1997-03-03 2000-09-19 Hitachi Chemical Company, Ltd. Circuit boards using heat resistant resin for adhesive layers
CN1313023A (zh) * 1998-07-08 2001-09-12 欧洲原子能研究组织 热控制器件以及制造这种器件的方法

Also Published As

Publication number Publication date
CN1637034A (zh) 2005-07-13
CN101445714A (zh) 2009-06-03
TW200848483A (en) 2008-12-16
KR100792056B1 (ko) 2008-01-04
TWI314567B (https=) 2009-09-11
KR20070077201A (ko) 2007-07-25
KR20050073528A (ko) 2005-07-14
TW200526710A (en) 2005-08-16
CN1637034B (zh) 2010-04-28
KR100860892B1 (ko) 2008-09-29

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: HITACHI CHEMICAL CO., LTD.

Free format text: FORMER NAME: HITACHI CHEMICAL CO. LTD.

CP03 Change of name, title or address

Address after: Japan Tokyo Chiyoda Marunouchi yidingmu 9 No. 2

Patentee after: Hitachi Chemical Co., Ltd.

Address before: Tokyo, Japan, Japan

Patentee before: Hitachi Chemical Co., Ltd.

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130320

Termination date: 20140106