CN101404267A - 半导体装置与半导体装置的制造方法 - Google Patents

半导体装置与半导体装置的制造方法 Download PDF

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Publication number
CN101404267A
CN101404267A CN200810211001.5A CN200810211001A CN101404267A CN 101404267 A CN101404267 A CN 101404267A CN 200810211001 A CN200810211001 A CN 200810211001A CN 101404267 A CN101404267 A CN 101404267A
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CN
China
Prior art keywords
semiconductor chip
metal layer
carrier tape
semiconductor device
resin layer
Prior art date
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Pending
Application number
CN200810211001.5A
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English (en)
Chinese (zh)
Inventor
中村嘉文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN101404267A publication Critical patent/CN101404267A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
CN200810211001.5A 2007-10-03 2008-08-13 半导体装置与半导体装置的制造方法 Pending CN101404267A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007259296 2007-10-03
JP2007259296 2007-10-03
JP2008097648 2008-04-04

Publications (1)

Publication Number Publication Date
CN101404267A true CN101404267A (zh) 2009-04-08

Family

ID=40538210

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200810211001.5A Pending CN101404267A (zh) 2007-10-03 2008-08-13 半导体装置与半导体装置的制造方法

Country Status (2)

Country Link
JP (1) JP2009105366A (enExample)
CN (1) CN101404267A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101924082A (zh) * 2009-06-16 2010-12-22 东部高科股份有限公司 热释放半导体封装
CN101986429A (zh) * 2009-07-28 2011-03-16 精材科技股份有限公司 芯片封装体及其形成方法
CN103594434A (zh) * 2013-10-23 2014-02-19 孔星 功率部件复合散热层及其工艺和带复合散热层的功率部件
CN103635996A (zh) * 2011-06-30 2014-03-12 英特尔公司 无焊内建层封装的翘曲减小
US9613920B2 (en) 2012-05-14 2017-04-04 Intel Corporation Microelectronic package utilizing multiple bumpless build-up structures and through-silicon vias
US9646851B2 (en) 2010-04-02 2017-05-09 Intel Corporation Embedded semiconductive chips in reconstituted wafers, and systems containing same
TWI697079B (zh) * 2019-03-06 2020-06-21 南茂科技股份有限公司 薄膜覆晶封裝結構
CN112420632A (zh) * 2019-08-23 2021-02-26 三星电子株式会社 半导体封装件
CN114424335A (zh) * 2019-09-27 2022-04-29 株式会社电装 电子装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5799541B2 (ja) 2011-03-25 2015-10-28 株式会社ソシオネクスト 半導体装置及びその製造方法
KR101630769B1 (ko) 2014-06-24 2016-06-16 매그나칩 반도체 유한회사 방열 반도체 칩 패키지 및 그 제조 방법
CN113327899A (zh) * 2021-04-22 2021-08-31 成都芯源系统有限公司 倒装芯片封装单元及封装方法

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101924082A (zh) * 2009-06-16 2010-12-22 东部高科股份有限公司 热释放半导体封装
CN101986429A (zh) * 2009-07-28 2011-03-16 精材科技股份有限公司 芯片封装体及其形成方法
US9646851B2 (en) 2010-04-02 2017-05-09 Intel Corporation Embedded semiconductive chips in reconstituted wafers, and systems containing same
US11257688B2 (en) 2010-04-02 2022-02-22 Intel Corporation Embedded semiconductive chips in reconstituted wafers, and systems containing same
US10651051B2 (en) 2010-04-02 2020-05-12 Intel Corporation Embedded semiconductive chips in reconstituted wafers, and systems containing same
US9847234B2 (en) 2010-04-02 2017-12-19 Intel Corporation Embedded semiconductive chips in reconstituted wafers, and systems containing same
CN103635996B (zh) * 2011-06-30 2016-08-17 英特尔公司 无焊内建层封装的翘曲减小
US9627227B2 (en) 2011-06-30 2017-04-18 Intel Corporation Bumpless build-up layer package warpage reduction
CN103635996A (zh) * 2011-06-30 2014-03-12 英特尔公司 无焊内建层封装的翘曲减小
US9613920B2 (en) 2012-05-14 2017-04-04 Intel Corporation Microelectronic package utilizing multiple bumpless build-up structures and through-silicon vias
CN103594434A (zh) * 2013-10-23 2014-02-19 孔星 功率部件复合散热层及其工艺和带复合散热层的功率部件
TWI697079B (zh) * 2019-03-06 2020-06-21 南茂科技股份有限公司 薄膜覆晶封裝結構
CN111668172A (zh) * 2019-03-06 2020-09-15 南茂科技股份有限公司 薄膜覆晶封装结构
CN111668172B (zh) * 2019-03-06 2022-05-03 南茂科技股份有限公司 薄膜覆晶封装结构
CN112420632A (zh) * 2019-08-23 2021-02-26 三星电子株式会社 半导体封装件
CN114424335A (zh) * 2019-09-27 2022-04-29 株式会社电装 电子装置
CN114424335B (zh) * 2019-09-27 2025-09-30 株式会社电装 电子装置

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Publication number Publication date
JP2009105366A (ja) 2009-05-14

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Open date: 20090408