CN101332580B - 抛光装置和抛光方法 - Google Patents

抛光装置和抛光方法 Download PDF

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Publication number
CN101332580B
CN101332580B CN2008101285883A CN200810128588A CN101332580B CN 101332580 B CN101332580 B CN 101332580B CN 2008101285883 A CN2008101285883 A CN 2008101285883A CN 200810128588 A CN200810128588 A CN 200810128588A CN 101332580 B CN101332580 B CN 101332580B
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CN
China
Prior art keywords
polishing
substrate
rubbing head
wafer
sand belt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2008101285883A
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English (en)
Chinese (zh)
Other versions
CN101332580A (zh
Inventor
高桥圭瑞
関正也
草宏明
伊藤贤也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
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Publication date
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Publication of CN101332580A publication Critical patent/CN101332580A/zh
Application granted granted Critical
Publication of CN101332580B publication Critical patent/CN101332580B/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/002—Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/16—Machines or devices using grinding or polishing belts; Accessories therefor for grinding other surfaces of particular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
CN2008101285883A 2007-06-29 2008-06-27 抛光装置和抛光方法 Active CN101332580B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007171959 2007-06-29
JP171959/2007 2007-06-29

Publications (2)

Publication Number Publication Date
CN101332580A CN101332580A (zh) 2008-12-31
CN101332580B true CN101332580B (zh) 2012-05-09

Family

ID=39816648

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008101285883A Active CN101332580B (zh) 2007-06-29 2008-06-27 抛光装置和抛光方法

Country Status (7)

Country Link
US (1) US7976361B2 (https=)
EP (1) EP2008769B1 (https=)
JP (2) JP5188285B2 (https=)
KR (1) KR101488993B1 (https=)
CN (1) CN101332580B (https=)
DE (1) DE602008005211D1 (https=)
TW (1) TWI436852B (https=)

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US8892238B2 (en) * 2009-10-06 2014-11-18 Edward T. Sweet Edge break details and processing
US20110081839A1 (en) * 2009-10-06 2011-04-07 Apple Inc. Method and apparatus for polishing a curved edge
CN101934489B (zh) * 2010-07-30 2012-10-03 溧阳市四方不锈钢制品有限公司 管坯焊缝打磨机
JP5649417B2 (ja) * 2010-11-26 2015-01-07 株式会社荏原製作所 固定砥粒を有する研磨テープを用いた基板の研磨方法
US8540551B2 (en) * 2010-12-15 2013-09-24 Corning Incorporated Glass edge finish system, belt assembly, and method for using same
CN102233536A (zh) * 2011-05-10 2011-11-09 淄博隆嘉工贸有限公司 陶瓷手模自动抛光机
TWI590915B (zh) * 2012-09-24 2017-07-11 荏原製作所股份有限公司 Grinding method
US9931726B2 (en) * 2013-01-31 2018-04-03 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer edge trimming tool using abrasive tape
JP6071611B2 (ja) * 2013-02-13 2017-02-01 Ｍｉｐｏｘ株式会社 オリエンテーションフラット等切り欠き部を有する、結晶材料から成るウエハの周縁を、研磨テープを使用して研磨することにより円形ウエハを製造する方法
JP2015000451A (ja) * 2013-06-17 2015-01-05 ワイエイシイ株式会社 基板表面加工装置
JP6113624B2 (ja) * 2013-10-11 2017-04-12 株式会社荏原製作所 基板処理装置および基板処理方法
CN105196140B (zh) * 2015-10-20 2017-05-31 慈溪市华表机械有限公司 一种外圆超精机
EP3335832B1 (en) * 2016-12-15 2021-02-03 Ebara Corporation Polishing apparatus and pressing pad for pressing polishing tool
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
JP6974067B2 (ja) * 2017-08-17 2021-12-01 株式会社荏原製作所 基板を研磨する方法および装置
JP7129166B2 (ja) * 2018-01-11 2022-09-01 株式会社荏原製作所 基板処理装置及び制御方法
JP7226711B2 (ja) * 2019-02-28 2023-02-21 範多機械株式会社 斫り装置
CN110405587B (zh) * 2019-07-29 2024-12-24 周口市超越科技电子有限公司 一种马达电枢自动抛光机
CN111745504B (zh) * 2020-05-20 2022-06-21 深圳市裕展精密科技有限公司 打磨机构、打磨装置及打磨方法
CN111941201B (zh) * 2020-08-21 2021-12-07 许昌学院 一种用于法布里-珀罗干涉仪镜板的高精度制造装置
CN114619338B (zh) * 2022-03-28 2024-11-15 南通市睿联环保设备有限公司 一种扫地车液压杆生产装置

Citations (1)

* Cited by examiner, † Cited by third party
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CN1977361A (zh) * 2005-04-19 2007-06-06 株式会社荏原制作所 基底处理设备

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JP2837342B2 (ja) * 1993-12-13 1998-12-16 日本ミクロコーティング株式会社 研磨装置
JP3081140B2 (ja) 1995-09-21 2000-08-28 日本ミクロコーティング株式会社 研磨テープによる研磨装置
NO306765B1 (no) * 1998-04-03 1999-12-20 Grobi As Anordning for kantrunding av hull i et arbeidsstykke
US6685539B1 (en) * 1999-08-24 2004-02-03 Ricoh Company, Ltd. Processing tool, method of producing tool, processing method and processing apparatus
US6629875B2 (en) * 2000-01-28 2003-10-07 Accretech Usa, Inc. Machine for grinding-polishing of a water edge
JP4156200B2 (ja) * 2001-01-09 2008-09-24 株式会社荏原製作所 研磨装置及び研磨方法
JP2003220546A (ja) * 2002-01-24 2003-08-05 Soken Kogyo Kk ベルト式研磨装置
JP4090247B2 (ja) * 2002-02-12 2008-05-28 株式会社荏原製作所 基板処理装置
JP4125148B2 (ja) 2003-02-03 2008-07-30 株式会社荏原製作所 基板処理装置
WO2005081301A1 (en) * 2004-02-25 2005-09-01 Ebara Corporation Polishing apparatus and substrate processing apparatus
JP5026957B2 (ja) * 2004-10-15 2012-09-19 株式会社東芝 研磨装置及び研磨方法
JP2006142388A (ja) * 2004-11-16 2006-06-08 Nihon Micro Coating Co Ltd 研磨テープ及び方法
WO2006112532A1 (en) 2005-04-19 2006-10-26 Ebara Corporation Substrate processing apparatus
JP5196709B2 (ja) * 2005-04-19 2013-05-15 株式会社荏原製作所 半導体ウエハ周縁研磨装置及び方法
JP2009518872A (ja) * 2005-12-09 2009-05-07 アプライド マテリアルズ インコーポレイテッド 基板を処理する方法及び装置
US7993485B2 (en) * 2005-12-09 2011-08-09 Applied Materials, Inc. Methods and apparatus for processing a substrate
JP2009532210A (ja) * 2006-03-30 2009-09-10 アプライド マテリアルズ インコーポレイテッド 基板の縁部を研摩するための方法及び装置
JP2008036783A (ja) * 2006-08-08 2008-02-21 Sony Corp 研磨方法および研磨装置
JP2008284684A (ja) * 2007-05-21 2008-11-27 Applied Materials Inc 研磨アームを使用して基板の縁部を研磨する方法及び装置

Patent Citations (1)

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CN1977361A (zh) * 2005-04-19 2007-06-06 株式会社荏原制作所 基底处理设备

Also Published As

Publication number Publication date
TW200932423A (en) 2009-08-01
DE602008005211D1 (de) 2011-04-14
JP5188285B2 (ja) 2013-04-24
KR101488993B1 (ko) 2015-02-02
JP2013075358A (ja) 2013-04-25
US7976361B2 (en) 2011-07-12
JP2009028892A (ja) 2009-02-12
KR20090004590A (ko) 2009-01-12
EP2008769A1 (en) 2008-12-31
JP5525590B2 (ja) 2014-06-18
EP2008769B1 (en) 2011-03-02
CN101332580A (zh) 2008-12-31
US20090004952A1 (en) 2009-01-01
TWI436852B (zh) 2014-05-11

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