JP2008520837A - ウエハファブ - Google Patents

ウエハファブ Download PDF

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Publication number
JP2008520837A
JP2008520837A JP2007543085A JP2007543085A JP2008520837A JP 2008520837 A JP2008520837 A JP 2008520837A JP 2007543085 A JP2007543085 A JP 2007543085A JP 2007543085 A JP2007543085 A JP 2007543085A JP 2008520837 A JP2008520837 A JP 2008520837A
Authority
JP
Japan
Prior art keywords
chamber
wafer
row
processing system
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007543085A
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English (en)
Japanese (ja)
Other versions
JP2008520837A5 (https=
Inventor
フェアバイロン、ケビン、ピー．
ポンネカンティ、ハリ
レーン、クリストファー
ウェイス、ロバート、エドワード
ラッチフォード、イアン
ブルック、テリー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intevac Inc
Original Assignee
Intevac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intevac Inc filed Critical Intevac Inc
Publication of JP2008520837A publication Critical patent/JP2008520837A/ja
Publication of JP2008520837A5 publication Critical patent/JP2008520837A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP2007543085A 2004-11-18 2005-10-31 ウエハファブ Pending JP2008520837A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/991,722 US20060102078A1 (en) 2004-11-18 2004-11-18 Wafer fab
PCT/US2005/039433 WO2006055236A2 (en) 2004-11-18 2005-10-31 Wafer processing system and method of manufacturing wafers

Publications (2)

Publication Number Publication Date
JP2008520837A true JP2008520837A (ja) 2008-06-19
JP2008520837A5 JP2008520837A5 (https=) 2008-11-27

Family

ID=36384826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007543085A Pending JP2008520837A (ja) 2004-11-18 2005-10-31 ウエハファブ

Country Status (6)

Country Link
US (1) US20060102078A1 (https=)
EP (1) EP1815041A4 (https=)
JP (1) JP2008520837A (https=)
CN (1) CN101208454A (https=)
TW (1) TWI300964B (https=)
WO (1) WO2006055236A2 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011049167A (ja) * 2009-08-27 2011-03-10 Samsung Mobile Display Co Ltd 薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法
JP2014125505A (ja) * 2012-12-25 2014-07-07 National Institute Of Advanced Industrial & Technology 部品製造方法、接合剥離装置、および複合キャリア
WO2020137169A1 (ja) * 2018-12-27 2020-07-02 株式会社Sumco 気相成長装置

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US20130175323A1 (en) * 2002-07-01 2013-07-11 Jian Zhang Serial thermal linear processor arrangement
US20060033678A1 (en) * 2004-01-26 2006-02-16 Applied Materials, Inc. Integrated electroless deposition system
US20060240187A1 (en) * 2005-01-27 2006-10-26 Applied Materials, Inc. Deposition of an intermediate catalytic layer on a barrier layer for copper metallization
US20060162658A1 (en) * 2005-01-27 2006-07-27 Applied Materials, Inc. Ruthenium layer deposition apparatus and method
US7438949B2 (en) * 2005-01-27 2008-10-21 Applied Materials, Inc. Ruthenium containing layer deposition method
US9524896B2 (en) * 2006-09-19 2016-12-20 Brooks Automation Inc. Apparatus and methods for transporting and processing substrates
US7901539B2 (en) * 2006-09-19 2011-03-08 Intevac, Inc. Apparatus and methods for transporting and processing substrates
US8419341B2 (en) 2006-09-19 2013-04-16 Brooks Automation, Inc. Linear vacuum robot with Z motion and articulated arm
US8293066B2 (en) * 2006-09-19 2012-10-23 Brooks Automation, Inc. Apparatus and methods for transporting and processing substrates
KR20100061731A (ko) * 2007-09-14 2010-06-08 퀄컴 엠이엠스 테크놀로지스, 인크. Ｍｅｍｓ 제조에 이용되는 에칭 방법
JP4473343B2 (ja) * 2007-11-09 2010-06-02 キヤノンアネルバ株式会社 インライン型ウェハ搬送装置
CN101849285B (zh) * 2007-11-09 2012-05-30 佳能安内华股份有限公司 在线型晶圆输送装置
JP4494523B2 (ja) * 2007-11-09 2010-06-30 キヤノンアネルバ株式会社 インライン型ウェハ搬送装置および基板搬送方法
US8349196B2 (en) * 2007-12-06 2013-01-08 Intevac, Inc. System and method for commercial fabrication of patterned media
US8475591B2 (en) * 2008-08-15 2013-07-02 Varian Semiconductor Equipment Associates, Inc. Method of controlling a thickness of a sheet formed from a melt
JP5388279B2 (ja) * 2009-02-27 2014-01-15 インテバック・インコーポレイテッド 基板搬送処理装置及び方法
CN102422407B (zh) * 2009-03-16 2014-10-15 奥塔装置公司 晶片承载器轨道
JP2010280943A (ja) * 2009-06-04 2010-12-16 Sony Corp 蒸着装置及び蒸着方法
JP5328726B2 (ja) 2009-08-25 2013-10-30 三星ディスプレイ株式會社 薄膜蒸着装置及びこれを利用した有機発光ディスプレイ装置の製造方法
JP5611718B2 (ja) * 2009-08-27 2014-10-22 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法
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KR101174875B1 (ko) 2010-01-14 2012-08-17 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR101193186B1 (ko) 2010-02-01 2012-10-19 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
US10808319B1 (en) 2010-02-26 2020-10-20 Quantum Innovations, Inc. System and method for vapor deposition of substrates with circular substrate frame that rotates in a planetary motion and curved lens support arms
US10550474B1 (en) 2010-02-26 2020-02-04 Quantum Innovations, Inc. Vapor deposition system
KR101156441B1 (ko) 2010-03-11 2012-06-18 삼성모바일디스플레이주식회사 박막 증착 장치
KR101202348B1 (ko) * 2010-04-06 2012-11-16 삼성디스플레이 주식회사 박막 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법
US8894458B2 (en) 2010-04-28 2014-11-25 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
TW201137143A (en) * 2010-04-28 2011-11-01 Hon Hai Prec Ind Co Ltd Sputtering system
KR101223723B1 (ko) 2010-07-07 2013-01-18 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
US20120058630A1 (en) * 2010-09-08 2012-03-08 Veeco Instruments Inc. Linear Cluster Deposition System
KR101678056B1 (ko) 2010-09-16 2016-11-22 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR101723506B1 (ko) 2010-10-22 2017-04-19 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101738531B1 (ko) 2010-10-22 2017-05-23 삼성디스플레이 주식회사 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR20120045865A (ko) 2010-11-01 2012-05-09 삼성모바일디스플레이주식회사 유기층 증착 장치
KR20120065789A (ko) 2010-12-13 2012-06-21 삼성모바일디스플레이주식회사 유기층 증착 장치
KR101760897B1 (ko) 2011-01-12 2017-07-25 삼성디스플레이 주식회사 증착원 및 이를 구비하는 유기막 증착 장치
KR101923174B1 (ko) 2011-05-11 2018-11-29 삼성디스플레이 주식회사 정전 척, 상기 정전 척을 포함하는 박막 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법
KR101840654B1 (ko) 2011-05-25 2018-03-22 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101852517B1 (ko) 2011-05-25 2018-04-27 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101857249B1 (ko) 2011-05-27 2018-05-14 삼성디스플레이 주식회사 패터닝 슬릿 시트 어셈블리, 유기막 증착 장치, 유기 발광 표시장치제조 방법 및 유기 발광 표시 장치
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