CN101275062A - 粘合剂组合物、粘合片以及半导体装置的制造方法 - Google Patents

粘合剂组合物、粘合片以及半导体装置的制造方法 Download PDF

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Publication number
CN101275062A
CN101275062A CNA2008100883362A CN200810088336A CN101275062A CN 101275062 A CN101275062 A CN 101275062A CN A2008100883362 A CNA2008100883362 A CN A2008100883362A CN 200810088336 A CN200810088336 A CN 200810088336A CN 101275062 A CN101275062 A CN 101275062A
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CN
China
Prior art keywords
adhesive
weight
adhesive composition
chip
adhesive layer
Prior art date
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Pending
Application number
CNA2008100883362A
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English (en)
Chinese (zh)
Inventor
市川功
佐伯尚哉
贱机弘宪
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Lintec Corp
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Lintec Corp
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Publication of CN101275062A publication Critical patent/CN101275062A/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/417—Bonding materials between chips and die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01331—Manufacture or treatment of die-attach connectors using blanket deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
CNA2008100883362A 2007-03-29 2008-03-28 粘合剂组合物、粘合片以及半导体装置的制造方法 Pending CN101275062A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007087217A JP2008247936A (ja) 2007-03-29 2007-03-29 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP2007-087217 2007-03-29

Publications (1)

Publication Number Publication Date
CN101275062A true CN101275062A (zh) 2008-10-01

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CNA2008100883362A Pending CN101275062A (zh) 2007-03-29 2008-03-28 粘合剂组合物、粘合片以及半导体装置的制造方法

Country Status (5)

Country Link
US (1) US20080242058A1 (https=)
JP (1) JP2008247936A (https=)
KR (1) KR20080088487A (https=)
CN (1) CN101275062A (https=)
TW (1) TW200904924A (https=)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101513784B (zh) * 2008-02-22 2012-10-10 精工爱普生株式会社 接合体及接合方法
TWI397568B (zh) * 2008-11-28 2013-06-01 琳得科股份有限公司 半導體晶片層合體及半導體晶片層合用接著劑組成物
CN103140558A (zh) * 2010-09-30 2013-06-05 株式会社Kcc 用于制备半导体封装的粘合剂组合物及粘合片材
CN103262172A (zh) * 2010-11-03 2013-08-21 弗赖斯金属有限公司 烧结材料及使用该材料的附着方法
CN103571367A (zh) * 2013-11-08 2014-02-12 烟台德邦科技有限公司 一种晶圆减薄压敏胶及其制备方法
CN104497894A (zh) * 2014-12-31 2015-04-08 镇江市港南电子有限公司 一种晶片切割用胶粘剂
CN105706228A (zh) * 2013-11-08 2016-06-22 琳得科株式会社 保护膜形成用组合物、保护膜形成用片、以及带有保护膜的芯片
CN109825223A (zh) * 2017-11-23 2019-05-31 Ｋｃｃ公司 粘合剂组合物以及利用其的粘合膜
CN113710762A (zh) * 2019-02-26 2021-11-26 艾利丹尼森公司 具有高剪切和剥离性质的psa组合物

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101035873B1 (ko) * 2008-12-24 2011-05-19 제일모직주식회사 고온 속경화형 접착필름 조성물 및 이를 이용한 접착필름
JP2010222390A (ja) * 2009-03-19 2010-10-07 Lintec Corp 接着剤組成物、接着シートおよび半導体装置の製造方法
EP2512674B1 (en) 2009-12-15 2018-04-04 Sicpa Holding Sa Process for assembling elements containing biological substances
WO2013042203A1 (ja) * 2011-09-20 2013-03-28 日立化成株式会社 接着剤組成物、フィルム状接着剤、接着シート、回路接続体及び回路部材の接続方法
US8685833B2 (en) * 2012-04-02 2014-04-01 International Business Machines Corporation Stress reduction means for warp control of substrates through clamping
WO2013157567A1 (ja) * 2012-04-17 2013-10-24 リンテック株式会社 接着剤組成物、接着シートおよび半導体装置の製造方法
JP5862901B2 (ja) * 2013-12-13 2016-02-16 Jnc株式会社 光硬化性インクジェット用インク
JP6721325B2 (ja) * 2015-12-14 2020-07-15 デクセリアルズ株式会社 熱硬化性接着シート、及び半導体装置の製造方法
KR102069314B1 (ko) * 2016-10-05 2020-01-22 주식회사 엘지화학 반도체 접착용 수지 조성물, 반도체용 접착 필름 및 다이싱 다이본딩 필름
KR102136705B1 (ko) 2017-06-02 2020-07-22 주식회사 엘지화학 이액형 접착제 조성물
CN112940658A (zh) * 2021-02-01 2021-06-11 南宁珀源能源材料有限公司 一种粘棒胶及其制备方法和应用

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JPH0715087B2 (ja) * 1988-07-21 1995-02-22 リンテック株式会社 粘接着テープおよびその使用方法
JP3739488B2 (ja) * 1996-06-25 2006-01-25 リンテック株式会社 粘接着テープおよびその使用方法
JP4275221B2 (ja) * 1998-07-06 2009-06-10 リンテック株式会社 粘接着剤組成物および粘接着シート
WO2000078887A1 (en) * 1999-06-18 2000-12-28 Hitachi Chemical Company, Ltd. Adhesive, adhesive member, circuit substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same
WO2001060938A1 (fr) * 2000-02-15 2001-08-23 Hitachi Chemical Co., Ltd. Composition adhesive, procede de production de ladite resine, film adhesif fabrique a partir de ladite resine, substrat pour montage de semi-conducteur et dispositif semi-conducteur
JP3711842B2 (ja) * 2000-06-01 2005-11-02 ソニーケミカル株式会社 異方性導電接続材料及び接続構造体
JP3912076B2 (ja) * 2001-11-09 2007-05-09 日立化成工業株式会社 接着シートならびに半導体装置およびその製造方法
JP4244777B2 (ja) * 2002-10-18 2009-03-25 日立化成工業株式会社 硬化性樹脂の硬化促進剤、硬化性樹脂組成物、電子部品装置、及びホスフィン誘導体の製造方法
JP4283596B2 (ja) * 2003-05-29 2009-06-24 日東電工株式会社 チップ状ワークの固定方法
US20050267286A1 (en) * 2003-10-20 2005-12-01 Shinya Nakamura Curing accelerator for curing resin, curing resin composition, electronic component device and method for producing phosphine derivative
JP4421972B2 (ja) * 2004-04-30 2010-02-24 日東電工株式会社 半導体装置の製法
JP3754700B1 (ja) * 2004-09-02 2006-03-15 住友ベークライト株式会社 半導体用接着フィルム及びこれを用いた半導体装置
JP2006269887A (ja) * 2005-03-25 2006-10-05 Sumitomo Bakelite Co Ltd 半導体用接着フィルム及びこれを用いた半導体装置

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101513784B (zh) * 2008-02-22 2012-10-10 精工爱普生株式会社 接合体及接合方法
US8716401B2 (en) 2008-11-28 2014-05-06 Lintec Corporation Semiconductor chip laminate and adhesive composition for semiconductor chip lamination
TWI397568B (zh) * 2008-11-28 2013-06-01 琳得科股份有限公司 半導體晶片層合體及半導體晶片層合用接著劑組成物
CN103140558A (zh) * 2010-09-30 2013-06-05 株式会社Kcc 用于制备半导体封装的粘合剂组合物及粘合片材
CN103262172B (zh) * 2010-11-03 2018-05-15 阿尔发装配解决方案有限公司 烧结材料及使用该材料的附着方法
CN103262172A (zh) * 2010-11-03 2013-08-21 弗赖斯金属有限公司 烧结材料及使用该材料的附着方法
CN103571367A (zh) * 2013-11-08 2014-02-12 烟台德邦科技有限公司 一种晶圆减薄压敏胶及其制备方法
CN105706228A (zh) * 2013-11-08 2016-06-22 琳得科株式会社 保护膜形成用组合物、保护膜形成用片、以及带有保护膜的芯片
US9890293B2 (en) 2013-11-08 2018-02-13 Lintec Corporation Protective film forming composition, protective film forming sheet, and chip provided with protective film
CN104497894A (zh) * 2014-12-31 2015-04-08 镇江市港南电子有限公司 一种晶片切割用胶粘剂
CN109825223A (zh) * 2017-11-23 2019-05-31 Ｋｃｃ公司 粘合剂组合物以及利用其的粘合膜
CN113710762A (zh) * 2019-02-26 2021-11-26 艾利丹尼森公司 具有高剪切和剥离性质的psa组合物
CN113710762B (zh) * 2019-02-26 2023-08-04 艾利丹尼森公司 具有高剪切和剥离性质的psa组合物

Also Published As

Publication number Publication date
KR20080088487A (ko) 2008-10-02
TW200904924A (en) 2009-02-01
US20080242058A1 (en) 2008-10-02
JP2008247936A (ja) 2008-10-16

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Application publication date: 20081001