CN101410340A - 具有低透气性的密封剂组合物 - Google Patents
具有低透气性的密封剂组合物 Download PDFInfo
- Publication number
- CN101410340A CN101410340A CN200780010461.5A CN200780010461A CN101410340A CN 101410340 A CN101410340 A CN 101410340A CN 200780010461 A CN200780010461 A CN 200780010461A CN 101410340 A CN101410340 A CN 101410340A
- Authority
- CN
- China
- Prior art keywords
- composition
- tin
- acid
- curable
- moisture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 96
- 230000035699 permeability Effects 0.000 title abstract description 5
- 239000000565 sealant Substances 0.000 title description 6
- 229920005989 resin Polymers 0.000 claims abstract description 48
- 239000011347 resin Substances 0.000 claims abstract description 48
- -1 UV stablizer Substances 0.000 claims description 55
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 43
- 238000006243 chemical reaction Methods 0.000 claims description 23
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 21
- 239000000126 substance Substances 0.000 claims description 21
- 239000004927 clay Substances 0.000 claims description 20
- 229910052570 clay Inorganic materials 0.000 claims description 19
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 18
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 17
- 239000000945 filler Substances 0.000 claims description 17
- 239000003795 chemical substances by application Substances 0.000 claims description 16
- 238000009423 ventilation Methods 0.000 claims description 15
- 229920000570 polyether Polymers 0.000 claims description 13
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 12
- BUZRAOJSFRKWPD-UHFFFAOYSA-N isocyanatosilane Chemical compound [SiH3]N=C=O BUZRAOJSFRKWPD-UHFFFAOYSA-N 0.000 claims description 11
- 229920000092 linear low density polyethylene Polymers 0.000 claims description 11
- 239000004707 linear low-density polyethylene Substances 0.000 claims description 11
- 238000002360 preparation method Methods 0.000 claims description 11
- 229910000077 silane Inorganic materials 0.000 claims description 11
- 125000004432 carbon atom Chemical group C* 0.000 claims description 10
- 229920001903 high density polyethylene Polymers 0.000 claims description 10
- 239000004700 high-density polyethylene Substances 0.000 claims description 10
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 9
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 8
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 claims description 8
- 125000000217 alkyl group Chemical group 0.000 claims description 7
- 125000003118 aryl group Chemical group 0.000 claims description 7
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 claims description 7
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052900 illite Inorganic materials 0.000 claims description 6
- 150000002500 ions Chemical class 0.000 claims description 6
- 238000012986 modification Methods 0.000 claims description 6
- 229910052901 montmorillonite Inorganic materials 0.000 claims description 6
- VGIBGUSAECPPNB-UHFFFAOYSA-L nonaaluminum;magnesium;tripotassium;1,3-dioxido-2,4,5-trioxa-1,3-disilabicyclo[1.1.1]pentane;iron(2+);oxygen(2-);fluoride;hydroxide Chemical compound [OH-].[O-2].[O-2].[O-2].[O-2].[O-2].[F-].[Mg+2].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[K+].[K+].[K+].[Fe+2].O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2 VGIBGUSAECPPNB-UHFFFAOYSA-L 0.000 claims description 6
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- KUQVFOOAIOMQOT-UHFFFAOYSA-N 2-methylpropyltin Chemical compound CC(C)C[Sn] KUQVFOOAIOMQOT-UHFFFAOYSA-N 0.000 claims description 5
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 claims description 5
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims description 5
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical group CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 5
- 125000005210 alkyl ammonium group Chemical group 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 5
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims description 5
- 239000012975 dibutyltin dilaurate Substances 0.000 claims description 5
- 230000004048 modification Effects 0.000 claims description 5
- 229920000728 polyester Polymers 0.000 claims description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 5
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 5
- 235000012239 silicon dioxide Nutrition 0.000 claims description 5
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 claims description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 4
- 229920000181 Ethylene propylene rubber Polymers 0.000 claims description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 4
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 4
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 4
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 4
- 239000013543 active substance Substances 0.000 claims description 4
- 125000001931 aliphatic group Chemical group 0.000 claims description 4
- 239000003963 antioxidant agent Substances 0.000 claims description 4
- 230000003078 antioxidant effect Effects 0.000 claims description 4
- 230000003115 biocidal effect Effects 0.000 claims description 4
- 239000003139 biocide Substances 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 239000000975 dye Substances 0.000 claims description 4
- XMHIUKTWLZUKEX-UHFFFAOYSA-N hexacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O XMHIUKTWLZUKEX-UHFFFAOYSA-N 0.000 claims description 4
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 235000012204 lemonade/lime carbonate Nutrition 0.000 claims description 4
- 239000011777 magnesium Substances 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- 239000010445 mica Substances 0.000 claims description 4
- 229910052618 mica group Inorganic materials 0.000 claims description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000049 pigment Substances 0.000 claims description 4
- 239000004800 polyvinyl chloride Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 4
- 150000003568 thioethers Chemical class 0.000 claims description 4
- 239000013008 thixotropic agent Substances 0.000 claims description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 4
- 229910001887 tin oxide Inorganic materials 0.000 claims description 4
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(ii) oxide Chemical class [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 claims description 4
- URXZKGGRKRRVDC-UHFFFAOYSA-N 1-[dimethoxy(propyl)silyl]oxyethanamine Chemical compound CCC[Si](OC)(OC)OC(C)N URXZKGGRKRRVDC-UHFFFAOYSA-N 0.000 claims description 3
- OQURWGJAWSLGQG-UHFFFAOYSA-N 1-isocyanatopropane Chemical compound CCCN=C=O OQURWGJAWSLGQG-UHFFFAOYSA-N 0.000 claims description 3
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 claims description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 3
- 229920001730 Moisture cure polyurethane Polymers 0.000 claims description 3
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 3
- 239000004697 Polyetherimide Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229920002367 Polyisobutene Polymers 0.000 claims description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 3
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052791 calcium Inorganic materials 0.000 claims description 3
- 239000011575 calcium Substances 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 3
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 3
- GCHSKZYGFZYKBO-UHFFFAOYSA-N methoxycarbonyl(phenyl)tin Chemical compound COC(=O)[Sn]C1=CC=CC=C1 GCHSKZYGFZYKBO-UHFFFAOYSA-N 0.000 claims description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 3
- 235000006408 oxalic acid Nutrition 0.000 claims description 3
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 229920002530 polyetherether ketone Polymers 0.000 claims description 3
- 229920001601 polyetherimide Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 3
- 239000011118 polyvinyl acetate Substances 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 3
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims description 3
- 229910052623 talc Inorganic materials 0.000 claims description 3
- 239000000454 talc Substances 0.000 claims description 3
- 235000012222 talc Nutrition 0.000 claims description 3
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 claims description 3
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 claims description 2
- QMTFKWDCWOTPGJ-KVVVOXFISA-N (z)-octadec-9-enoic acid;tin Chemical compound [Sn].CCCCCCCC\C=C/CCCCCCCC(O)=O QMTFKWDCWOTPGJ-KVVVOXFISA-N 0.000 claims description 2
- OQOGEOLRYAOSKO-UHFFFAOYSA-N 1,1-dichloro-1-nitroethane Chemical compound CC(Cl)(Cl)[N+]([O-])=O OQOGEOLRYAOSKO-UHFFFAOYSA-N 0.000 claims description 2
- KIJDMKUPUUYDLN-UHFFFAOYSA-N 2,2-dimethyl-4-trimethoxysilylbutan-1-amine Chemical compound CO[Si](OC)(OC)CCC(C)(C)CN KIJDMKUPUUYDLN-UHFFFAOYSA-N 0.000 claims description 2
- ZEMPKEQAKRGZGQ-AAKVHIHISA-N 2,3-bis[[(z)-12-hydroxyoctadec-9-enoyl]oxy]propyl (z)-12-hydroxyoctadec-9-enoate Chemical compound CCCCCCC(O)C\C=C/CCCCCCCC(=O)OCC(OC(=O)CCCCCCC\C=C/CC(O)CCCCCC)COC(=O)CCCCCCC\C=C/CC(O)CCCCCC ZEMPKEQAKRGZGQ-AAKVHIHISA-N 0.000 claims description 2
- OVSKIKFHRZPJSS-UHFFFAOYSA-N 2,4-D Chemical compound OC(=O)COC1=CC=C(Cl)C=C1Cl OVSKIKFHRZPJSS-UHFFFAOYSA-N 0.000 claims description 2
- BXGYYDRIMBPOMN-UHFFFAOYSA-N 2-(hydroxymethoxy)ethoxymethanol Chemical compound OCOCCOCO BXGYYDRIMBPOMN-UHFFFAOYSA-N 0.000 claims description 2
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 claims description 2
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 claims description 2
- HNNQYHFROJDYHQ-UHFFFAOYSA-N 3-(4-ethylcyclohexyl)propanoic acid 3-(3-ethylcyclopentyl)propanoic acid Chemical compound CCC1CCC(CCC(O)=O)C1.CCC1CCC(CCC(O)=O)CC1 HNNQYHFROJDYHQ-UHFFFAOYSA-N 0.000 claims description 2
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 claims description 2
- KVUMYOWDFZAGPN-UHFFFAOYSA-N 3-trimethoxysilylpropanenitrile Chemical compound CO[Si](OC)(OC)CCC#N KVUMYOWDFZAGPN-UHFFFAOYSA-N 0.000 claims description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 2
- YPIFGDQKSSMYHQ-UHFFFAOYSA-N 7,7-dimethyloctanoic acid Chemical compound CC(C)(C)CCCCCC(O)=O YPIFGDQKSSMYHQ-UHFFFAOYSA-N 0.000 claims description 2
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 claims description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 2
- XSMLRKWNCXBONL-UHFFFAOYSA-N C(C)[Si](OC)(OC)OC.[O] Chemical compound C(C)[Si](OC)(OC)OC.[O] XSMLRKWNCXBONL-UHFFFAOYSA-N 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims description 2
- 239000004258 Ethoxyquin Substances 0.000 claims description 2
- 239000004812 Fluorinated ethylene propylene Substances 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 241000353097 Molva molva Species 0.000 claims description 2
- 229920001207 Noryl Polymers 0.000 claims description 2
- 239000004727 Noryl Substances 0.000 claims description 2
- 239000005642 Oleic acid Substances 0.000 claims description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 claims description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 2
- 239000004695 Polyether sulfone Substances 0.000 claims description 2
- 239000004793 Polystyrene Substances 0.000 claims description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 claims description 2
- 235000021355 Stearic acid Nutrition 0.000 claims description 2
- 229920000147 Styrene maleic anhydride Polymers 0.000 claims description 2
- 125000003342 alkenyl group Chemical group 0.000 claims description 2
- 150000004645 aluminates Chemical class 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 2
- HPTYUNKZVDYXLP-UHFFFAOYSA-N aluminum;trihydroxy(trihydroxysilyloxy)silane;hydrate Chemical compound O.[Al].[Al].O[Si](O)(O)O[Si](O)(O)O HPTYUNKZVDYXLP-UHFFFAOYSA-N 0.000 claims description 2
- 150000001408 amides Chemical class 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 claims description 2
- SCRYTJBWFYOLEF-UHFFFAOYSA-N butanoic acid;tin Chemical compound [Sn].CCCC(O)=O SCRYTJBWFYOLEF-UHFFFAOYSA-N 0.000 claims description 2
- VNSBYDPZHCQWNB-UHFFFAOYSA-N calcium;aluminum;dioxido(oxo)silane;sodium;hydrate Chemical compound O.[Na].[Al].[Ca+2].[O-][Si]([O-])=O VNSBYDPZHCQWNB-UHFFFAOYSA-N 0.000 claims description 2
- 239000006229 carbon black Substances 0.000 claims description 2
- 229920006217 cellulose acetate butyrate Polymers 0.000 claims description 2
- 239000013078 crystal Substances 0.000 claims description 2
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 claims description 2
- YQGOWXYZDLJBFL-UHFFFAOYSA-N dimethoxysilane Chemical compound CO[SiH2]OC YQGOWXYZDLJBFL-UHFFFAOYSA-N 0.000 claims description 2
- HGQSXVKHVMGQRG-UHFFFAOYSA-N dioctyltin Chemical compound CCCCCCCC[Sn]CCCCCCCC HGQSXVKHVMGQRG-UHFFFAOYSA-N 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 claims description 2
- CCGKOQOJPYTBIH-UHFFFAOYSA-N ethenone Chemical compound C=C=O CCGKOQOJPYTBIH-UHFFFAOYSA-N 0.000 claims description 2
- DECIPOUIJURFOJ-UHFFFAOYSA-N ethoxyquin Chemical compound N1C(C)(C)C=C(C)C2=CC(OCC)=CC=C21 DECIPOUIJURFOJ-UHFFFAOYSA-N 0.000 claims description 2
- 229940093500 ethoxyquin Drugs 0.000 claims description 2
- 235000019285 ethoxyquin Nutrition 0.000 claims description 2
- HTSRFYSEWIPFNI-UHFFFAOYSA-N ethyl-dimethoxy-methylsilane Chemical compound CC[Si](C)(OC)OC HTSRFYSEWIPFNI-UHFFFAOYSA-N 0.000 claims description 2
- 229910021485 fumed silica Inorganic materials 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 238000000227 grinding Methods 0.000 claims description 2
- 229910052621 halloysite Inorganic materials 0.000 claims description 2
- 229910000271 hectorite Inorganic materials 0.000 claims description 2
- KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 claims description 2
- 229910001701 hydrotalcite Inorganic materials 0.000 claims description 2
- 229960001545 hydrotalcite Drugs 0.000 claims description 2
- 229920000554 ionomer Polymers 0.000 claims description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 claims description 2
- 229910052622 kaolinite Inorganic materials 0.000 claims description 2
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical group CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 claims description 2
- FRDNYWXDODPUJV-UHFFFAOYSA-N n-ethyl-2-methyl-3-trimethoxysilylpropan-1-amine Chemical compound CCNCC(C)C[Si](OC)(OC)OC FRDNYWXDODPUJV-UHFFFAOYSA-N 0.000 claims description 2
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- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 2
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4825—Polyethers containing two hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/005—Reinforced macromolecular compounds with nanosized materials, e.g. nanoparticles, nanofibres, nanotubes, nanowires, nanorods or nanolayered materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C08L101/10—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2190/00—Compositions for sealing or packing joints
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2300/00—Characterised by the use of unspecified polymers
- C08J2300/10—Polymers characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C08J2300/108—Polymers characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
- C08J2375/04—Polyurethanes
Landscapes
- Chemical & Material Sciences (AREA)
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Abstract
本发明涉及一种包括可湿固化的甲硅烷基化树脂的组合物，特别包括可湿固化的甲硅烷基化树脂，所述经固化的组合物显示出低的透气性。
Description
发明领域
本发明涉及具有低透气性的含可湿固化的甲硅烷基化树脂的组合物和使用这些组合物的方法。该组合物尤其非常适合于在窗户领域中用作隔热玻璃密封剂和适合于诸如涂料、粘合剂和垫圈之类的应用中。
发明背景
室温可固化的组合物因其作为密封剂的用途而广为人知。在隔热玻璃单元(IGU)的制造中，例如将玻璃板彼此平行地放置并在周边密封，使得板之间的空间或者内部空间被完全密闭。内部空间通常用导热率低的气体或气体混合物充注。
当前可室温固化的(RTC)有机硅密封剂虽然在一定程度上有效，但仍仅具有有限的能力来防止导热率低的气体(如氩气)从IGU的内部空间损失。随着时间的过去，气体将逸出，使IGU的隔热效率降至零点(varnishing point)。
因此，需要一种与已知的RTC组合物相比具有降低的透气性的RTC组合物。当用作IGU的密封剂时，与更透气的RTC组合物相比，具有降低的透气性的RTC组合物将更长时间地保持IGU的面板内的隔热气体，因此在较长时间内延长IGU的隔热性能。
发明概述
本发明基于下述发现：含可湿固化的甲硅烷基化树脂的组合物与至少一种其他聚合物组合，在固化后显示出降低的透气性，该至少一种其他聚合物的透气性比已固化树脂的透气性低。所述组合物特别适合用作气体阻挡性能高以及柔软度、加工性能和弹性的所需特性为重要性能标准的密封剂。
根据本发明，提供一种含可湿固化的甲硅烷基化树脂的组合物，它包括：
a)可湿固化的甲硅烷基化树脂，在固化后，提供显示透气性的经固化的树脂；
b)透气性小于经固化的树脂(a)的透气性的至少一种其他聚合物；和任选的
c)至少一种其他组分，选自催化剂、助粘剂、填料、表面活性剂、UV稳定剂、抗氧化剂、固化加速剂、触变剂、除湿剂、颜料、染料、溶剂和生物杀灭剂。
当前述组合物例如在IGU的制备中用作气体阻挡物时，将减少气体的损失，从而延长使用其的制品的使用寿命。
发明详述
根据本发明，本发明的含可湿固化的甲硅烷基化树脂的组合物是树脂类(resinous)组合物，它包括：a)可湿固化的甲硅烷基化树脂，在固化后，提供显示低透气性的固化的树脂，即，水解并随后交联的甲硅烷基化聚氨酯(SPUR)树脂；b)透气性小于经固化的树脂(a)的透气性的至少一种其他聚合物，a)和b)形成均匀混合物；和任选的c)至少一种其他组分，选自催化剂、助粘剂、填料、表面活性剂、UV稳定剂、抗氧化剂、固化加速剂、触变剂、除湿剂、颜料、染料、溶剂和生物杀灭剂。
本发明的组合物可用于制备密封剂、涂料、粘合剂、垫圈和类似物，且尤其适合在预计用于隔热玻璃单元的密封剂中使用。
可用于本发明的可湿固化的甲硅烷基化树脂(a)为已知的材料，且通常通过以下方法制得：(i)异氰酸酯封端的聚氨酯(PUR)预聚物与合适的硅烷例如具有可水解的官能团(例如烷氧基等)和含活性氢的官能团(例如硫醇、伯胺和仲胺(优选后者)等)的硅烷反应，或(ii)羟基封端的PUR预聚物与合适的异氰酸酯封端的硅烷(例如具有1-3个烷氧基的硅烷)反应。使用的这些反应的细节以及制备异氰酸酯封端的和羟基封端的PUR预聚物的细节可在以下文献中找到：美国专利4,985,491、5,919,888、6,207,794、6,303,731、6,359,101和6,515,164以及公开的美国专利申请2004/0122253和2005/0020706(异氰酸酯封端的PUR预聚物)；美国专利3,786,081和4,481,367(羟基封端的PUR预聚物)；美国专利3,627,722、3,632,557、3,971,751、5,623,044、5,852,137、6,197,912和6,310,170(得自异氰酸酯封端的PUR预聚物与反应性硅烷例如氨基烷氧基硅烷反应的可湿固化的SPUR)；和美国专利4,345,053、4,625,012、6,833,423和公开的美国专利申请2002/0198352(得自羟基封端的PUR预聚物与异氰酸基硅烷反应的可湿固化的SPUR)。以上美国专利文献的全部内容通过参考并入本申请。
本发明的可湿固化的甲硅烷基化树脂(a)还可通过(iii)异氰酸基硅烷直接与多元醇反应制得。
(a)得自异氰酸酯封端的PUR预聚物的可湿固化的SPUR树脂
异氰酸酯封端的PUR预聚物通过一种或多种多元醇(优选二醇)与一种或多种多异氰酸酯(优选二异氰酸酯)反应制得，其比例使得所得到的预聚物被异氰酸酯封端。在二醇与二异氰酸酯反应的情况下，使用摩尔过量的二异氰酸酯。
在可用于制备异氰酸酯封端的PUR预聚物的多元醇中包括聚醚多元醇、聚酯多元醇例如羟基封端的聚己内酯(polycaprolatones)、聚醚酯多元醇例如得自聚醚多元醇与ε-己内酯的反应的那些物质、聚酯醚多元醇例如得自羟基封端的聚己内酯与一种或多种氧化烯(例如环氧乙烷和环氧丙烷)的反应的那些物质、羟基封端的聚丁二烯等。
具体的合适的多元醇包括聚醚二醇，具体地，聚(氧乙烯)二醇、聚(氧丙烯)二醇和聚(氧乙烯-氧丙烯)二醇、聚氧化烯三醇、聚丁二醇、聚缩醛、多羟基聚丙烯酸酯、多羟基聚酯酰胺和多羟基聚硫醚、聚己内酯二醇和三醇等。在本发明的一种实施方案中，用于制备异氰酸酯封端的PUR预聚物的多元醇为当量为约500-25,000的聚(氧乙烯)二醇。在本发明的另一实施方案中，用于制备异氰酸酯封端的PUR预聚物的多元醇为当量为约1,000-20,000的聚(氧丙烯)二醇。还可使用各种结构、分子量和/或官能度的多元醇的混合物。
聚醚多元醇可具有至多约8个官能度，但优选具有约2-4个官能度，更优选具有2个官能度(即，二醇)。特别合适的为在双金属氰化物(DMC)催化剂、碱金属氢氧化物催化剂或碱金属醇盐催化剂存在下制备的聚醚多元醇；例如参见美国专利3,829,505、3,941,849、4,242,490、4,335,188、4,687,851、4,985,491、5,096,993、5,100,997、5,106,874、5,116,931、5,136,010、5,185,420和5,266,681，这些专利的全部内容通过参考并入本申请。在这些催化剂存在下制备的聚醚多元醇往往具有高分子量和低不饱和度，认为这些性质是本发明的反光(retroreflective)制品性能改进的原因。优选聚醚多元醇的数均分子量为约1,000-约25,000，更优选为约2,000-约20,000，甚至更优选为约4,000-约18,000。优选聚醚多元醇的端基不饱和度水平不大于约0.04毫当量/克多元醇。更优选聚醚多元醇的端基不饱和度不大于约0.02毫当量/克多元醇。适用于制备异氰酸酯封端的PUR预聚物的市售可得的二醇的实例包括ARCOL R-1819(数均分子量为8,000)、E-2204(数均分子量为4,000)和ARCOL E-2211(数均分子量为11,000)。
众多多异氰酸酯(优选二异氰酸酯)及其混合物中的任一种可用于制备异氰酸酯封端的PUR预聚物。在一种实施方案中，多异氰酸酯可为二苯基甲烷二异氰酸酯(″MDI″)、聚亚甲基聚苯基异氰酸酯(″PMDI″)、对亚苯基二异氰酸酯、亚萘基二异氰酸酯、液体碳二亚胺改性的MDI及其衍生物、异佛尔酮二异氰酸酯、二环己基甲烷-4，4′-二异氰酸酯、甲苯二异氰酸酯(″TDI″)特别是2，6-TDI异构体以及本领域充分确定的各种其他脂族和芳族多异氰酸酯，及其组合。
与上述异氰酸酯封端的PUR预聚物反应的甲硅烷基化反应物必须含有对异氰酸酯具有活性的官能团和至少一种易水解且随后可交联的基团(例如烷氧基)。具体地，可用的甲硅烷基化反应物为氨基硅烷，特别是具有以下通式的那些物质：
其中R1为氢、具有至多8个碳原子的烷基或环烷基或具有至多8个碳原子的芳基，R2为任选包含一个或多个杂原子的具有至多12个碳原子的亚烷基，各R3为相同或不同的具有至多8个碳原子的烷基或芳基，各R4为相同或不同的具有至多6个碳原子的烷基，且x为0、1或2。在一种实施方案中，R1为氢或甲基、乙基、丙基、异丙基、正丁基、叔丁基、环己基或苯基，R2具有1-4个碳原子，各R4为相同或不同的甲基、乙基、丙基或异丙基，且x为0。
本文使用的具体的氨基硅烷例如包括氨丙基三甲氧基硅烷、氨丙基三乙氧基硅烷、氨基丁基三乙氧基硅烷、N-(2-氨基乙基-3-氨丙基)三乙氧基硅烷、氨基十一烷基三甲氧基硅烷和氨丙基甲基二乙氧基硅烷。其他合适的氨基硅烷包括，但不局限于苯基氨丙基三甲氧基硅烷、甲基氨丙基三甲氧基硅烷、正丁基氨丙基三甲氧基硅烷、叔丁基氨丙基三甲氧基硅烷、环己基氨丙基三甲氧基硅烷、马来酸二丁酯氨丙基三甲氧基硅烷、马来酸二丁酯取代的4-氨基-3，3-二甲基丁基三甲氧基硅烷、N-甲基-3-氨基-2-甲基丙基三甲氧基硅烷、N-乙基-3-氨基-2-甲基丙基三甲氧基硅烷、N-乙基-3-氨基-2-甲基丙基二乙氧基硅烷、N-乙基-3-氨基-2-甲基丙基三乙氧基硅烷、N-乙基-3-氨基-2-甲基丙基甲基二甲氧基硅烷、N-丁基-3-氨基-2-甲基丙基三甲氧基硅烷、3-(N-甲基-3-氨基-1-甲基-1-乙氧基)丙基三甲氧基硅烷、N-乙基-4-氨基-3，3-二甲基丁基二甲氧基甲基硅烷和N-乙基-4-氨基-3，3-二甲基丁基三甲氧基硅烷。
催化剂通常用于制备异氰酸酯封端的PUR预聚物。优选使用缩合催化剂，这是由于缩合催化剂还催化本发明的可固化的组合物的SPUR树脂组分的固化(水解，随后交联)。合适的缩合催化剂包括二烷基锡二羧酸盐例如二月桂酸二丁锡和二乙酸二丁锡、叔胺、羧酸的亚锡盐例如辛酸亚锡和乙酸亚锡等。在本发明的一种实施方案中，二月桂酸二丁锡催化剂用于制备PUR预聚物。其他可用的催化剂包括锆复合物(KAT XC6212、K-KATXC-A209、得自King Industries、Inc.)、铝螯合物(类，得自DuPontcompany；和KR类，得自Kenrich Petrochemical，Inc.)和其他有机金属(例如Zn、Co、Ni和Fe等)。
(b)得自羟基封端的PUR预聚物的可湿固化的SPUR树脂
如前所述，可湿固化的SPUR树脂可通过羟基封端的PUR预聚物与异氰酸基硅烷反应制备。可采用基本相同的方式，使用上述制备异氰酸酯封端的PUR预聚物基本相同的物质即多元醇、多异氰酸酯和任选的催化剂(优选缩合催化剂)制得羟基封端的PUR预聚物，一个主要的区别在于多元醇与多异氰酸酯的比例使得所得到的预聚物被羟基封端。因此，例如在二醇与二异氰酸酯反应的情况下，使用摩尔过量的二醇，从而得到羟基封端的PUR预聚物。
用于羟基封端的SPUR树脂的可用的甲硅烷基化反应物为包含异氰酸酯封端和容易水解的官能团(例如1-3个烷氧基)的那些物质。合适的甲硅烷基化反应物为具有以下通式的异氰酸基硅烷：
其中R5为任选包含一个或多个杂原子的具有至多12个碳原子的亚烷基，各R6为相同或不同的具有至多8个碳原子的烷基或芳基，各R7为相同或不同的具有至多6个碳原子的烷基，且y为0、1或2。在一种实施方案中，R5具有1-4个碳原子，各R7为相同或不同的甲基、乙基、丙基或异丙基，且y为0。
本文中可用于与前述羟基封端的PUR预聚物反应以得到可湿固化的SPUR树脂的具体的异氰酸基硅烷包括异氰酸丙酯基三甲氧基硅烷、异氰酸异丙酯基三甲氧基硅烷、异氰酸正丁酯基三甲氧基硅烷、异氰酸叔丁酯基三甲氧基硅烷、异氰酸丙酯基三乙氧基硅烷、异氰酸异丙酯基三乙氧基硅烷、异氰酸正丁酯基三乙氧基硅烷、异氰酸叔丁酯基三乙氧基硅烷等。
c)得自异氰酸基硅烷直接与多元醇反应的可湿固化的SPUR树脂
本发明的可湿固化的SPUR树脂可得自一种或多种多元醇(优选二醇)与异氰酸基硅烷直接反应，而不先形成聚氨酯预聚物。可用于该方法以制备可湿固化的SPUR树脂的各种材料，即多元醇和硅烷(例如具有可水解的官能团和异氰酸基官能团二者的那些硅烷)如上所述。因此，合适的多元醇包括分子量为约4,000-20,000的羟基封端的多元醇。但是，还可使用各种结构、分子量和/或官能度的多元醇的混合物。用于与前述多元醇反应以提供可湿固化的SPUR树脂的合适的异氰酸基硅烷如上所述。
氨基甲酸酯预聚物的合成和随后的甲硅烷基化反应以及多元醇与异氰酸基硅烷的直接反应在无水条件下进行，并优选在惰性气氛(例如氮气覆盖下)进行，以防止烷氧基硅烷基过早水解。两个反应步骤的典型的温度范围为0℃-150℃，更优选为60℃-90℃。通常，甲硅烷基化聚氨酯合成的总反应时间为4-8小时。
使用标准滴定技术(ASTM 2572-87)或红外分析来鉴测合成。当通过任一种技术不能检测到残余的-NCO时，认为氨基甲酸酯预聚物的甲硅烷基化反应完全。
本发明的有机硅组合物进一步包括对气体或气体混合物的透气性显示出小于可湿固化的甲硅烷基化树脂(a)的透气性的至少一种其他聚合物(b)。合适的聚合物包括聚乙烯类，例如低密度聚乙烯(LDPE)、极低密度聚乙烯(VLDPE)、线型低密度聚乙烯(LLDPE)和高密度聚乙烯(HDPE)；聚丙烯(PP)；聚异丁烯(PIB)、聚乙酸乙烯酯(PVAc)、聚乙烯醇(PVOH)、聚苯乙烯、聚碳酸酯、聚酯，例如聚对苯二甲酸乙二酯(PET)、聚对苯二甲酸丁二酯(PBT)、聚萘二甲酸乙二酯(PEN)、二醇改性的聚对苯二甲酸乙二酯(PETG)；聚氯乙烯(PVC)、聚偏氯乙烯、聚偏氟乙烯、热塑性聚氨酯(TPU)、丙烯腈-丁二烯-苯乙烯共聚物(ABS)、聚甲基丙烯酸甲酯(PMMA)、聚氟乙烯(PVF)、聚酰胺(尼龙)、聚甲基戊烯、聚酰亚胺(PI)、聚醚酰亚胺(PEI)、聚醚醚酮(PEEK)、聚砜、聚醚砜、乙烯-一氯三氟乙烯共聚物、聚四氟乙烯(PTFE)、乙酸纤维素、乙酸丁酸纤维素、塑化聚氯乙烯、离聚物(Surtyn)、聚苯硫醚(PPS)、苯乙烯-马来酸酐共聚物、改性聚苯醚(PPO)，等等，及其混合物。
聚合物(b)本质上也可以是弹性的，实例包括，但不限于，乙丙橡胶(EPDM)、聚丁二烯、聚氯丁二烯、聚异戊二烯、聚氨酯(TPU)、苯乙烯-丁二烯-苯乙烯共聚物(SBS)、苯乙烯-乙烯-丁二烯-苯乙烯共聚物(SEEBS)、聚甲基苯基硅氧烷(PMPS)，等等。
这些聚合物可以单独或者结合或者以共聚物形式共混，例如聚碳酸酯-ABS共混物、聚碳酸酯聚酯共混物、接枝聚合物例如硅烷接枝的聚乙烯和硅烷接枝的聚氨酯。
在本发明的一种实施方案中，聚合物(b)选自：低密度聚乙烯(LDPE)、极低密度聚乙烯(VLDPE)、线型低密度聚乙烯(LLDPE)、高密度聚乙烯(HDPE)，及其混合物。在本发明的另一实施方案中，聚合物(b)选自：低密度聚乙烯(LDPE)、极低密度聚乙烯(VLDPE)、线型低密度聚乙烯(LLDPE)，及其混合物。在本发明的又一实施方案中，聚合物(b)是线型低密度聚乙烯(LLDPE)。
通常用于上述氨基甲酸酯预聚物以及相关的甲硅烷基化聚氨酯(SPUR)的制备的催化剂包括已知可用于促进有机硅密封剂组合物交联的那些物质。所述催化剂可包括金属催化剂和非金属催化剂。用于本发明的金属缩合催化剂的金属部分包括锡、钛、锆、铅、铁、钴、锑、锰、铋和锌化合物。
在本发明的一种实施方案中，用于促进有机硅密封剂组合物交联的锡化合物包括：锡化合物，例如二月桂酸二丁锡、二乙酸二丁锡、二甲醇二丁锡、辛酸锡、三蜡酸异丁锡(isobutyltintriceroate)、二丁锡氧化物、增溶的二丁锡氧化物、双二异辛基邻苯二甲酸二丁锡、双-三丙氧基甲硅烷基二辛基锡、二丁锡双乙酰丙酮、硅烷化二丁锡二氧化物、三-辛二酸甲酯基苯基锡(carbomethoxyphenyl tin tris-uberate)、三蜡酸异丁锡(isobutyltin triceroate)、二丁酸二甲锡、二新癸酸二甲锡、酒石酸三乙锡、二苯甲酸二丁锡、油酸锡、环烷酸锡、三-2-乙基己基己酸丁锡和丁酸锡等。在另一实施方案中，可用于促进有机硅密封剂组合物交联的钛化合物为螯合的钛化合物，例如双(乙基乙酰乙酸)1，3-丙二氧基钛；双(乙基乙酰乙酸)二异丙氧基钛；和钛酸四烷酯，例如钛酸四正丁酯和钛酸四异丙酯。在本发明的又一实施方案中，双β-二酮酸二有机锡用于促进有机硅密封剂组合物交联。
在本发明的一方面，所述催化剂为金属催化剂。在本发明的另一方面，所述金属催化剂选自锡化合物，在本发明的另一方面，所述金属催化剂为二月桂酸二丁锡。
本发明的有机硅组合物可包括一种或多种烷氧基硅烷作为助粘剂。在一种实施方案中，助粘剂可为N-2-氨基乙基-3-氨丙基三甲氧基硅烷和1，3，5-三(三甲氧基甲硅烷基丙基)异氰脲酸酯的组合。可用于本发明的其他助粘剂包括N-2-氨基乙基-3-氨丙基三乙氧基硅烷、γ-氨丙基三乙氧基硅烷、γ-氨丙基三甲氧基硅烷、氨丙基三甲氧基硅烷、双-γ-(三甲氧基甲硅烷基丙基)胺、N-苯基-γ-氨丙基三甲氧基硅烷、三氨基官能的三甲氧基硅烷、γ-氨丙基甲基二乙氧基硅烷、γ-氨丙基甲基二乙氧基硅烷、甲基丙烯酰氧基丙基三甲氧基硅烷、甲基氨丙基三甲氧基硅烷、γ-环氧丙氧丙基乙基二甲氧基硅烷、γ-环氧丙氧丙基三甲氧基硅烷、γ-环氧丙氧乙基三甲氧基硅烷、β-(3，4-环氧基环己基)丙基三甲氧基硅烷、β-(3，4-环氧基环己基)乙基甲基二甲氧基硅烷、异氰酸丙酯基三乙氧基硅烷、异氰酸丙酯基甲基二甲氧基硅烷、β-氰基乙基三甲氧基硅烷、γ-丙烯酰氧基丙基三甲氧基硅烷、γ-甲基丙烯酰氧基丙基甲基二甲氧基硅烷、4-氨基-3，3-二甲基丁基三甲氧基硅烷、N-乙基-3-三甲氧基甲硅烷基-2-甲基丙胺等。
任选地，本文的可固化密封剂组合物还可以包含一种或多种填料，如碳酸钙包括沉淀碳酸钙、胶态碳酸钙、经化合物例如硬脂酸酯/盐或硬脂酸处理的研磨、沉淀和胶态碳酸钙；增强二氧化硅，例如热解法二氧化硅、沉淀二氧化硅、硅胶和疏水化二氧化硅和硅胶；粉碎的和研磨的石英、氧化铝、氢氧化铝、氢氧化钛、硅藻土、氧化铁、炭黑和石墨、滑石、云母等。
在本发明的一个方面，可固化组合物的填料组分是碳酸钙、二氧化硅或其混合物。添加的填料的类型和数量取决于固化后的有机硅组合物期望的物理性质。因此，所述填料可以是单种物质或者两种或更多种物质的混合物。
其他有用的填料可以是具有独特形态的纳米粘土，其一个方向的尺寸为纳米范围。纳米粘土可和与构成粘土颗粒的各层之间的表面离子结合的插层剂形成化学复合物。插层剂和粘土颗粒的这种缔合导致材料可与许多不同种类的基质树脂(host resin)相容，从而使粘土填料分散其中。
当描述本发明的有机纳米粘土填料时，除非另有说明，以下术语具有以下含义。
本文使用的术语″剥落″描述这样一个过程，其中纳米粘土小片的小包在聚合物基体中彼此分离。在剥落过程中，在各小包最外区域的小片裂开，暴露更多的小片用于分离。
本文使用的术语″坑道(gallery)″描述粘土小片的平行的各层之间的空间。坑道空间根据占据该空间的分子或聚合物的性质而变。各纳米粘土小片之间的层间空间同样根据占据该空间的分子的类型而变。
本文使用的术语″插层剂(intercalant)″包括能进入粘土坑道并与其表面结合的任何无机、有机或半有机化合物。
本文使用的术语″插入物(intercalate)″是指粘土-化学复合物，其中由于表面改性过程增加粘土坑道空间。在适当的温度和剪切条件下，插入物能在树脂基体中剥落。
本文使用的表述″改性粘土″是指经能与存在于粘土的层间表面的阳离子进行离子交换反应的任何无机、有机或半有机化合物处理的粘土材料。
本文使用的术语″纳米粘土″描述具有独特形态的粘土材料，其中一个方向的尺寸为纳米范围。纳米粘土可和与构成粘土颗粒的各层之间的表面离子结合的插层剂形成化学复合物。插层剂和粘土颗粒的这种缔合导致材料可与许多不同种类的基质树脂相容，从而使粘土填料分散其中。
本文使用的表述″有机纳米粘土″描述经有机插层剂处理或改性的纳米粘土。
本文使用的术语″有机粘土″是指经能与存在于粘土的层间表面的阳离子进行离子交换反应的有机分子(还称为″剥落剂″、″表面改性剂″或″插层剂″)处理的粘土或其他层状材料。
纳米粘土可为天然或合成的材料。这一特征可影响粒度，对本发明来说，颗粒应具有约0.01μm至约5μm，优选约0.05μm至约2μm，更优选约0.1μm至约1μm的横向尺寸。颗粒的厚度或纵向尺寸通常可在约0.5nm至约10nm之间变化，并优选约1nm至约5nm。
提供填料组分的可用的纳米粘土包括天然或合成的页硅酸盐，尤其是绿土粘土，例如蒙脱土、蒙脱土钠、蒙脱土钙、蒙脱土镁、绿脱石、贝得石、铬岭石、合成粘土、锂蒙脱石、皂石、锌蒙脱石、NaSiO13(OH)3.3H2O(magadite)、水羟硅钠石、sobockite、svindordite、富镁蒙脱石、滑石、云母、高岭石、蛭石、多水高岭石、铝酸盐氧化物或水滑石等及其混合物。在另一实施方案中，可用的层状材料包括云母矿物例如伊利石和混合的层状伊利石/绿土矿物，例如累托石、tarosovite、三八面体伊利石和伊利石与以上所述的一种或多种粘土矿物的混合物。充分吸收有机分子以增加相邻页硅酸盐小片之间的层间间距为至少约5埃或至少约10埃(当测量干燥页硅酸盐时)的任何可溶胀的层状材料均可用于提供本发明的可固化的组合物。
在本发明的一种实施方案中，用于处理或改性粘土和层状材料的有机和无机化合物包括阳离子表面活性剂，例如铵、氯化铵、烷基铵(伯、仲、叔和季)、脂族或芳族或芳脂族胺的鏻或锍的衍生物、膦或硫醚。
本文可使用的用于纳米粘土的其他有机处理试剂包括胺化合物和/或季铵化合物R6R7R8N+X-，R6、R7和R8各自独立为具有至多60个碳原子的烷氧基硅烷基、烷基或链烯基，X为阴离子，例如Cl-、F-、SO4 2-等。
本发明的组合物还可以包括一种或多种非离子表面活性剂，如聚乙二醇、聚丙二醇、乙氧化蓖麻油、油酸乙氧化物、烷基酚乙氧化物、环氧乙烷(EO)与环氧丙烷(PO)的共聚物、有机硅与聚醚的共聚物(有机硅聚醚共聚物)、有机硅和环氧乙烷与环氧丙烷共聚物的共聚物及其混合物。
本发明的可固化的密封剂组合物还包括已知和常规量的常规用于RTC含有机硅的组合物的其他组分，例如着色剂、颜料、增塑剂、固化加速剂、触变剂、除湿剂、染料、溶剂、抗氧化剂、UV稳定剂、生物杀灭剂等，条件是这些组分不影响经固化的组合物所需的性能。
本文公开的可湿固化的甲硅烷基化树脂(a)、其他聚合物(b)、和任选的组分，如填料、交联催化剂、助粘剂和离子表面活性剂的量可在宽范围内变化，且优选可从下表所述的范围内选择。
表一本发明的含可湿固化的甲硅烷基化树脂的组合物的各种组分的量(wt％)的范围
本文的经固化的组合物可通过本领域众所周知的方法制得，例如在湿气存在下，熔体共混、挤出共混、溶液共混、干混、在Banbury混合机中共混等，以提供基本上均匀的混合物。
尽管详细说明并描述了本发明的优选实施方案，但例如组分、材料和参数的各种更改对于本领域的技术人员来说是显而易见的，且意图在所附的权利要求中涵盖落在本发明范围内的所有这些更改与变化。
Claims (26)
1.一种含可湿固化的甲硅烷基化树脂的组合物，包括：
a)可湿固化的甲硅烷基化树脂，在固化后，提供显示透气性的经固化的树脂；
b)透气性小于经固化的树脂(a)的透气性的至少一种其他聚合物；和任选的
c)至少一种其他组分，选自催化剂、助粘剂、填料、表面活性剂、UV稳定剂、抗氧化剂、固化加速剂、触变剂、除湿剂、颜料、染料、溶剂和生物杀灭剂。
2.权利要求1的组合物，其中可湿固化的甲硅烷基化树脂(a)为至少一种选自以下的物质：(i)得自异氰酸酯封端的聚氨酯预聚物与含活性氢的有机基官能的硅烷的反应的甲硅烷基化树脂；(ii)得自羟基封端的聚氨酯预聚物与异氰酸基硅烷的反应的甲硅烷基化树脂；和(iii)得自多元醇与异氰酸基硅烷的反应的甲硅烷基化聚合物。
3.权利要求1的组合物，其中可湿固化的甲硅烷基化树脂(a)为组合物总重量的约1-约99wt％。
4.权利要求1的组合物，其中可湿固化的甲硅烷基化树脂(a)为组合物总重量的约10-约50wt％。
5.权利要求1的组合物，其中可湿固化的甲硅烷基化树脂(a)为组合物总重量的约20-约30wt％。
6.权利要求1的组合物，其中聚合物(b)选自低密度聚乙烯、极低密度聚乙烯、线型低密度聚乙烯和高密度聚乙烯、聚丙烯、聚异丁烯、聚乙酸乙烯酯、聚乙烯醇、聚苯乙烯、聚碳酸酯、聚酯例如聚对苯二甲酸乙二酯、聚对苯二甲酸丁二酯、聚萘二甲酸乙二酯、二醇改性的聚对苯二甲酸乙二酯；聚氯乙烯、聚偏二氯乙烯、聚偏二氟乙烯、热塑性聚氨酯、丙烯腈-丁二烯-苯乙烯共聚物、聚甲基丙烯酸甲酯、聚氟乙烯、聚酰胺、聚甲基戊烯、聚酰亚胺、聚醚酰亚胺、聚醚醚酮、聚砜、聚醚砜、乙烯-一氯三氟乙烯共聚物、聚四氟乙烯、乙酸纤维素、乙酸丁酸纤维素、塑化聚氯乙烯、离聚物、聚苯硫醚、苯乙烯-马来酸酐共聚物、改性聚苯醚、乙丙橡胶、聚丁二烯、聚氯丁二烯、聚异戊二烯、聚氨酯、苯乙烯-丁二烯-苯乙烯共聚物、苯乙烯-乙烯-丁二烯-苯乙烯共聚物、聚甲基苯基硅氧烷及其混合物。
7.权利要求6的组合物，其中聚合物(b)选自低密度聚乙烯、极低密度聚乙烯、线型低密度聚乙烯、高密度聚乙烯，及其混合物。
8.权利要求7的组合物，其中聚合物(b)选自低密度聚乙烯、极低密度聚乙烯、线型低密度聚乙烯，及其混合物。
9.权利要求1的组合物，其中聚合物(b)为组合物总重量的约1-约99wt％。
10.权利要求1的组合物，其中聚合物(b)为组合物总重量的约5-约50wt％。
11.权利要求1的组合物，其中聚合物(b)为组合物总重量的约10-约20wt％。
12.权利要求1的组合物，其中所述催化剂为锡催化剂。
13.权利要求1的组合物，其中所述锡催化剂选自二月桂酸二丁锡、二乙酸二丁锡、二甲醇二丁锡、辛酸锡、三蜡酸异丁锡、二丁锡氧化物、增溶的二丁锡氧化物、双二异辛基邻苯二甲酸二丁锡、双-三丙氧基甲硅烷基二辛基锡、二丁锡双乙酰丙酮、硅烷化二丁锡二氧化物、三-辛二酸甲酯基苯基锡、三蜡酸异丁锡、二丁酸二甲锡、二新癸酸二甲锡、酒石酸三乙锡、二苯甲酸二丁锡、油酸锡、环烷酸锡、三-2-乙基己基己酸丁锡、丁酸锡、双β-二酮酸二有机锡，及其混合物。
14.权利要求1的组合物，其中所述助粘剂选自n-2-氨基乙基-3-氨丙基三甲氧基硅烷、1，3，5-三(三甲氧基甲硅烷基丙基)异氰脲酸酯、γ-氨丙基三乙氧基硅烷、γ-氨丙基三甲氧基硅烷、氨丙基三甲氧基硅烷、双-γ-(三甲氧基甲硅烷基丙基)胺、N-苯基-γ-氨丙基三甲氧基硅烷、三氨基官能的三甲氧基硅烷、γ-氨丙基甲基二乙氧基硅烷、γ-氨丙基甲基二乙氧基硅烷、甲基丙烯酰氧基丙基三甲氧基硅烷、甲基氨丙基三甲氧基硅烷、γ-环氧丙氧丙基乙基二甲氧基硅烷、γ-环氧丙氧丙基三甲氧基硅烷、γ-环氧丙氧乙基三甲氧基硅烷、β-(3，4-环氧基环己基)丙基三甲氧基硅烷、β-(3，4-环氧基环己基)乙基甲基二甲氧基硅烷、异氰酸丙酯基三乙氧基硅烷、异氰酸丙酯基甲基二甲氧基硅烷、β-氰基乙基三甲氧基硅烷、γ-丙烯酰氧基丙基三甲氧基硅烷、γ-甲基丙烯酰氧基丙基甲基二甲氧基硅烷、4-氨基-3，3-二甲基丁基三甲氧基硅烷、n-乙基-3-三甲氧基甲硅烷基-2-甲基丙胺，及其混合物。
15.权利要求1的组合物，其中所述填料选自碳酸钙、沉淀碳酸钙、胶态碳酸钙、用化合物硬脂酸盐/酯或硬脂酸处理的碳酸钙、热解法二氧化硅、沉淀二氧化硅、硅胶、疏水化二氧化硅、亲水硅胶、粉碎石英、研磨石英、氧化铝、氢氧化铝、氢氧化钛、粘土、高岭土、膨润土、蒙脱土、硅藻土、氧化铁、炭黑和石墨、云母、滑石，及其混合物。
16.权利要求15的组合物，其中所述填料选自蒙脱土、蒙脱土钠、蒙脱土钙、蒙脱土镁、绿脱石、贝得石、铬岭石、合成粘土、锂蒙脱石、皂石、锌蒙脱石、magadite、水羟硅钠石、sobockite、svindordite、富镁蒙脱石、蛭石、多水高岭石、铝酸盐氧化物、水滑石、伊利石、累托石、tarosovite、三八面体伊利石、高岭石，及其混合物。
17.权利要求16的组合物，其中所述填料用铵、伯烷基铵、仲烷基铵、叔烷基铵、季烷基铵，脂族、芳族或芳脂族胺的鏻衍生物，脂族、芳族或芳脂族胺的膦或硫醚或锍的衍生物，膦或硫醚改性。
18.权利要求16的组合物，其中所述填料用至少一种叔胺化合物R3R4R5N和/或季铵化合物R6R7R8N+X-改性，其中R3、R4、R5、R6、R7和R8各自独立为具有至多60个碳原子的烷基、链烯基或烷氧基硅烷基，X为阴离子。
19.权利要求1的组合物，其中所述表面活性剂为选自以下的非离子表面活性剂：聚乙二醇、聚丙二醇、乙氧化蓖麻油、油酸乙氧化物、烷基酚乙氧化物、环氧乙烷与环氧丙烷的共聚物、有机硅与聚醚的共聚物、有机硅和环氧乙烷与环氧丙烷共聚物的共聚物及其混合物。
20.权利要求19的组合物，其中所述非离子表面活性剂选自环氧乙烷与环氧丙烷的共聚物、有机硅与聚醚的共聚物、有机硅和环氧乙烷与环氧丙烷共聚物的共聚物及其混合物。
21.用权利要求1的含可湿固化的甲硅烷基化树脂的组合物制备的密封剂、粘合剂或涂料组合物。
22.用权利要求2的含可湿固化的甲硅烷基化树脂的组合物制备的密封剂、粘合剂或涂料组合物。
23.用权利要求18的含可湿固化的甲硅烷基化树脂的组合物制备的密封剂、粘合剂或涂料组合物。
24.固化的权利要求1的含甲硅烷基化树脂的组合物。
25.固化的权利要求2的含甲硅烷基化树脂的组合物。
26.固化的权利要求18的含甲硅烷基化树脂的组合物。
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| US11/345,563 US7569653B2 (en) | 2006-02-01 | 2006-02-01 | Sealant composition having reduced permeability to gas |
| US11/345,563 | 2006-02-01 | ||
| PCT/US2007/002407 WO2007089705A1 (en) | 2006-02-01 | 2007-01-30 | Sealant composition having reduced permeability to gas |
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- 2007-01-30 WO PCT/US2007/002407 patent/WO2007089705A1/en active Application Filing
- 2007-01-30 CA CA002640370A patent/CA2640370A1/en not_active Abandoned
- 2007-01-30 AU AU2007209951A patent/AU2007209951B2/en not_active Ceased
- 2007-01-30 CN CN200780010461.5A patent/CN101410340B/zh not_active Expired - Fee Related
- 2007-01-30 TW TW096103412A patent/TWI427049B/zh not_active IP Right Cessation
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| CN111201293A (zh) * | 2017-10-26 | 2020-05-26 | 太阳精机株式会社 | 湿气固化性聚氨酯热熔粘接剂及其制造方法 |
| CN111479875A (zh) * | 2017-12-22 | 2020-07-31 | 科思创德国股份有限公司 | 湿固化型组合物 |
| CN111479875B (zh) * | 2017-12-22 | 2022-11-15 | 科思创德国股份有限公司 | 湿固化型组合物 |
| CN110924176A (zh) * | 2019-11-22 | 2020-03-27 | 涿州长兴新材料科技有限公司 | 一种新型丝接密封材料 |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2640370A1 (en) | 2007-08-09 |
| TWI427049B (zh) | 2014-02-21 |
| US20070179242A1 (en) | 2007-08-02 |
| AU2007209951B2 (en) | 2012-11-22 |
| EP1984308A1 (en) | 2008-10-29 |
| CN101410340B (zh) | 2013-05-22 |
| US7569653B2 (en) | 2009-08-04 |
| TW200740710A (en) | 2007-11-01 |
| JP5542339B2 (ja) | 2014-07-09 |
| JP2009525387A (ja) | 2009-07-09 |
| EP1984308B1 (en) | 2017-01-18 |
| WO2007089705A1 (en) | 2007-08-09 |
| AU2007209951A1 (en) | 2007-08-09 |
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