CN101401495A - 陶瓷叠层器件及其制造方法 - Google Patents

陶瓷叠层器件及其制造方法 Download PDF

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Publication number
CN101401495A
CN101401495A CNA200780008539XA CN200780008539A CN101401495A CN 101401495 A CN101401495 A CN 101401495A CN A200780008539X A CNA200780008539X A CN A200780008539XA CN 200780008539 A CN200780008539 A CN 200780008539A CN 101401495 A CN101401495 A CN 101401495A
Authority
CN
China
Prior art keywords
ceramic
electrode
ceramic laminated
laminated device
silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA200780008539XA
Other languages
English (en)
Chinese (zh)
Inventor
齐藤隆一
茂野交市
加贺田博司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN101401495A publication Critical patent/CN101401495A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/129—Ceramic dielectrics containing a glassy phase, e.g. glass ceramic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021—Constructional details
    • H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
CNA200780008539XA 2006-03-15 2007-03-06 陶瓷叠层器件及其制造方法 Pending CN101401495A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006070599A JP4967388B2 (ja) 2006-03-15 2006-03-15 セラミック積層デバイスの製造方法およびセラミック積層デバイス
JP070599/2006 2006-03-15

Publications (1)

Publication Number Publication Date
CN101401495A true CN101401495A (zh) 2009-04-01

Family

ID=38594717

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA200780008539XA Pending CN101401495A (zh) 2006-03-15 2007-03-06 陶瓷叠层器件及其制造方法

Country Status (5)

Country Link
US (1) US7826196B2 (enExample)
EP (1) EP1986481A4 (enExample)
JP (1) JP4967388B2 (enExample)
CN (1) CN101401495A (enExample)
WO (1) WO2007119312A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104980118A (zh) * 2014-04-03 2015-10-14 深圳振华富电子有限公司 一种叠层片式陶瓷射频低通滤波器及其制备方法
CN107211535A (zh) * 2015-01-13 2017-09-26 日本特殊陶业株式会社 电路基板和其制造方法
CN112408975A (zh) * 2019-08-23 2021-02-26 兴勤电子工业股份有限公司 陶瓷组成物、陶瓷烧结体、叠层型陶瓷电子元件及其制法
CN113443908A (zh) * 2020-03-27 2021-09-28 兴勤电子工业股份有限公司 陶瓷组成物、陶瓷烧结体及叠层型陶瓷电子元件

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6297914B2 (ja) * 2014-05-01 2018-03-20 日本特殊陶業株式会社 感温素子および温度センサ
TW201905948A (zh) * 2017-06-26 2019-02-01 以色列商以色列維夏公司 寬頻耦合電容器

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JP2613722B2 (ja) * 1991-09-27 1997-05-28 日本碍子株式会社 低温焼成用誘電体磁器組成物の製造法
JP2786977B2 (ja) 1991-09-27 1998-08-13 日本碍子株式会社 低温焼成用誘電体磁器組成物及びその製法
JPH0855518A (ja) 1994-08-12 1996-02-27 Ube Ind Ltd 誘電体磁器組成物
WO1998036888A1 (en) * 1997-02-24 1998-08-27 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
JPH11171645A (ja) * 1997-12-09 1999-06-29 Hitachi Metals Ltd 電子部品
JPH11189894A (ja) * 1997-12-24 1999-07-13 Murata Mfg Co Ltd Ｓｎ合金メッキ皮膜、電子部品およびチップ型セラミック電子部品
JPH11209172A (ja) 1998-01-22 1999-08-03 Matsushita Electric Ind Co Ltd 誘電体磁器組成物および複合誘電体磁器組成物
JP2000165048A (ja) 1998-11-26 2000-06-16 Kyocera Corp 積層回路基板及びその製造方法
JP3917770B2 (ja) * 1999-01-22 2007-05-23 日本碍子株式会社 低温焼成磁器およびこれを備えた電子部品
JP3741556B2 (ja) * 1999-01-22 2006-02-01 日本碍子株式会社 低温焼成磁器およびこれを備えた電子部品
JP2001035741A (ja) * 1999-07-22 2001-02-09 Tdk Corp 電子部品の製造方法
US6876537B2 (en) * 1999-10-07 2005-04-05 Matsushita Electric Industrial Co., Ltd. Ceramic electronic component and method for manufacturing the same
JP3838541B2 (ja) * 2001-03-09 2006-10-25 日本碍子株式会社 低温焼成磁器および電子部品
JP2002338353A (ja) * 2001-05-17 2002-11-27 Aiomu Technology:Kk 誘電体磁器組成物
JP2004203646A (ja) * 2002-12-24 2004-07-22 Ngk Insulators Ltd 低温焼成磁器および電子部品
US7230316B2 (en) * 2002-12-27 2007-06-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having transferred integrated circuit
JP4308062B2 (ja) * 2004-03-30 2009-08-05 三洋電機株式会社 積層セラミック基板及びその製造方法
JP2005289701A (ja) 2004-03-31 2005-10-20 Taiyo Yuden Co Ltd セラミックス組成物及びそれを使用したセラミックス配線基板
TW200706513A (en) * 2005-04-27 2007-02-16 Murata Manufacturing Co Dielectric ceramic, process for producing the same, and laminated ceramic capacitor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104980118A (zh) * 2014-04-03 2015-10-14 深圳振华富电子有限公司 一种叠层片式陶瓷射频低通滤波器及其制备方法
CN107211535A (zh) * 2015-01-13 2017-09-26 日本特殊陶业株式会社 电路基板和其制造方法
CN107211535B (zh) * 2015-01-13 2019-08-16 日本特殊陶业株式会社 电路基板和其制造方法
CN112408975A (zh) * 2019-08-23 2021-02-26 兴勤电子工业股份有限公司 陶瓷组成物、陶瓷烧结体、叠层型陶瓷电子元件及其制法
CN112408975B (zh) * 2019-08-23 2022-11-04 兴勤电子工业股份有限公司 陶瓷组成物、陶瓷烧结体、叠层型陶瓷电子元件及其制法
CN113443908A (zh) * 2020-03-27 2021-09-28 兴勤电子工业股份有限公司 陶瓷组成物、陶瓷烧结体及叠层型陶瓷电子元件

Also Published As

Publication number Publication date
US7826196B2 (en) 2010-11-02
US20090034157A1 (en) 2009-02-05
EP1986481A4 (en) 2012-11-28
WO2007119312A1 (ja) 2007-10-25
JP2007250728A (ja) 2007-09-27
JP4967388B2 (ja) 2012-07-04
EP1986481A1 (en) 2008-10-29

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