CN101375392A - 发光二极管的封装件及其制造方法 - Google Patents
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Abstract
提供一种发光二极管的封装件。该封装件包括金属片、发光二极管芯片、绝缘层、引线框、反射涂层和模塑材料。发光二极管芯片表面安装在金属片上,绝缘层形成在金属片上并且与发光二极管芯片隔离。在绝缘层上设置引线框,在引线框上形成反射涂层,模塑材料以预定形状模制发光二极管芯片。
Description
技术领域
本发明涉及发光二极管的封装件以及制造其的方法。
背景技术
现有技术发光二极管(LED)模块的例子如图1所示。对于图1的现有技术LED模块,对应于红色LED2、绿色LED3和蓝色LED4的每个LED芯片分别安装在一个独立的封装件中。使用透镜状环氧树脂模制该封装件以形成作为模块的单个器件。
现有技术LED封装方法的例子包括在硅光学平台(Silicon OpticalBench,SIOB)的次粘着基台(Submount)上倒装接合(flip-bonding)发光二极管芯片的方法或者使用金属芯印刷电路板(MCPCB)的方法。
MCPCB指的是板上芯片(COB)结构,其中LED芯片直接裸片接合到印刷电路板(PCB),然后在其上进行丝焊用于电连接。
但是,根据现有技术在COB型封装件中使用MCPCB的情况下,在厚的MCPCB上设置绝缘层。在此,由于MCPCB的下部金属(lowermetal)是柔性的同时厚度较厚,因此在挤压MCPCB时会发生变形,由此缺陷率增加并且在工艺操作过程中处理MCPCB时引起不便。
而且,根据现有技术的MCPCB的下部金属的较厚厚度不理想地妨碍微小封装件的形成。
此外,根据现有技术,由于LED芯片不直接接触金属片,因此由LED芯片产生的热不能够充分释放。
发明内容
技术问题
本发明提供LED封装件以及制造其的方法,其可以通过提供表面安装型LED封装件满足对微小封装件的需求,其中所述表面安装型LED封装件能够解决现有技术LED封装件的缺点例如厚的MCPCB。
技术方案
在本发明的一个实施方案中,提供发光二极管,包括:金属片;表面安装在该金属片上的发光二极管芯片;在该金属片上的绝缘层,该绝缘层与发光二极管芯片隔离;在绝缘层上的引线框;在引线框上的反射涂层;和模塑材料,该模塑材料以预定形状模制发光二极管芯片。
在本发明的另一个实施方案中,提供制造发光二极管封装件的方法,包括:在引线框下形成绝缘层;在引线框和绝缘层中形成发光二极管安装区域;在形成发光二极管安装区域的绝缘层下形成金属片;在引线框上形成反射涂层;在安装区域中将发光二极管芯片表面安装在金属片上;和在发光二极管芯片上进行模制。
有益效果
根据本发明的LED封装件以及制造其的方法能够通过使用薄金属片并由此显著减小PCB的厚度来满足对微小封装件的需求。
而且,根据本发明,由于LED芯片安装在金属片上,因此由LED芯片产生的热直接传导至金属片,由此可实现热的有效释放。
附图说明
图1是现有技术的LED封装件的示例图;和
图2~图5是根据本发明一个实施方案的制造LED封装件的方法的横截面图。
具体实施方式
现在将参考附图详细说明根据本发明的一个实施方案的LED封装件以及制造其的方法。
应该理解,当层(或膜)称为在另一层或衬底“上”或“下”时,该层(或膜)可以直接在所述另一层或衬底上或下,或者也可以存在插入的层。
图2~图5是根据本发明一个实施方案的制造LED封装件的方法的横截面图。
参考图2,将绝缘层32连接于引线框33。
引线框33由铜合金形成并且可以包括具有预定图案的电路。
而且,绝缘层32可以由玻璃环氧基材料例如阻燃剂-4(FR-4)树脂32形成。在此,FR-4树脂32是由介电树脂制成的绝缘体,并且具有高的机械强度和优异的耐久性,由此即使FR-4树脂32具有薄的厚度也仅产生小的热变形。由于FR-4树脂32的粘附性,所以FR-4树脂32也是用于形成多层的适当材料。
当使用压机或热压缩夹具将FR-4树脂32连接于引线框33的表面时,由于FR-4树脂32的粘附性,FR-4树脂32通过所述压机或热压缩夹具施加的热连接到引线框33的表面。
参考图3,在引线框33和FR-4树脂32中形成LED安装区域。
具体地,通过机械方法(例如钻机)对连接在一起的FR-4树脂32和引线框33进行穿孔,以形成待安装图5的LED芯片35的空间。
在此,可以对FR-4树脂32和引线框33的连接片进行穿孔以形成具有圆柱形或四边形容器的LED安装空间。
或者,FR-4树脂32和引线框33的穿孔部分可以是从引线框33到FR-4树脂32成锥形的倾斜表面。
然后,参考图3,高温压缩金属片31并将其连接于FR-4树脂32的下表面。
在此,金属片31可以由具有热导性的金属材料例如铝(Al)和siver(Au)形成。
由于金属片31比现有技术的薄,因此金属片31有助于明显减小PCB的厚度,以满足对微小封装件的需求。
例如,金属片31具有约25μm~约75μm的厚度,并用作散热器。而且,由于图5的LED芯片35安装在金属片31上,使得可以满足对LED封装件的微小化的需求。
而且,在高温压缩金属片31并将其连接于FR-4树脂32的下表面时,可以以与将FR-4树脂32和引线框33连接在一起时相同的方式使用压机或热压缩夹具。
然后,参考图4,在引线框33的上表面上在形成反射涂层34。
在此,反射涂层34可以由具有高反射性的材料形成,以改善LED芯片35发射的光的亮度。
反射涂层34可以包括白色树脂,该白色树脂含有氧化钛和树脂作为主组分并且通过混合碳酸钙、硫酸钡、氧化锌等形成。
而且,除了白色树脂之外,还可以使用白色颜料形成反射涂层34。
在本发明中,推荐丝网印刷而不是已广泛使用的现有技术的气动涂料法(pneumatic dispensing method)作为涂敷用于反射涂层34的白色树脂的方法。
与现有技术的气动涂料法相比,丝网印刷法可以在短时间内将白色树脂涂敷到相对大的区域,并需要小的设备投资成本。
厚度例如为50μm的印网掩模(未示出)形成在FR-4树脂32和引线框33的穿孔部分上,特别是形成在待安装LED芯片35的空间上。之后,使用挤压机(squeeze)(未示出)用白色树脂填充除印网掩模之外的部分。
具体地,挤压机沿着印网掩模的上表面移动同时以预定方向擦涂液体白色树脂,使得除了印网掩模之外的部分可以填充有液体白色树脂。
在使用液体白色树脂填充除了印网掩模之外的部分之后,移除印网掩模,在预定温度下实施退火以固化白色树脂,并且白色树脂的表面平坦化为与印网掩模的上表面相同的水平。
然后,参考图5,将LED芯片35安装在安装空间中的金属片31上。
使用具有热导性的糊(未示出)将LED芯片35安装在金属片31上,可以使用引线36电连接LED芯片35和引线框33。
而且,在本发明中,LED芯片可以倒装接合到硅光学平台(SIOB)(未示出),可以将已经倒装接合有LED芯片的SIOB安装在金属片31上,并且可以使用引线使它们电连接。
在安装LED芯片35之后,注射环氧树脂作为模塑材料37,用于模制到LED芯片35上由FR-4树脂32、引线框33和反射涂层34包围的空间。
以上述方式形成的表面安装型LED封装件可以满足对微小封装件的需求,这是因为使用厚度为约25μm~75μm的薄金属层,由此在反射涂层34与金属片31之间实现约0.6mm~约0.4mm的薄的厚度。
而且,根据本发明,由于LED芯片安装在金属片上,因此由LED芯片产生的热可以直接传导至金属片,由此实现有效的热释放。
工业实用性
对本领域技术人员而言,显然在本发明中可以进行各种修改和变化。因此,本发明旨在覆盖本发明的各种修改和变化,只要它们落入所附权利要求及其等同物的范围内。
具体地,虽然采用一个LED芯片作为例子来说明根据本发明的表面安装型LED封装件,但是本发明并不限于此,可以实现每个包括多个LED芯片的多个封装件并用于液晶显示器(LCD)的背光单元。
Claims (18)
1.一种发光二极管的封装件,包括:
金属片;
表面安装在所述金属片上的发光二极管芯片;
在所述金属片上的绝缘层,所述绝缘层与所述发光二极管芯片隔离;
在所述绝缘层上的引线框;
在所述引线框上的反射涂层;和
模塑材料,该模塑材料以预定形状模制所述发光二极管芯片。
2.根据权利要求1的封装件,其中所述金属片具有约25~75μm的厚度。
3.根据权利要求1的封装件,其中所述绝缘层由玻璃环氧基材料形成。
4.根据权利要求1的封装件,其中所述绝缘层由阻燃剂-4树脂形成。
5.根据权利要求1的封装件,其中所述反射涂层包括氧化钛和树脂作为主组分。
6.根据权利要求5的封装件,其中所述反射涂层由白色树脂制成,所述白色树脂通过混合选自碳酸钙、硫酸钡、氧化锌和氧化钛中的至少一种形成。
7.一种制造发光二极管的封装件的方法,所述方法包括:
在引线框下形成绝缘层;
在所述引线框和所述绝缘层中形成发光二极管安装区域;
在形成所述发光二极管安装区域的所述绝缘层下形成金属片;
在所述引线框上形成反射涂层;
在所述安装区域中将发光二极管芯片表面安装在所述金属片上;和
在所述发光二极管芯片上进行模制。
8.根据权利要求7的方法,其中所述绝缘层的形成包括形成玻璃环氧基材料的绝缘层。
9.根据权利要求7的方法,其中高温挤压并连接所述绝缘层。
10.根据权利要求7的方法,其中所述绝缘层的形成包括形成阻燃剂-4树脂的绝缘层,和高温挤压并连接所述绝缘层。
11.根据权利要求7的方法,其中所述发光二极管安装区域的形成包括使用机械方法以预定形状对所述引线框和所述绝缘层进行穿孔。
12.根据权利要求7的方法,其中在所述金属片的形成中,所述金属片具有约25μm~约75μm的厚度。
13.根据权利要求7的方法,其中所述反射涂层的形成包括使用白色颜料形成所述反射涂层。
14.根据权利要求7的方法,其中所述反射涂层的形成包括使用白色树脂形成所述反射涂层,所述白色树脂通过混合选自碳酸钙、硫酸钡、氧化锌和氧化钛中的至少一种形成并且使用氧化钛和树脂作为主组分。
15.根据权利要求7的方法,其中所述反射涂层的形成包括使用印网掩模和挤压机通过丝网印刷法形成所述反射涂层。
16.根据权利要求7的方法,其中所述发光二极管芯片的表面安装包括使用具有热导性的糊将所述发光二极管芯片接合在所述金属片上。
17.根据权利要求7的方法,其中所述发光二极管安装区域的形成包括将所述发光二极管安装区域穿孔为圆柱形或四边形容器。
18.根据权利要求7的方法,其中所述发光二极管安装区域的形成包括通过机械方法对所述绝缘层和所述引线框进行穿孔,其中所述绝缘层和所述引线框的穿孔部分为从所述引线框到所述绝缘层成锥形的倾斜表面。
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KR10-2006-0008158 | 2006-01-26 | ||
PCT/KR2007/000381 WO2007086668A1 (en) | 2006-01-26 | 2007-01-23 | Package of light emitting diode and method for manufacturing the same |
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CN114375502A (zh) * | 2019-09-20 | 2022-04-19 | 株式会社日本显示器 | Led模组 |
CN114375502B (zh) * | 2019-09-20 | 2024-05-28 | 株式会社日本显示器 | Led模组 |
Also Published As
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JP2009524930A (ja) | 2009-07-02 |
US20110169032A1 (en) | 2011-07-14 |
US8217413B2 (en) | 2012-07-10 |
KR101283182B1 (ko) | 2013-07-05 |
US20090020774A1 (en) | 2009-01-22 |
KR20070078169A (ko) | 2007-07-31 |
CN101375392B (zh) | 2013-10-02 |
USRE48617E1 (en) | 2021-06-29 |
US8552449B2 (en) | 2013-10-08 |
US9450156B2 (en) | 2016-09-20 |
US7935976B2 (en) | 2011-05-03 |
US20140008689A1 (en) | 2014-01-09 |
JP2012074753A (ja) | 2012-04-12 |
US20110169021A1 (en) | 2011-07-14 |
WO2007086668A1 (en) | 2007-08-02 |
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