CN101396767B - 激光加工设备、加工数据产生方法 - Google Patents

激光加工设备、加工数据产生方法 Download PDF

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Publication number
CN101396767B
CN101396767B CN2008101683096A CN200810168309A CN101396767B CN 101396767 B CN101396767 B CN 101396767B CN 2008101683096 A CN2008101683096 A CN 2008101683096A CN 200810168309 A CN200810168309 A CN 200810168309A CN 101396767 B CN101396767 B CN 101396767B
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China
Prior art keywords
laser
processing
reference point
process equipment
plane
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Expired - Fee Related
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CN2008101683096A
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English (en)
Chinese (zh)
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CN101396767A (zh
Inventor
井高护
竹内彰雄
山川英树
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Keyence Corp
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Keyence Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/44—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using single radiation source per colour, e.g. lighting beams or shutter arrangements
    • B41J2/442—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using single radiation source per colour, e.g. lighting beams or shutter arrangements using lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/47—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light
    • B41J2/471—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light using dot sequential main scanning by means of a light deflector, e.g. a rotating polygonal mirror

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Numerical Control (AREA)
CN2008101683096A 2007-09-26 2008-09-26 激光加工设备、加工数据产生方法 Expired - Fee Related CN101396767B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007248359A JP5027606B2 (ja) 2007-09-26 2007-09-26 レーザ加工装置、加工データ生成方法及びコンピュータプログラム
JP2007248359 2007-09-26
JP2007-248359 2007-09-26

Publications (2)

Publication Number Publication Date
CN101396767A CN101396767A (zh) 2009-04-01
CN101396767B true CN101396767B (zh) 2013-05-15

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CN2008101683096A Expired - Fee Related CN101396767B (zh) 2007-09-26 2008-09-26 激光加工设备、加工数据产生方法

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US (1) US8772669B2 (enExample)
JP (1) JP5027606B2 (enExample)
CN (1) CN101396767B (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010144778A2 (en) * 2009-06-12 2010-12-16 Applied Materials, Inc. Methods and systems for laser-scribed line alignment
DE202010004852U1 (de) * 2010-04-09 2011-08-26 TRUMPF Maschinen Grüsch AG Laserbearbeitungsmaschine
US20130200053A1 (en) * 2010-04-13 2013-08-08 National Research Council Of Canada Laser processing control method
JP2012148312A (ja) * 2011-01-19 2012-08-09 Keyence Corp レーザー加工装置
JP2012148316A (ja) * 2011-01-19 2012-08-09 Keyence Corp レーザー加工装置
JP5810555B2 (ja) * 2011-03-01 2015-11-11 株式会社リコー レーザ描画装置
JP5459255B2 (ja) 2011-04-08 2014-04-02 株式会社安川電機 ロボットシステム
JP5459256B2 (ja) 2011-04-08 2014-04-02 株式会社安川電機 ロボットシステム
JP2012253298A (ja) * 2011-06-07 2012-12-20 Disco Abrasive Syst Ltd 加工装置
JP6180620B2 (ja) * 2014-03-12 2017-08-16 三菱電機株式会社 カメラモニタ付レーザ加工ヘッド装置
CN103963479B (zh) * 2014-05-08 2016-06-29 佛山市联动科技实业有限公司 带检测的激光打标机
JP6107782B2 (ja) * 2014-09-30 2017-04-05 ブラザー工業株式会社 プログラム及びレーザ加工装置
JP6601285B2 (ja) * 2016-03-15 2019-11-06 オムロン株式会社 レーザ加工システムおよび加工制御方法
JP2018187684A (ja) * 2018-08-29 2018-11-29 パナソニック デバイスＳｕｎｘ株式会社 レーザ加工装置
JP2020086472A (ja) * 2018-11-14 2020-06-04 Ｄｇｓｈａｐｅ株式会社 図形データ作成プログラム
EP3671381A1 (en) * 2018-12-20 2020-06-24 Etxe-Tar, S.A. Methods and systems for operating a machine in a manufacturing process
US12290878B2 (en) * 2019-03-20 2025-05-06 Bobst Mex Sa Characterization method and system for a laser processing machine with a moving sheet or web
JP7285478B2 (ja) * 2019-03-26 2023-06-02 パナソニックＩｐマネジメント株式会社 レーザ加工装置
JP7316209B2 (ja) * 2019-12-26 2023-07-27 株式会社キーエンス レーザ加工装置
JP7316208B2 (ja) * 2019-12-26 2023-07-27 株式会社キーエンス レーザ加工装置
JP7370285B2 (ja) * 2020-03-16 2023-10-27 株式会社キーエンス マーキングシステム、診断支援装置、診断支援方法、診断支援プログラム及び記憶媒体
TWI824421B (zh) * 2022-02-24 2023-12-01 雷傑科技股份有限公司 微晶粒加工設備及微晶粒加工方法
CN114769898B (zh) * 2022-03-11 2024-06-07 大族激光科技产业集团股份有限公司 激光加工控制方法、装置及可读存储介质
CN120045112A (zh) * 2023-11-24 2025-05-27 深圳市创客工场科技有限公司 激光加工的预览方法、装置、激光加工设备及存储介质

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4106008A1 (de) * 1991-02-26 1992-08-27 Fraunhofer Ges Forschung Verfahren zur on-line-ueberwachung bei der werkstueckbearbeitung mit laserstrahlung
JPH1058169A (ja) 1996-08-26 1998-03-03 Amada Co Ltd レーザ加工機におけるティーチング方法及びその装置
US6040550A (en) * 1996-10-28 2000-03-21 Chang; Dale U. Apparatus and method for laser welding the outer joints of metal bellows
US6066829A (en) * 1996-07-02 2000-05-23 Miyachi Technos Corporation Apparatus for entering, formatting, and storing a variety of characters, symbols, and figures for use in a laser marking system
US6791057B1 (en) * 1998-11-12 2004-09-14 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Method and device for machining workpieces using high-energy radiation
CN1740739A (zh) * 2005-09-21 2006-03-01 天津大学 基于线结构激光被动扫描的快速彩色三维贴图方法
CN1301480C (zh) * 2002-03-27 2007-02-21 深圳市特得维技术有限公司 计算机视觉三维彩色扫描系统及其扫描方式

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4647220A (en) * 1984-07-09 1987-03-03 Lockheed Corporation Method of and apparatus for detecting corrosion utilizing infrared analysis
JP2638017B2 (ja) 1987-12-18 1997-08-06 日本電気株式会社 レーザビーム・スキャナ
US5052816A (en) * 1989-08-29 1991-10-01 Denyo Kabushiki Kaisha Junction inspection method and apparatus for electronic parts
US5131758A (en) * 1990-05-16 1992-07-21 Administrator Of The National Aeronautics And Space Administration Method of remotely characterizing thermal properties of a sample
RU94030810A (ru) * 1991-11-06 1996-06-20 Т.Лай Шуй Импульсный лазерный аппарат, способ для обеспечения гладкой абляции вещества, лазерный аппарат и способ роговичной хирургии
JP2823750B2 (ja) 1992-09-02 1998-11-11 三菱電機株式会社 レーザマーキング装置
US5864114A (en) * 1994-03-10 1999-01-26 Toshiharu Ishikawa Coating removal apparatus using coordinate-controlled laser beam
WO1995029035A1 (en) * 1994-04-20 1995-11-02 Hitachi Construction Machinery Co., Ltd. Laser beam machining apparatus and laser beam machining method and dam bar machining method
US6111659A (en) * 1995-09-26 2000-08-29 Matsushita Electric Industrial Co., Ltd. Digital copier with image scanner apparatus and offline image data and control data interface
GB9611942D0 (en) * 1996-06-07 1996-08-07 Lumonics Ltd Focus control of lasers in material processing operations
JPH1058167A (ja) * 1996-08-26 1998-03-03 Miyachi Technos Corp スキャニング式レーザマーキング装置
JP3259014B2 (ja) * 1996-07-24 2002-02-18 ミヤチテクノス株式会社 スキャニング式レーザマーキング方法及び装置
JPH11267868A (ja) * 1997-12-29 1999-10-05 Shinozaki Seisakusho:Kk レ―ザ加工装置及びレ―ザ加工方法
US6075220A (en) * 1998-02-12 2000-06-13 Sandia Corporation Optical penetration sensor for pulsed laser welding
US6603885B1 (en) * 1998-04-30 2003-08-05 Fuji Photo Film Co., Ltd. Image processing method and apparatus
US6605797B1 (en) * 1999-07-16 2003-08-12 Troitski Laser-computer graphics system for generating portrait and 3-D sculpture reproductions inside optically transparent material
JP2001062573A (ja) * 1999-08-30 2001-03-13 Keyence Corp レーザマーカ
DE59909654D1 (de) * 1999-11-12 2004-07-08 Werner Kluft Verfahren und Vorrichtung zur Messung von Prozessparametern eines Materialbearbeitungsprozesses
US6929607B2 (en) * 1999-12-02 2005-08-16 Neuroscience Toolworks, Inc. Comprehensive pain assessment systems and methods
US7313289B2 (en) * 2000-08-30 2007-12-25 Ricoh Company, Ltd. Image processing method and apparatus and computer-readable storage medium using improved distortion correction
US7245412B2 (en) * 2001-02-16 2007-07-17 Electro Scientific Industries, Inc. On-the-fly laser beam path error correction for specimen target location processing
KR100638304B1 (ko) * 2002-04-26 2006-10-26 도시바 마쯔시따 디스플레이 테크놀로지 컴퍼니, 리미티드 Ｅｌ 표시 패널의 드라이버 회로
US6670574B1 (en) * 2002-07-31 2003-12-30 Unitek Miyachi Corporation Laser weld monitor
US6720523B1 (en) * 2002-09-23 2004-04-13 Igor Troitski Method for production of laser-induced images represented by incomplete data, which are supplemented during production
JP2004148379A (ja) * 2002-10-31 2004-05-27 Sunx Ltd レーザマーキングシステム及びレーザマーキング方法
US7499201B2 (en) * 2002-12-26 2009-03-03 Fujifilm Corporation Image reading apparatus, method of reading image, and image reading system
US7723641B2 (en) * 2003-01-10 2010-05-25 Mitsuboshi Diamond Industrial Co., Ltd. Brittle material substrate scribing device and scribing method, and automatic analysis line
SE524818C2 (sv) * 2003-02-13 2004-10-05 Abb Ab En metod och ett system för att programmera en industrirobot att förflytta sig relativt definierade positioner på ett objekt
US6874932B2 (en) * 2003-06-30 2005-04-05 General Electric Company Methods for determining the depth of defects
US6940037B1 (en) * 2003-08-25 2005-09-06 Southern Methodist University System and method for controlling welding parameters in welding-based deposition processes
JP2005138169A (ja) * 2003-11-10 2005-06-02 Gijutsu Transfer Service:Kk レーザマーキング装置、レーザマーキング方法、及び被マーキング体
CN1922613A (zh) * 2004-01-14 2007-02-28 国际条形码公司 能补偿变形的可扫描虚拟条形码图像
JP2006025212A (ja) * 2004-07-08 2006-01-26 Canon Inc データ処理装置及び省電力制御方法
JP4986407B2 (ja) * 2005-03-31 2012-07-25 住友電工デバイス・イノベーション株式会社 レーザモジュール、その制御方法、その制御のための制御データの生成方法およびその制御データ
DE602006010941D1 (de) * 2005-07-07 2010-01-21 Toshiba Kk Laserbasiertes Wartungsgerät
ATE537550T1 (de) * 2005-07-08 2011-12-15 Nexgen Semi Holding Inc Vorrichtung und verfahren zur kontrollierten fertigung von halbleitern mittels teilchenstrahlen
JP5013699B2 (ja) * 2005-10-21 2012-08-29 株式会社キーエンス ３次元加工データ設定装置、３次元加工データ設定方法、３次元加工データ設定プログラム、コンピュータで読み取り可能な記録媒体及び記録した機器並びにレーザ加工装置
JP4958489B2 (ja) * 2006-06-30 2012-06-20 株式会社キーエンス レーザ加工装置、レーザ加工条件設定装置、レーザ加工条件設定方法、レーザ加工条件設定プログラム
JP4795886B2 (ja) * 2006-07-27 2011-10-19 株式会社キーエンス レーザ加工装置、レーザ加工条件設定装置、レーザ加工条件設定方法、レーザ加工条件設定プログラム
JP4956107B2 (ja) * 2006-09-15 2012-06-20 株式会社キーエンス レーザ加工データ生成装置、レーザ加工データ生成方法、コンピュータプログラム及びレーザマーキングシステム
JP4956134B2 (ja) * 2006-10-13 2012-06-20 キヤノン株式会社 印刷装置、印刷装置の制御方法及びプログラム

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4106008A1 (de) * 1991-02-26 1992-08-27 Fraunhofer Ges Forschung Verfahren zur on-line-ueberwachung bei der werkstueckbearbeitung mit laserstrahlung
US6066829A (en) * 1996-07-02 2000-05-23 Miyachi Technos Corporation Apparatus for entering, formatting, and storing a variety of characters, symbols, and figures for use in a laser marking system
JPH1058169A (ja) 1996-08-26 1998-03-03 Amada Co Ltd レーザ加工機におけるティーチング方法及びその装置
US6040550A (en) * 1996-10-28 2000-03-21 Chang; Dale U. Apparatus and method for laser welding the outer joints of metal bellows
US6791057B1 (en) * 1998-11-12 2004-09-14 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Method and device for machining workpieces using high-energy radiation
CN1301480C (zh) * 2002-03-27 2007-02-21 深圳市特得维技术有限公司 计算机视觉三维彩色扫描系统及其扫描方式
CN1740739A (zh) * 2005-09-21 2006-03-01 天津大学 基于线结构激光被动扫描的快速彩色三维贴图方法

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Publication number Publication date
CN101396767A (zh) 2009-04-01
JP5027606B2 (ja) 2012-09-19
JP2009078280A (ja) 2009-04-16
US8772669B2 (en) 2014-07-08
US20090078687A1 (en) 2009-03-26

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