CN101311346A - 制造多晶硅的方法 - Google Patents
制造多晶硅的方法 Download PDFInfo
- Publication number
- CN101311346A CN101311346A CNA2008100850833A CN200810085083A CN101311346A CN 101311346 A CN101311346 A CN 101311346A CN A2008100850833 A CNA2008100850833 A CN A2008100850833A CN 200810085083 A CN200810085083 A CN 200810085083A CN 101311346 A CN101311346 A CN 101311346A
- Authority
- CN
- China
- Prior art keywords
- gas
- reductive agent
- chlorine
- silicon
- waste gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910021420 polycrystalline silicon Inorganic materials 0.000 title claims abstract description 54
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims abstract description 47
- 229920005591 polysilicon Polymers 0.000 title claims description 50
- 230000002829 reductive effect Effects 0.000 claims abstract description 99
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 claims abstract description 57
- 238000006243 chemical reaction Methods 0.000 claims abstract description 26
- 238000010574 gas phase reaction Methods 0.000 claims abstract description 16
- 239000012535 impurity Substances 0.000 claims abstract description 16
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims abstract description 8
- 239000007789 gas Substances 0.000 claims description 114
- 239000003795 chemical substances by application Substances 0.000 claims description 95
- 239000000460 chlorine Substances 0.000 claims description 68
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 65
- 229910052801 chlorine Inorganic materials 0.000 claims description 65
- 239000002912 waste gas Substances 0.000 claims description 65
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 26
- 239000011701 zinc Substances 0.000 claims description 26
- 229910052725 zinc Inorganic materials 0.000 claims description 26
- 238000005660 chlorination reaction Methods 0.000 claims description 20
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 claims description 15
- 239000005049 silicon tetrachloride Substances 0.000 claims description 15
- 239000006227 byproduct Substances 0.000 claims description 14
- 239000000376 reactant Substances 0.000 claims description 6
- 238000011084 recovery Methods 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 4
- 239000011777 magnesium Substances 0.000 claims description 4
- 239000011734 sodium Substances 0.000 claims description 4
- 239000005046 Chlorosilane Substances 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 3
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 230000000977 initiatory effect Effects 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 239000011591 potassium Substances 0.000 claims description 3
- 229910052700 potassium Inorganic materials 0.000 claims description 3
- 229910052708 sodium Inorganic materials 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- 239000002994 raw material Substances 0.000 abstract description 10
- 239000002699 waste material Substances 0.000 abstract description 8
- 239000011856 silicon-based particle Substances 0.000 abstract description 2
- 239000003638 chemical reducing agent Substances 0.000 abstract 3
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 abstract 1
- 230000003247 decreasing effect Effects 0.000 abstract 1
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 36
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 33
- 229910052710 silicon Inorganic materials 0.000 description 33
- 239000010703 silicon Substances 0.000 description 33
- 238000006722 reduction reaction Methods 0.000 description 19
- 238000005868 electrolysis reaction Methods 0.000 description 18
- 235000005074 zinc chloride Nutrition 0.000 description 18
- 239000011592 zinc chloride Substances 0.000 description 18
- 238000000746 purification Methods 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 238000001816 cooling Methods 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 239000010453 quartz Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 150000003839 salts Chemical class 0.000 description 7
- 238000001914 filtration Methods 0.000 description 6
- 239000000284 extract Substances 0.000 description 5
- 238000004821 distillation Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 238000010248 power generation Methods 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000002354 inductively-coupled plasma atomic emission spectroscopy Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000004626 scanning electron microscopy Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- KPZGRMZPZLOPBS-UHFFFAOYSA-N 1,3-dichloro-2,2-bis(chloromethyl)propane Chemical compound ClCC(CCl)(CCl)CCl KPZGRMZPZLOPBS-UHFFFAOYSA-N 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000001637 plasma atomic emission spectroscopy Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000550 scanning electron microscopy energy dispersive X-ray spectroscopy Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/021—Preparation
- C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
- C01B33/033—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by reduction of silicon halides or halosilanes with a metal or a metallic alloy as the only reducing agents
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Silicon Compounds (AREA)
- Manufacture And Refinement Of Metals (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-069885 | 2007-03-19 | ||
JP2007069885A JP5018156B2 (ja) | 2007-03-19 | 2007-03-19 | 多結晶シリコンの製造方法 |
JP2007069885 | 2007-03-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101311346A true CN101311346A (zh) | 2008-11-26 |
CN101311346B CN101311346B (zh) | 2012-03-21 |
Family
ID=39736372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008100850833A Expired - Fee Related CN101311346B (zh) | 2007-03-19 | 2008-03-17 | 制造多晶硅的方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7815884B2 (zh) |
JP (1) | JP5018156B2 (zh) |
KR (1) | KR101365171B1 (zh) |
CN (1) | CN101311346B (zh) |
DE (1) | DE102008012711A1 (zh) |
TW (1) | TWI426160B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102438946A (zh) * | 2009-05-22 | 2012-05-02 | 旭硝子株式会社 | 硅制造装置及硅制造方法 |
CN102741166A (zh) * | 2010-01-22 | 2012-10-17 | 克斯莫石油株式会社 | 多晶硅的制造方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7922814B2 (en) * | 2005-11-29 | 2011-04-12 | Chisso Corporation | Production process for high purity polycrystal silicon and production apparatus for the same |
JP4630993B2 (ja) * | 2008-08-31 | 2011-02-09 | 北京中晶華業科技有限公司 | 高純度シリコンの製造方法 |
JP5586005B2 (ja) * | 2008-12-10 | 2014-09-10 | 独立行政法人物質・材料研究機構 | シリコンの製造方法 |
JP5180947B2 (ja) * | 2009-12-09 | 2013-04-10 | コスモ石油株式会社 | 多結晶シリコン製造用の反応炉の洗浄方法 |
JP5383604B2 (ja) * | 2010-07-22 | 2014-01-08 | コスモ石油株式会社 | 多結晶シリコン製造用の反応炉 |
US11827993B1 (en) | 2020-09-18 | 2023-11-28 | GRU Energy Lab Inc. | Methods of forming active materials for electrochemical cells using low-temperature electrochemical deposition |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52133022A (en) * | 1976-04-30 | 1977-11-08 | Mitsubishi Metal Corp | Production of high purity silicon |
JP3844856B2 (ja) | 1997-09-11 | 2006-11-15 | 住友チタニウム株式会社 | 高純度シリコンの製造方法 |
JP2003034519A (ja) * | 2001-07-18 | 2003-02-07 | Yutaka Kamaike | シリコンの製造方法 |
JP2003342016A (ja) | 2002-05-24 | 2003-12-03 | Takayuki Shimamune | 多結晶シリコンの製造方法 |
JP2004035382A (ja) * | 2002-06-28 | 2004-02-05 | Takayuki Shimamune | 多結晶シリコンの製造方法 |
JP4462839B2 (ja) * | 2003-03-19 | 2010-05-12 | 株式会社キノテック・ソーラーエナジー | シリコンの製造装置及び製造方法 |
AU2003264408A1 (en) * | 2002-09-12 | 2004-05-04 | Takayuki Shimamune | Process for producing high-purity silicon and apparatus |
JP2004099421A (ja) | 2002-09-12 | 2004-04-02 | Takayuki Shimamune | シリコンの製造方法 |
CN1222471C (zh) * | 2002-10-23 | 2005-10-12 | 同济大学 | 用三氯氢硅和四氯化硅混合源生产多晶硅的方法 |
JP4780271B2 (ja) * | 2004-04-30 | 2011-09-28 | 三菱マテリアル株式会社 | 多結晶シリコンの製造方法 |
JP4740646B2 (ja) * | 2005-05-18 | 2011-08-03 | 株式会社トクヤマ | シリコンの製造方法 |
US7922814B2 (en) * | 2005-11-29 | 2011-04-12 | Chisso Corporation | Production process for high purity polycrystal silicon and production apparatus for the same |
JP5205776B2 (ja) * | 2007-03-12 | 2013-06-05 | Jnc株式会社 | 固体生成物の製造方法及び製造装置 |
JP5040717B2 (ja) * | 2007-03-19 | 2012-10-03 | Jnc株式会社 | 高純度シリコンの製造方法 |
-
2007
- 2007-03-19 JP JP2007069885A patent/JP5018156B2/ja not_active Expired - Fee Related
-
2008
- 2008-03-05 DE DE102008012711A patent/DE102008012711A1/de not_active Withdrawn
- 2008-03-17 TW TW097109329A patent/TWI426160B/zh not_active IP Right Cessation
- 2008-03-17 KR KR1020080024273A patent/KR101365171B1/ko not_active IP Right Cessation
- 2008-03-17 CN CN2008100850833A patent/CN101311346B/zh not_active Expired - Fee Related
- 2008-03-19 US US12/051,536 patent/US7815884B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102438946A (zh) * | 2009-05-22 | 2012-05-02 | 旭硝子株式会社 | 硅制造装置及硅制造方法 |
CN102741166A (zh) * | 2010-01-22 | 2012-10-17 | 克斯莫石油株式会社 | 多晶硅的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20080233038A1 (en) | 2008-09-25 |
TW200839040A (en) | 2008-10-01 |
TWI426160B (zh) | 2014-02-11 |
CN101311346B (zh) | 2012-03-21 |
JP2008230871A (ja) | 2008-10-02 |
US7815884B2 (en) | 2010-10-19 |
DE102008012711A1 (de) | 2008-10-09 |
KR101365171B1 (ko) | 2014-02-21 |
KR20080085715A (ko) | 2008-09-24 |
JP5018156B2 (ja) | 2012-09-05 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: JNC CORPORATION Free format text: FORMER OWNER: CHISSO CORPORATION Effective date: 20111027 |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20111027 Address after: Japan Tokyo Chiyoda Otemachi two chome 2 No. 1 Applicant after: JNC Corporation Address before: Japan Osaka Osaka North Island in the three chome 3 No. 23 Applicant before: Chisso Corporation |
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C14 | Grant of patent or utility model | ||
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120321 Termination date: 20160317 |