CN101373762B - 功率半导体模块 - Google Patents

功率半导体模块 Download PDF

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Publication number
CN101373762B
CN101373762B CN200810173727.4A CN200810173727A CN101373762B CN 101373762 B CN101373762 B CN 101373762B CN 200810173727 A CN200810173727 A CN 200810173727A CN 101373762 B CN101373762 B CN 101373762B
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CN
China
Prior art keywords
bus bar
electrode plate
solder
semiconductor package
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200810173727.4A
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English (en)
Chinese (zh)
Other versions
CN101373762A (zh
Inventor
渡边尚威
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
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Toshiba Corp
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Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of CN101373762A publication Critical patent/CN101373762A/zh
Application granted granted Critical
Publication of CN101373762B publication Critical patent/CN101373762B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connection Of Batteries Or Terminals (AREA)
CN200810173727.4A 2007-08-16 2008-08-15 功率半导体模块 Expired - Fee Related CN101373762B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007212307 2007-08-16
JP2007-212307 2007-08-16
JP2007212307A JP4881256B2 (ja) 2007-08-16 2007-08-16 パワー半導体モジュール

Publications (2)

Publication Number Publication Date
CN101373762A CN101373762A (zh) 2009-02-25
CN101373762B true CN101373762B (zh) 2010-07-28

Family

ID=40362300

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200810173727.4A Expired - Fee Related CN101373762B (zh) 2007-08-16 2008-08-15 功率半导体模块

Country Status (3)

Country Link
US (1) US7982299B2 (https=)
JP (1) JP4881256B2 (https=)
CN (1) CN101373762B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8493762B2 (en) * 2009-12-28 2013-07-23 Kabushiki Kaisha Toshiba Power semiconductor module and semiconductor power converter provided with the same
JP6165525B2 (ja) * 2012-10-31 2017-07-19 株式会社東芝 半導体電力変換装置およびその製造方法
JP6155676B2 (ja) * 2013-02-11 2017-07-05 株式会社デンソー 半導体装置及びその製造方法
JP2019149479A (ja) * 2018-02-27 2019-09-05 トヨタ自動車株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002164485A (ja) 2000-11-28 2002-06-07 Toyota Industries Corp 半導体モジュール
JP4434520B2 (ja) 2001-06-29 2010-03-17 日本製紙クレシア株式会社 柔軟性と表面滑性に優れた圧縮ティッシュペーパー及びこれの製造方法
US20060164813A1 (en) * 2004-11-30 2006-07-27 Kabushiki Kaisha Toshiba Semiconductor package and semiconductor module
CN100418216C (zh) 2004-11-30 2008-09-10 株式会社东芝 半导体封装及半导体模块

Also Published As

Publication number Publication date
JP2009049104A (ja) 2009-03-05
US7982299B2 (en) 2011-07-19
JP4881256B2 (ja) 2012-02-22
US20090045490A1 (en) 2009-02-19
CN101373762A (zh) 2009-02-25

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100728