TWI300964B - Wafer fab - Google Patents

Wafer fab Download PDF

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Publication number
TWI300964B
TWI300964B TW094132534A TW94132534A TWI300964B TW I300964 B TWI300964 B TW I300964B TW 094132534 A TW094132534 A TW 094132534A TW 94132534 A TW94132534 A TW 94132534A TW I300964 B TWI300964 B TW I300964B
Authority
TW
Taiwan
Prior art keywords
chamber
processing
chambers
substrate
wafer
Prior art date
Application number
TW094132534A
Other languages
English (en)
Chinese (zh)
Other versions
TW200623309A (en
Inventor
Kevin P Fairbairn
Hari Ponnekanti
Christopher Lane
Robert Edward Weiss
Ian Latchford
Terry Bluck
Original Assignee
Intevac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intevac Inc filed Critical Intevac Inc
Publication of TW200623309A publication Critical patent/TW200623309A/zh
Application granted granted Critical
Publication of TWI300964B publication Critical patent/TWI300964B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
TW094132534A 2004-11-18 2005-09-20 Wafer fab TWI300964B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/991,722 US20060102078A1 (en) 2004-11-18 2004-11-18 Wafer fab

Publications (2)

Publication Number Publication Date
TW200623309A TW200623309A (en) 2006-07-01
TWI300964B true TWI300964B (en) 2008-09-11

Family

ID=36384826

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094132534A TWI300964B (en) 2004-11-18 2005-09-20 Wafer fab

Country Status (6)

Country Link
US (1) US20060102078A1 (https=)
EP (1) EP1815041A4 (https=)
JP (1) JP2008520837A (https=)
CN (1) CN101208454A (https=)
TW (1) TWI300964B (https=)
WO (1) WO2006055236A2 (https=)

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CN101208454A (zh) 2008-06-25
EP1815041A2 (en) 2007-08-08
TW200623309A (en) 2006-07-01
US20060102078A1 (en) 2006-05-18
JP2008520837A (ja) 2008-06-19
EP1815041A4 (en) 2009-07-29
WO2006055236A3 (en) 2007-11-15
WO2006055236A2 (en) 2006-05-26

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