JP4881256B2 - パワー半導体モジュール - Google Patents

パワー半導体モジュール Download PDF

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Publication number
JP4881256B2
JP4881256B2 JP2007212307A JP2007212307A JP4881256B2 JP 4881256 B2 JP4881256 B2 JP 4881256B2 JP 2007212307 A JP2007212307 A JP 2007212307A JP 2007212307 A JP2007212307 A JP 2007212307A JP 4881256 B2 JP4881256 B2 JP 4881256B2
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JP
Japan
Prior art keywords
electrode plate
bus bar
solder
soldered
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007212307A
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English (en)
Japanese (ja)
Other versions
JP2009049104A (ja
JP2009049104A5 (https=
Inventor
尚威 渡邉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2007212307A priority Critical patent/JP4881256B2/ja
Priority to US12/190,941 priority patent/US7982299B2/en
Priority to CN200810173727.4A priority patent/CN101373762B/zh
Publication of JP2009049104A publication Critical patent/JP2009049104A/ja
Publication of JP2009049104A5 publication Critical patent/JP2009049104A5/ja
Application granted granted Critical
Publication of JP4881256B2 publication Critical patent/JP4881256B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connection Of Batteries Or Terminals (AREA)
JP2007212307A 2007-08-16 2007-08-16 パワー半導体モジュール Expired - Fee Related JP4881256B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007212307A JP4881256B2 (ja) 2007-08-16 2007-08-16 パワー半導体モジュール
US12/190,941 US7982299B2 (en) 2007-08-16 2008-08-13 Power semiconductor module
CN200810173727.4A CN101373762B (zh) 2007-08-16 2008-08-15 功率半导体模块

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007212307A JP4881256B2 (ja) 2007-08-16 2007-08-16 パワー半導体モジュール

Publications (3)

Publication Number Publication Date
JP2009049104A JP2009049104A (ja) 2009-03-05
JP2009049104A5 JP2009049104A5 (https=) 2009-11-12
JP4881256B2 true JP4881256B2 (ja) 2012-02-22

Family

ID=40362300

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007212307A Expired - Fee Related JP4881256B2 (ja) 2007-08-16 2007-08-16 パワー半導体モジュール

Country Status (3)

Country Link
US (1) US7982299B2 (https=)
JP (1) JP4881256B2 (https=)
CN (1) CN101373762B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8493762B2 (en) * 2009-12-28 2013-07-23 Kabushiki Kaisha Toshiba Power semiconductor module and semiconductor power converter provided with the same
JP6165525B2 (ja) * 2012-10-31 2017-07-19 株式会社東芝 半導体電力変換装置およびその製造方法
JP6155676B2 (ja) * 2013-02-11 2017-07-05 株式会社デンソー 半導体装置及びその製造方法
JP2019149479A (ja) * 2018-02-27 2019-09-05 トヨタ自動車株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002164485A (ja) 2000-11-28 2002-06-07 Toyota Industries Corp 半導体モジュール
JP4434520B2 (ja) 2001-06-29 2010-03-17 日本製紙クレシア株式会社 柔軟性と表面滑性に優れた圧縮ティッシュペーパー及びこれの製造方法
US20060164813A1 (en) * 2004-11-30 2006-07-27 Kabushiki Kaisha Toshiba Semiconductor package and semiconductor module
CN100418216C (zh) 2004-11-30 2008-09-10 株式会社东芝 半导体封装及半导体模块

Also Published As

Publication number Publication date
JP2009049104A (ja) 2009-03-05
CN101373762B (zh) 2010-07-28
US7982299B2 (en) 2011-07-19
US20090045490A1 (en) 2009-02-19
CN101373762A (zh) 2009-02-25

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