JP2008247936A - 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 - Google Patents

粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 Download PDF

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Publication number
JP2008247936A
JP2008247936A JP2007087217A JP2007087217A JP2008247936A JP 2008247936 A JP2008247936 A JP 2008247936A JP 2007087217 A JP2007087217 A JP 2007087217A JP 2007087217 A JP2007087217 A JP 2007087217A JP 2008247936 A JP2008247936 A JP 2008247936A
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JP
Japan
Prior art keywords
adhesive
adhesive layer
adhesive composition
chip
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007087217A
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English (en)
Japanese (ja)
Other versions
JP2008247936A5 (https=
Inventor
Isao Ichikawa
功 市川
Naoya Saeki
尚哉 佐伯
Hironori Shizuhata
弘憲 賤機
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2007087217A priority Critical patent/JP2008247936A/ja
Priority to US12/055,427 priority patent/US20080242058A1/en
Priority to KR1020080028784A priority patent/KR20080088487A/ko
Priority to CNA2008100883362A priority patent/CN101275062A/zh
Priority to TW097111228A priority patent/TW200904924A/zh
Publication of JP2008247936A publication Critical patent/JP2008247936A/ja
Publication of JP2008247936A5 publication Critical patent/JP2008247936A5/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/417—Bonding materials between chips and die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01331—Manufacture or treatment of die-attach connectors using blanket deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
JP2007087217A 2007-03-29 2007-03-29 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 Pending JP2008247936A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007087217A JP2008247936A (ja) 2007-03-29 2007-03-29 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
US12/055,427 US20080242058A1 (en) 2007-03-29 2008-03-26 Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device
KR1020080028784A KR20080088487A (ko) 2007-03-29 2008-03-28 점접착제 조성물, 점접착 시트 및 반도체장치의 제조방법
CNA2008100883362A CN101275062A (zh) 2007-03-29 2008-03-28 粘合剂组合物、粘合片以及半导体装置的制造方法
TW097111228A TW200904924A (en) 2007-03-29 2008-03-28 Adhesive composition, adhesive sheet and production process for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007087217A JP2008247936A (ja) 2007-03-29 2007-03-29 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2008247936A true JP2008247936A (ja) 2008-10-16
JP2008247936A5 JP2008247936A5 (https=) 2009-11-05

Family

ID=39795165

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007087217A Pending JP2008247936A (ja) 2007-03-29 2007-03-29 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法

Country Status (5)

Country Link
US (1) US20080242058A1 (https=)
JP (1) JP2008247936A (https=)
KR (1) KR20080088487A (https=)
CN (1) CN101275062A (https=)
TW (1) TW200904924A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010222390A (ja) * 2009-03-19 2010-10-07 Lintec Corp 接着剤組成物、接着シートおよび半導体装置の製造方法
WO2013157567A1 (ja) * 2012-04-17 2013-10-24 リンテック株式会社 接着剤組成物、接着シートおよび半導体装置の製造方法
JP2014088567A (ja) * 2013-12-13 2014-05-15 Jnc Corp 光硬化性インクジェット用インク
JP2019506503A (ja) * 2016-10-05 2019-03-07 エルジー・ケム・リミテッド 半導体接着用樹脂組成物、半導体用接着フィルムおよびダイシングダイボンディングフィルム

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4697243B2 (ja) * 2008-02-22 2011-06-08 セイコーエプソン株式会社 接合体および接合方法
JP5089560B2 (ja) * 2008-11-28 2012-12-05 リンテック株式会社 半導体チップ積層体および半導体チップ積層用接着剤組成物
KR101035873B1 (ko) * 2008-12-24 2011-05-19 제일모직주식회사 고온 속경화형 접착필름 조성물 및 이를 이용한 접착필름
EP2512674B1 (en) 2009-12-15 2018-04-04 Sicpa Holding Sa Process for assembling elements containing biological substances
KR101176957B1 (ko) * 2010-09-30 2012-09-07 주식회사 케이씨씨 반도체 패키지 제작용 접착제 조성물 및 접착시트
SG10201913296SA (en) * 2010-11-03 2020-02-27 Frys Metals Inc Sintering materials and attachment methods using same
WO2013042203A1 (ja) * 2011-09-20 2013-03-28 日立化成株式会社 接着剤組成物、フィルム状接着剤、接着シート、回路接続体及び回路部材の接続方法
US8685833B2 (en) * 2012-04-02 2014-04-01 International Business Machines Corporation Stress reduction means for warp control of substrates through clamping
CN103571367B (zh) * 2013-11-08 2014-10-22 烟台德邦科技有限公司 一种晶圆减薄压敏胶及其制备方法
WO2015068551A1 (ja) * 2013-11-08 2015-05-14 リンテック株式会社 保護膜形成用組成物、保護膜形成用シート、及び保護膜付きチップ
CN104497894B (zh) * 2014-12-31 2017-02-08 徐丹 一种晶片切割用胶粘剂
JP6721325B2 (ja) * 2015-12-14 2020-07-15 デクセリアルズ株式会社 熱硬化性接着シート、及び半導体装置の製造方法
KR102136705B1 (ko) 2017-06-02 2020-07-22 주식회사 엘지화학 이액형 접착제 조성물
KR20190059648A (ko) * 2017-11-23 2019-05-31 주식회사 케이씨씨 접착제 조성물 및 이를 사용한 접착필름
EP3931279A4 (en) * 2019-02-26 2022-10-05 Avery Dennison Corporation PSA COMPOSITION WITH HIGH SHEAR AND PEEL PROPERTIES
CN112940658A (zh) * 2021-02-01 2021-06-11 南宁珀源能源材料有限公司 一种粘棒胶及其制备方法和应用

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH108001A (ja) * 1996-06-25 1998-01-13 Lintec Corp 粘接着テープおよびその使用方法
JP2001345349A (ja) * 2000-06-01 2001-12-14 Sony Chem Corp 接続材料及び接続構造体
JP2003147299A (ja) * 2001-11-09 2003-05-21 Hitachi Chem Co Ltd 接着シートならびに半導体装置およびその製造方法
JP2004156036A (ja) * 2002-10-18 2004-06-03 Hitachi Chem Co Ltd 硬化性樹脂の硬化促進剤、硬化性樹脂組成物、電子部品装置、及びホスフィン誘導体の製造方法
JP2004356412A (ja) * 2003-05-29 2004-12-16 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2005340746A (ja) * 2004-04-30 2005-12-08 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置、ならびに半導体装置の製法
JP2006073982A (ja) * 2004-09-02 2006-03-16 Sumitomo Bakelite Co Ltd 半導体用接着フィルム及びこれを用いた半導体装置
JP2006269887A (ja) * 2005-03-25 2006-10-05 Sumitomo Bakelite Co Ltd 半導体用接着フィルム及びこれを用いた半導体装置

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JPH0715087B2 (ja) * 1988-07-21 1995-02-22 リンテック株式会社 粘接着テープおよびその使用方法
JP4275221B2 (ja) * 1998-07-06 2009-06-10 リンテック株式会社 粘接着剤組成物および粘接着シート
WO2000078887A1 (en) * 1999-06-18 2000-12-28 Hitachi Chemical Company, Ltd. Adhesive, adhesive member, circuit substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same
WO2001060938A1 (fr) * 2000-02-15 2001-08-23 Hitachi Chemical Co., Ltd. Composition adhesive, procede de production de ladite resine, film adhesif fabrique a partir de ladite resine, substrat pour montage de semi-conducteur et dispositif semi-conducteur
US20050267286A1 (en) * 2003-10-20 2005-12-01 Shinya Nakamura Curing accelerator for curing resin, curing resin composition, electronic component device and method for producing phosphine derivative

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH108001A (ja) * 1996-06-25 1998-01-13 Lintec Corp 粘接着テープおよびその使用方法
JP2001345349A (ja) * 2000-06-01 2001-12-14 Sony Chem Corp 接続材料及び接続構造体
JP2003147299A (ja) * 2001-11-09 2003-05-21 Hitachi Chem Co Ltd 接着シートならびに半導体装置およびその製造方法
JP2004156036A (ja) * 2002-10-18 2004-06-03 Hitachi Chem Co Ltd 硬化性樹脂の硬化促進剤、硬化性樹脂組成物、電子部品装置、及びホスフィン誘導体の製造方法
JP2004356412A (ja) * 2003-05-29 2004-12-16 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2005340746A (ja) * 2004-04-30 2005-12-08 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置、ならびに半導体装置の製法
JP2006073982A (ja) * 2004-09-02 2006-03-16 Sumitomo Bakelite Co Ltd 半導体用接着フィルム及びこれを用いた半導体装置
JP2006269887A (ja) * 2005-03-25 2006-10-05 Sumitomo Bakelite Co Ltd 半導体用接着フィルム及びこれを用いた半導体装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010222390A (ja) * 2009-03-19 2010-10-07 Lintec Corp 接着剤組成物、接着シートおよび半導体装置の製造方法
WO2013157567A1 (ja) * 2012-04-17 2013-10-24 リンテック株式会社 接着剤組成物、接着シートおよび半導体装置の製造方法
JPWO2013157567A1 (ja) * 2012-04-17 2015-12-21 リンテック株式会社 接着剤組成物、接着シートおよび半導体装置の製造方法
JP2014088567A (ja) * 2013-12-13 2014-05-15 Jnc Corp 光硬化性インクジェット用インク
JP2019506503A (ja) * 2016-10-05 2019-03-07 エルジー・ケム・リミテッド 半導体接着用樹脂組成物、半導体用接着フィルムおよびダイシングダイボンディングフィルム

Also Published As

Publication number Publication date
KR20080088487A (ko) 2008-10-02
TW200904924A (en) 2009-02-01
CN101275062A (zh) 2008-10-01
US20080242058A1 (en) 2008-10-02

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