CN101208454A - 晶片处理系统及制造晶片的方法 - Google Patents

晶片处理系统及制造晶片的方法 Download PDF

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Publication number
CN101208454A
CN101208454A CNA2005800395984A CN200580039598A CN101208454A CN 101208454 A CN101208454 A CN 101208454A CN A2005800395984 A CNA2005800395984 A CN A2005800395984A CN 200580039598 A CN200580039598 A CN 200580039598A CN 101208454 A CN101208454 A CN 101208454A
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CN
China
Prior art keywords
chamber
wafer
row
treatment
process according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005800395984A
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English (en)
Chinese (zh)
Inventor
凯文·P·费尔贝恩
哈里·蓬内坎蒂
克里斯托弗·莱恩
罗伯特·爱德华·韦斯
伊恩·拉奇福特
特里·布卢克
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Intevac Inc
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Intevac Inc
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Filing date
Publication date
Application filed by Intevac Inc filed Critical Intevac Inc
Publication of CN101208454A publication Critical patent/CN101208454A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
CNA2005800395984A 2004-11-18 2005-10-31 晶片处理系统及制造晶片的方法 Pending CN101208454A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/991,722 US20060102078A1 (en) 2004-11-18 2004-11-18 Wafer fab
US10/991,722 2004-11-18

Publications (1)

Publication Number Publication Date
CN101208454A true CN101208454A (zh) 2008-06-25

Family

ID=36384826

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2005800395984A Pending CN101208454A (zh) 2004-11-18 2005-10-31 晶片处理系统及制造晶片的方法

Country Status (6)

Country Link
US (1) US20060102078A1 (https=)
EP (1) EP1815041A4 (https=)
JP (1) JP2008520837A (https=)
CN (1) CN101208454A (https=)
TW (1) TWI300964B (https=)
WO (1) WO2006055236A2 (https=)

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CN102422390A (zh) * 2009-03-16 2012-04-18 奥塔装置公司 气相沉积反应器系统及其方法
CN103531508A (zh) * 2013-10-17 2014-01-22 深圳市华星光电技术有限公司 基板运输设备及运输方法
CN103681363A (zh) * 2012-09-17 2014-03-26 Psk有限公司 串行线性热处理器排列
CN106784394A (zh) * 2013-12-30 2017-05-31 Sfa工程股份有限公司 用于附着玻璃与掩模的设备及方法、以及用于装载基板的系统及方法
CN112048698A (zh) * 2017-02-09 2020-12-08 应用材料公司 用于真空处理设在基板上的薄膜晶体管沟道的方法、薄膜晶体管和用于真空处理基板的设备
CN117230423A (zh) * 2022-06-08 2023-12-15 凌嘉科技股份有限公司 并列式镀膜设备及多层膜的镀膜方法

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CN102422390B (zh) * 2009-03-16 2015-05-13 奥塔装置公司 气相沉积反应器系统及其方法
CN103681363A (zh) * 2012-09-17 2014-03-26 Psk有限公司 串行线性热处理器排列
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CN103531508A (zh) * 2013-10-17 2014-01-22 深圳市华星光电技术有限公司 基板运输设备及运输方法
WO2015054952A1 (zh) * 2013-10-17 2015-04-23 深圳市华星光电技术有限公司 基板运输设备及运输方法
CN103531508B (zh) * 2013-10-17 2016-05-18 深圳市华星光电技术有限公司 基板运输设备及运输方法
CN106784394A (zh) * 2013-12-30 2017-05-31 Sfa工程股份有限公司 用于附着玻璃与掩模的设备及方法、以及用于装载基板的系统及方法
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CN112048698B (zh) * 2017-02-09 2023-07-28 应用材料公司 用于真空处理设在基板上的薄膜晶体管沟道的方法、薄膜晶体管和用于真空处理基板的设备
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US20060102078A1 (en) 2006-05-18
JP2008520837A (ja) 2008-06-19
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