DE602008005211D1 - Poliervorrichtung und Polierverfahren - Google Patents

Poliervorrichtung und Polierverfahren

Info

Publication number
DE602008005211D1
DE602008005211D1 DE602008005211T DE602008005211T DE602008005211D1 DE 602008005211 D1 DE602008005211 D1 DE 602008005211D1 DE 602008005211 T DE602008005211 T DE 602008005211T DE 602008005211 T DE602008005211 T DE 602008005211T DE 602008005211 D1 DE602008005211 D1 DE 602008005211D1
Authority
DE
Germany
Prior art keywords
polishing
polishing process
polishing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602008005211T
Other languages
German (de)
English (en)
Inventor
Tamami Takahashi
Masaya Seki
Hiroaki Kusa
Kenya Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of DE602008005211D1 publication Critical patent/DE602008005211D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/002—Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/16—Machines or devices using grinding or polishing belts; Accessories therefor for grinding other surfaces of particular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
DE602008005211T 2007-06-29 2008-06-23 Poliervorrichtung und Polierverfahren Active DE602008005211D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007171959 2007-06-29

Publications (1)

Publication Number Publication Date
DE602008005211D1 true DE602008005211D1 (de) 2011-04-14

Family

ID=39816648

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602008005211T Active DE602008005211D1 (de) 2007-06-29 2008-06-23 Poliervorrichtung und Polierverfahren

Country Status (7)

Country Link
US (1) US7976361B2 (https=)
EP (1) EP2008769B1 (https=)
JP (2) JP5188285B2 (https=)
KR (1) KR101488993B1 (https=)
CN (1) CN101332580B (https=)
DE (1) DE602008005211D1 (https=)
TW (1) TWI436852B (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8892238B2 (en) * 2009-10-06 2014-11-18 Edward T. Sweet Edge break details and processing
US20110081839A1 (en) * 2009-10-06 2011-04-07 Apple Inc. Method and apparatus for polishing a curved edge
CN101934489B (zh) * 2010-07-30 2012-10-03 溧阳市四方不锈钢制品有限公司 管坯焊缝打磨机
JP5649417B2 (ja) * 2010-11-26 2015-01-07 株式会社荏原製作所 固定砥粒を有する研磨テープを用いた基板の研磨方法
US8540551B2 (en) * 2010-12-15 2013-09-24 Corning Incorporated Glass edge finish system, belt assembly, and method for using same
CN102233536A (zh) * 2011-05-10 2011-11-09 淄博隆嘉工贸有限公司 陶瓷手模自动抛光机
TWI590915B (zh) * 2012-09-24 2017-07-11 荏原製作所股份有限公司 Grinding method
US9931726B2 (en) * 2013-01-31 2018-04-03 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer edge trimming tool using abrasive tape
JP6071611B2 (ja) * 2013-02-13 2017-02-01 Ｍｉｐｏｘ株式会社 オリエンテーションフラット等切り欠き部を有する、結晶材料から成るウエハの周縁を、研磨テープを使用して研磨することにより円形ウエハを製造する方法
JP2015000451A (ja) * 2013-06-17 2015-01-05 ワイエイシイ株式会社 基板表面加工装置
JP6113624B2 (ja) * 2013-10-11 2017-04-12 株式会社荏原製作所 基板処理装置および基板処理方法
CN105196140B (zh) * 2015-10-20 2017-05-31 慈溪市华表机械有限公司 一种外圆超精机
EP3335832B1 (en) * 2016-12-15 2021-02-03 Ebara Corporation Polishing apparatus and pressing pad for pressing polishing tool
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
JP6974067B2 (ja) * 2017-08-17 2021-12-01 株式会社荏原製作所 基板を研磨する方法および装置
JP7129166B2 (ja) * 2018-01-11 2022-09-01 株式会社荏原製作所 基板処理装置及び制御方法
JP7226711B2 (ja) * 2019-02-28 2023-02-21 範多機械株式会社 斫り装置
CN110405587B (zh) * 2019-07-29 2024-12-24 周口市超越科技电子有限公司 一种马达电枢自动抛光机
CN111745504B (zh) * 2020-05-20 2022-06-21 深圳市裕展精密科技有限公司 打磨机构、打磨装置及打磨方法
CN111941201B (zh) * 2020-08-21 2021-12-07 许昌学院 一种用于法布里-珀罗干涉仪镜板的高精度制造装置
CN114619338B (zh) * 2022-03-28 2024-11-15 南通市睿联环保设备有限公司 一种扫地车液压杆生产装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2837342B2 (ja) * 1993-12-13 1998-12-16 日本ミクロコーティング株式会社 研磨装置
JP3081140B2 (ja) 1995-09-21 2000-08-28 日本ミクロコーティング株式会社 研磨テープによる研磨装置
NO306765B1 (no) * 1998-04-03 1999-12-20 Grobi As Anordning for kantrunding av hull i et arbeidsstykke
US6685539B1 (en) * 1999-08-24 2004-02-03 Ricoh Company, Ltd. Processing tool, method of producing tool, processing method and processing apparatus
US6629875B2 (en) * 2000-01-28 2003-10-07 Accretech Usa, Inc. Machine for grinding-polishing of a water edge
JP4156200B2 (ja) * 2001-01-09 2008-09-24 株式会社荏原製作所 研磨装置及び研磨方法
JP2003220546A (ja) * 2002-01-24 2003-08-05 Soken Kogyo Kk ベルト式研磨装置
JP4090247B2 (ja) * 2002-02-12 2008-05-28 株式会社荏原製作所 基板処理装置
JP4125148B2 (ja) 2003-02-03 2008-07-30 株式会社荏原製作所 基板処理装置
WO2005081301A1 (en) * 2004-02-25 2005-09-01 Ebara Corporation Polishing apparatus and substrate processing apparatus
JP5026957B2 (ja) * 2004-10-15 2012-09-19 株式会社東芝 研磨装置及び研磨方法
JP2006142388A (ja) * 2004-11-16 2006-06-08 Nihon Micro Coating Co Ltd 研磨テープ及び方法
EP1872392B1 (en) 2005-04-19 2012-02-22 Ebara Corporation Substrate processing apparatus
WO2006112532A1 (en) 2005-04-19 2006-10-26 Ebara Corporation Substrate processing apparatus
JP5196709B2 (ja) * 2005-04-19 2013-05-15 株式会社荏原製作所 半導体ウエハ周縁研磨装置及び方法
JP2009518872A (ja) * 2005-12-09 2009-05-07 アプライド マテリアルズ インコーポレイテッド 基板を処理する方法及び装置
US7993485B2 (en) * 2005-12-09 2011-08-09 Applied Materials, Inc. Methods and apparatus for processing a substrate
JP2009532210A (ja) * 2006-03-30 2009-09-10 アプライド マテリアルズ インコーポレイテッド 基板の縁部を研摩するための方法及び装置
JP2008036783A (ja) * 2006-08-08 2008-02-21 Sony Corp 研磨方法および研磨装置
JP2008284684A (ja) * 2007-05-21 2008-11-27 Applied Materials Inc 研磨アームを使用して基板の縁部を研磨する方法及び装置

Also Published As

Publication number Publication date
CN101332580B (zh) 2012-05-09
TW200932423A (en) 2009-08-01
JP5188285B2 (ja) 2013-04-24
KR101488993B1 (ko) 2015-02-02
JP2013075358A (ja) 2013-04-25
US7976361B2 (en) 2011-07-12
JP2009028892A (ja) 2009-02-12
KR20090004590A (ko) 2009-01-12
EP2008769A1 (en) 2008-12-31
JP5525590B2 (ja) 2014-06-18
EP2008769B1 (en) 2011-03-02
CN101332580A (zh) 2008-12-31
US20090004952A1 (en) 2009-01-01
TWI436852B (zh) 2014-05-11

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