CN101371317A - 使用各向异性导电膜的pcb的连接结构及粘附方法、及使用其评价连接状况的方法 - Google Patents
使用各向异性导电膜的pcb的连接结构及粘附方法、及使用其评价连接状况的方法 Download PDFInfo
- Publication number
- CN101371317A CN101371317A CNA2007800026851A CN200780002685A CN101371317A CN 101371317 A CN101371317 A CN 101371317A CN A2007800026851 A CNA2007800026851 A CN A2007800026851A CN 200780002685 A CN200780002685 A CN 200780002685A CN 101371317 A CN101371317 A CN 101371317A
- Authority
- CN
- China
- Prior art keywords
- parts
- conductive film
- anisotropic conductive
- pcb
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 35
- 230000003746 surface roughness Effects 0.000 claims abstract description 41
- 239000002245 particle Substances 0.000 claims abstract description 29
- 239000000853 adhesive Substances 0.000 claims abstract description 25
- 230000001070 adhesive effect Effects 0.000 claims abstract description 25
- 230000009975 flexible effect Effects 0.000 claims abstract description 10
- 238000001125 extrusion Methods 0.000 claims description 26
- 238000009413 insulation Methods 0.000 claims description 25
- 238000001192 hot extrusion Methods 0.000 claims description 13
- 238000005259 measurement Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 abstract description 7
- 238000007906 compression Methods 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 53
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 8
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
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- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
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- -1 polypropylene Polymers 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000019994 cava Nutrition 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035772 mutation Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/56—Insulating bodies
- H01B17/62—Insulating-layers or insulating-films on metal bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/091—Locally and permanently deformed areas including dielectric material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Abstract
Description
Claims (7)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060006347 | 2006-01-20 | ||
KR10-2006-0006347 | 2006-01-20 | ||
KR1020060006347A KR100747336B1 (ko) | 2006-01-20 | 2006-01-20 | 이방성 도전 필름을 이용한 회로기판의 접속 구조체, 이를위한 제조 방법 및 이를 이용한 접속 상태 평가방법 |
PCT/KR2007/000355 WO2007083963A1 (en) | 2006-01-20 | 2007-01-22 | Connecting structure and adhesion method of pcb using anisotropic conductive film, and method for evaluating connecting condition using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101371317A true CN101371317A (zh) | 2009-02-18 |
CN101371317B CN101371317B (zh) | 2011-04-20 |
Family
ID=38287850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007800026851A Expired - Fee Related CN101371317B (zh) | 2006-01-20 | 2007-01-22 | 使用各向异性导电膜的pcb的连接结构及粘附方法、及使用其评价连接状况的方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7993417B2 (zh) |
JP (1) | JP4987880B2 (zh) |
KR (1) | KR100747336B1 (zh) |
CN (1) | CN101371317B (zh) |
WO (1) | WO2007083963A1 (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102714916A (zh) * | 2009-12-02 | 2012-10-03 | 住友电气工业株式会社 | 印刷电路板连接结构、其制备方法以及各向异性导电粘合剂 |
CN104620403A (zh) * | 2012-09-14 | 2015-05-13 | 株式会社Lg化学 | Oled发光模块 |
WO2017070898A1 (en) * | 2015-10-29 | 2017-05-04 | Boe Technology Group Co., Ltd. | Anisotropic conductive film (acf), bonding structure, and display panel, and their fabrication methods |
CN104620403B (zh) * | 2012-09-14 | 2018-02-09 | 乐金显示有限公司 | Oled发光模块 |
CN110828327A (zh) * | 2018-08-13 | 2020-02-21 | 鹏鼎控股(深圳)股份有限公司 | 组件的电性连接方法和设备 |
Families Citing this family (11)
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JP4814277B2 (ja) * | 2008-04-18 | 2011-11-16 | ソニーケミカル&インフォメーションデバイス株式会社 | 接合体、該接合体の製造方法、及び該接合体に用いられる異方性導電膜 |
JP4816750B2 (ja) * | 2009-03-13 | 2011-11-16 | 住友電気工業株式会社 | プリント配線基板の接続方法 |
JP5668636B2 (ja) * | 2010-08-24 | 2015-02-12 | 日立化成株式会社 | 回路接続構造体の製造方法 |
JP5654289B2 (ja) * | 2010-08-26 | 2015-01-14 | デクセリアルズ株式会社 | 実装体の製造方法及び実装体並びに異方性導電膜 |
DE102012200485A1 (de) * | 2012-01-13 | 2013-07-18 | Osram Opto Semiconductors Gmbh | Organische lichtemittierende Vorrichtung und Verfahren zum Prozessieren einer organischen lichtemittierenden Vorrichtung |
KR101535600B1 (ko) * | 2012-11-06 | 2015-07-09 | 제일모직주식회사 | 이방성 도전 필름 및 반도체 장치 |
KR101551758B1 (ko) * | 2012-12-11 | 2015-09-09 | 제일모직주식회사 | 이방 도전성 필름용 조성물 및 이방 도전성 필름 |
JP6023581B2 (ja) * | 2012-12-26 | 2016-11-09 | 株式会社日立製作所 | 超音波振動子ユニットおよびその製造方法 |
KR101420543B1 (ko) * | 2012-12-31 | 2014-08-13 | 삼성전기주식회사 | 다층기판 |
EP2984437B1 (de) * | 2013-04-11 | 2017-07-12 | Basf Se | Rohrbündelapparat sowie dessen verwendung |
CN105828524A (zh) * | 2016-05-27 | 2016-08-03 | 深圳市华星光电技术有限公司 | 显示器、多段电路板及其制造方法 |
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JP3188546B2 (ja) * | 1993-03-23 | 2001-07-16 | キヤノン株式会社 | 絶縁体と導電体との接合体並びに接合方法 |
US5605547A (en) * | 1995-03-27 | 1997-02-25 | Micron Technology, Inc. | Method and apparatus for mounting a component to a substrate using an anisotropic adhesive, a compressive cover film, and a conveyor |
JPH10150266A (ja) | 1996-11-15 | 1998-06-02 | Kyocera Corp | 多層配線基板 |
US6086441A (en) * | 1997-04-30 | 2000-07-11 | Matsushita Electric Industrial Co., Ltd. | Method for connecting electrodes of plasma display panel |
US6274224B1 (en) * | 1999-02-01 | 2001-08-14 | 3M Innovative Properties Company | Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article |
JP3197540B2 (ja) * | 1999-02-05 | 2001-08-13 | ソニーケミカル株式会社 | 基板素片、及びフレキシブル基板 |
EP2161735A3 (en) * | 1999-03-05 | 2010-12-08 | Canon Kabushiki Kaisha | Image formation apparatus |
US6410415B1 (en) * | 1999-03-23 | 2002-06-25 | Polymer Flip Chip Corporation | Flip chip mounting technique |
JP2001047423A (ja) | 1999-08-09 | 2001-02-20 | Murata Mfg Co Ltd | 複合積層体およびその製造方法 |
JP3291482B2 (ja) * | 1999-08-31 | 2002-06-10 | 三井金属鉱業株式会社 | 整面電解銅箔、その製造方法および用途 |
JP3291486B2 (ja) * | 1999-09-06 | 2002-06-10 | 三井金属鉱業株式会社 | 整面電解銅箔、その製造方法およびその用途 |
US20020027294A1 (en) * | 2000-07-21 | 2002-03-07 | Neuhaus Herbert J. | Electrical component assembly and method of fabrication |
AU2001293304A1 (en) * | 2000-09-19 | 2002-04-02 | Nanopierce Technologies, Inc. | Method for assembling components and antennae in radio frequency identification devices |
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KR100589801B1 (ko) * | 2002-12-12 | 2006-06-14 | 세이코 엡슨 가부시키가이샤 | 전기 광학 장치용 기판, 전기 광학 장치용 기판의 제조방법, 전기 광학 장치, 전기 광학 장치의 제조 방법, 전자기기 및 마스크 |
KR100559937B1 (ko) * | 2003-01-08 | 2006-03-13 | 엘에스전선 주식회사 | 미세회로의 접속방법 및 그에 의한 접속 구조체 |
CN101553086B (zh) * | 2003-01-22 | 2011-08-31 | 日本电气株式会社 | 电路基板装置及布线基板间的连接方法 |
JP3908671B2 (ja) * | 2003-01-29 | 2007-04-25 | 松下電器産業株式会社 | 半導体装置およびそれを用いたディスプレイ装置 |
US20040227197A1 (en) * | 2003-02-28 | 2004-11-18 | Shinji Maekawa | Composition of carbon nitride, thin film transistor with the composition of carbon nitride, display device with the thin film transistor, and manufacturing method thereof |
US7837300B2 (en) * | 2004-07-15 | 2010-11-23 | Ricoh Company, Ltd. | Liquid jet head, manufacturing method of the liquid jet head, image forming device, nozzle member of the liquid jet head, repellent ink film forming method, cartridge, and liquid jet recording device |
JP2006072694A (ja) * | 2004-09-02 | 2006-03-16 | Matsushita Electric Ind Co Ltd | タッチパネル |
-
2006
- 2006-01-20 KR KR1020060006347A patent/KR100747336B1/ko not_active IP Right Cessation
-
2007
- 2007-01-22 WO PCT/KR2007/000355 patent/WO2007083963A1/en active Application Filing
- 2007-01-22 US US12/161,487 patent/US7993417B2/en not_active Expired - Fee Related
- 2007-01-22 CN CN2007800026851A patent/CN101371317B/zh not_active Expired - Fee Related
- 2007-01-22 JP JP2008550250A patent/JP4987880B2/ja not_active Expired - Fee Related
-
2011
- 2011-06-02 US US13/152,000 patent/US20110290538A1/en not_active Abandoned
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102714916A (zh) * | 2009-12-02 | 2012-10-03 | 住友电气工业株式会社 | 印刷电路板连接结构、其制备方法以及各向异性导电粘合剂 |
CN104620403A (zh) * | 2012-09-14 | 2015-05-13 | 株式会社Lg化学 | Oled发光模块 |
US9638400B2 (en) | 2012-09-14 | 2017-05-02 | Lg Display Co., Ltd. | OLED lighting module |
CN104620403B (zh) * | 2012-09-14 | 2018-02-09 | 乐金显示有限公司 | Oled发光模块 |
CN108119783A (zh) * | 2012-09-14 | 2018-06-05 | 乐金显示有限公司 | Oled发光模块 |
CN108119783B (zh) * | 2012-09-14 | 2020-03-31 | 乐金显示有限公司 | Oled发光模块 |
WO2017070898A1 (en) * | 2015-10-29 | 2017-05-04 | Boe Technology Group Co., Ltd. | Anisotropic conductive film (acf), bonding structure, and display panel, and their fabrication methods |
CN110828327A (zh) * | 2018-08-13 | 2020-02-21 | 鹏鼎控股(深圳)股份有限公司 | 组件的电性连接方法和设备 |
Also Published As
Publication number | Publication date |
---|---|
JP4987880B2 (ja) | 2012-07-25 |
US20090000807A1 (en) | 2009-01-01 |
CN101371317B (zh) | 2011-04-20 |
US7993417B2 (en) | 2011-08-09 |
KR20070076889A (ko) | 2007-07-25 |
KR100747336B1 (ko) | 2007-08-07 |
US20110290538A1 (en) | 2011-12-01 |
JP2009523306A (ja) | 2009-06-18 |
WO2007083963A1 (en) | 2007-07-26 |
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