WO2002075789A1 - Automatic continue wafer processing system and method for using the same - Google Patents

Automatic continue wafer processing system and method for using the same Download PDF

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Publication number
WO2002075789A1
WO2002075789A1 PCT/KR2002/000457 KR0200457W WO02075789A1 WO 2002075789 A1 WO2002075789 A1 WO 2002075789A1 KR 0200457 W KR0200457 W KR 0200457W WO 02075789 A1 WO02075789 A1 WO 02075789A1
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WO
WIPO (PCT)
Prior art keywords
polygon
wafer
tower
path
distribution
Prior art date
Application number
PCT/KR2002/000457
Other languages
French (fr)
Inventor
Young-Hoon Park
Hyun-Soo Kyung
Hong-Joo Lim
Choon-Kum Baik
Chang-Hwan Choi
Jang-Ho Bae
Original Assignee
Ips Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ips Ltd. filed Critical Ips Ltd.
Publication of WO2002075789A1 publication Critical patent/WO2002075789A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Definitions

  • the present invention relates to an automatic continuous wafer processing system in which a series of processes for processing wafers are performed without exposing the wafers to air, and to a wafer processing method using the above system.
  • a series of processes for continuously processing wafers are needed to produce semiconductor chips.
  • the processes are largely divided into four processes of a photo process, an etching process, a diffusion process, and a thin film deposition process. Since the respective processes should be performed in different conditions, a large number of process modules for performing these processes are needed.
  • the process modules are efficiently arranged by the category of process in a large space, forming a process module line.
  • a wafer is sequentially transferred from one process module to another process module, manually or by a robot in a production line, during which the above processes are performed.
  • an object of the present invention to provide an automatic continuous wafer processing system which can reduce the space occupied by modules in a production line and the time taken for transferring a wafer from one process module to another process module, by incorporating a plurality of process modules performing a series of continuous processes in a semiconductor manufacturing process, and a wafer processing method using the above system.
  • an automatic continuous wafer processing system comprising a polygon module unit including a polygon tower where at least one first polygon path through which a wafer passes is formed, a plurality of process modules coupled in a cluster in a row direction and a column direction at each of the other sides of the polygon tower except for a sur ace where the first polygon path and processing a wafer that is taken in, and a polygon elevating robot moving up and down in a vertical direction in the polygon tower and transferring the wafer to the process modules, a wafer distribution tower including a tower main body where a distribution path is formed in the same number of the first polygon path, an aligner fixed in the tower main body to recognize a degree of misalignment of the wafer that is inserted and generate corresponding information, and an elevating robot installed in the tower mam body to be capable of moving up and down to take the wafer from the aligner and move the wafer up and down to a position corresponding to each of the distribution paths, and at least one
  • the wafer distribution tower comprises at least one load port module where a FOUR for accommodating wafers waiting for processes or completed the processes is installed.
  • a fan filter for removing foreign material included in air taken in is installed at the wafer distribution tower.
  • the elevating robot comprises a robot main body moving in a vertical direction in the tower main body, a rotation shaft rotating on the robot main body, an arm installed at the rotation shaft, and a finger performing a joint movement with respect to the arm and taking the wafer.
  • the load lock units comprise a load lock main body installed to connect the first polygon path and the distribution path, a cool station installed in the load lock main body and having a plurality of slots formed therein where the wafers are accommodated and cooling the accommodated wafers, a load lock elevator to move the cool station up and down to an appropriate height at which the polygon elevating robot or the elevating robot takes the wafer, a load lock vat valve to open and close the distribution paths, and a second load lock vat valve to open and close the first polygon paths.
  • the polygon elevating robot comprises a polygon elevator installed in the polygon tower in a vertical direction, a robot main body moving up and down by the polygon elevator, a rotation shaft rotating on the robot main body, an arm performing a joint movement with respect to the rotation shaft, and a finger performing a joint movement with respect to the arm to take the wafer.
  • a method of processing a wafer using a wafer processing system including a polygon module unit comprising a polygon tower where at least one first polygon path through which the wafer passes is formed, a plurality of process modules coupled to each of the other sides of the polygon tower except for a surface where the first polygon path is formed in a cluster and in a row direction and column direction to process the wafer taken in, and a polygon elevating robot moving up and down in the polygon tower to transfer the wafer to the process modules; and at least one load lock unit installed at the polygon tower to correspond to the first polygon path, temporarily keeping the wafer passing through the first polygon path, the process modules having a sequential relationship for process of the wafer and being sequentially arranged clockwise or counterclockwise around the polygon tower, the method comprising the steps of the polygon elevating robot transferring the wafer temporarily kept in the load lock unit to a first process module where a particular process is performed, the polygon elevating robot taking the wafer from the first
  • FIG. 1 is a perspective view of an automatic continuous wafer processing system according to the present invention
  • FIG. 2 is a perspective view of the automatic continuous wafer processing system of FIG. 1 , viewed from a different angle;
  • FIG. 3 is a perspective view of a wafer distribution tower of FIG. 1 ;
  • FIG. 4 is a perspective view of a polygon tower of FIG. 2;
  • FIG. 5 is a perspective view showing the inside of the polygon tower of FIG. 4;
  • FIG. 6 is a perspective view showing the inside of a load lock unit of FIG. 5;
  • FIG. 7 is a view showing the state in which a process module of FIG. 1 is coupled to the polygon tower;
  • FIG. 8 is an exploded perspective view of a preferred embodiment of the process module of FIG. 7.
  • FIG. 9 is a sectional view of the preferred embodiment of the process module of FIG. 7.
  • FIG. 1 is a perspective view of an automatic continuous wafer processing system according to the present invention.
  • FIG. 2 is a perspective view of the automatic continuous wafer processing system of FIG. 1 , viewed from a different angle.
  • FIG. 3 is a perspective view of a wafer distribution tower of FIG. 1.
  • FIG. 4 is a perspective view of a polygon tower of FIG 2.
  • FIG. 5 is a perspective view showing the inside of the polygon tower of FIG. 4.
  • FIG. 6 is a perspective view showing the inside of a load lock unit of FIG. 5.
  • an automatic continuous wafer processing system includes a polygon module unit 10 where a plurality of process modules 100a, 100b, 100c, 100d, 100e, 100f, 100g, and 100g are installed, a wafer distribution tower 30 where distribution paths 31a and 31a' through which a wafer w to be supplied to the polygon module unit 10 passes are formed, and two load lock units 40 and 50 installed between the polygon module unit 10 and the wafer distribution tower 30 corresponding to the respective distribution paths 31a and 31 a'.
  • the wafer distribution tower 30 is for transfer of wafers between the load lock units 40 and 50 and FOUPs 36a and 37a installed at first and second load port modules 36 and 37.
  • Each of the load lock units 40 and 50 is for transfer of wafers between the wafer distribution tower 30 in a ready state and the polygon module unit 10 maintained in a vacuum state and further separates the polygon module unit 10 from the wafer distribution tower 30.
  • the numbers of the distribution paths and load lock units are limited to 2 to simplify descriptions thereof, it is obvious that the numbers of the distribution paths and the load lock units can be one or two or more.
  • the polygon module unit 10 includes a polygon tower 11 having a polygonal column shape, i.e., a hexagonal column shape in the present preferred embodiment.
  • a polygon tower 11 having a polygonal column shape, i.e., a hexagonal column shape in the present preferred embodiment.
  • a plurality of second polygon paths, eight (13a, 13b, 13c, 13d, 13e, 13f, 13g, and 13h) in the present preferred embodiment, are formed at the other sides, exclusive of the side where the first polygon paths 12 and 22 are formed in a row direction and a column direction.
  • a polygon elevating robot 15 for transferring the wafer w to the first or second polygon paths while moving in a vertical direction is installed in the polygon tower 11.
  • the polygon elevating robot 15 includes a polygon elevator 15e installed in the vertical direction in the polygon tower 1 1 , a robot main body 15a moving up and down by the polygon elevator 15e, a rotation shaft 15b rotating on the robot main body 15a, an arm 15c installed at the rotation shaft 15b, and a finger 15d performing a joint movement with respect to the arm 15c to take the wafer w.
  • the polygon elevating robot 15 being moved up and down by the polygon elevator 15e transfers the supplied wafer w to the first polygon paths 12 and 22 or the second polygon paths 13a, 13b, 13d, 13d, 13e, 13f, 13g, and 13h.
  • Eight process modules 100a, 100b, 100c, 100d, 100e, 100f, 100g, and 100h besides the polygon tower 11 are coupled in a cluster to correspond to the second polygon paths 13a, 13b, 13d, 13d, 13e, 13f, 13g, and 13h.
  • the process modules 100a, 100b, 100c, 100d, 100e, 100f, 100g, and 100h are installed in two tiers, that is, four in each tier, at the side portion of the polygon tower 11.
  • Each of the process modules has a sequential processing relationship in a clockwise or counterclockwise direction.
  • a module vat valve 101 for opening and shutting a wafer transfer opening 116 to be described later and the second polygon paths 13a, 13b, 13c, 13d, 13e, 13f, 13g, and 13h is installed between the polygon tower 11 and each of the process modules 100a, 100b, 100c, 100d, 100e, 100f, 100g, and 100h.
  • the function and structure of each process module are determined according to the process that is continuously performed.
  • a polygon vacuum pump 16 for producing a vacuum inside the polygon tower 11 is connected through a pumping line (not shown).
  • a degree of vacuum in the process module is maintained at a pressure of 10 "2 Torr, for example, a degree of vacuum in the polygon tower 11 is maintained by the polygon vacuum pump 16 to be slightly higher than 10 "2 Torr.
  • the module vat valve 101 is open after the process is complete, the gas remaining in the process module is prevented from being exhausted to the polygon tower 11 so that the polygon tower 11 is prevented from being contaminated. Since the polygon vacuum pump 16 is well known, a detailed description thereof is omitted herein.
  • the wafer distribution tower 30 includes a tower main body 31 where the distribution paths 31 a and 31a' through which the wafer w passes are formed at an inner side surface thereof, an aligner 32 fixed in the tower main body 31 and used to accurately place the wafer w on the load lock units 40 and 50, a cylinder 34a installed in the tower main body 31 in a vertical direction and having a vertical moving shaft 34a' moving up and down, a horizontal guide 34b for moving the cylinder 34a in a horizontal direction, and an elevating robot 35 fixed on the vertical moving shaft 34a' and moving up and down to take the wafer w from the aligner 32 and place the wafer w to a position corresponding to each of the distribution paths 31 a and 31 a'.
  • the elevating robot 35 includes a robot main body 35a moving along with the vertical moving shaft 34a', a rotation. shaft 35b rotating on the robot main body 35a, an arm 35c installed at the rotation shaft 35b, and a finger 35d performing a joint movement with respect to the arm 35c to take the wafer w.
  • a slot 32a into which the wafer w transferred by the elevating robot 35 is inserted is formed in the aligner 32.
  • the aligner 32 recognizes a degree of misalignment of the wafer w inserted in the slot 32a and provides corresponding information to the elevating robot 35 so that the wafer w can be accurately transferred to the load lock unit. Since the aligner 32 is well known, a detailed description thereof is omitted herein.
  • a panel 38 is installed at the tower main body 31 to prevent an inner space of the tower main body 31 from being exposed to the outside.
  • a plurality of load port module i.e., the first and second load port modules 36 and 37 in the present preferred embodiment, where the FOUPs 36a and 37a for accommodating the wafer w which is waiting for processes or has completed the processes are installed, are installed at the tower main body 31.
  • a fan filter 39 for removing foreign material included in air taken into the wafer distribution tower 30 is installed at a predetermined portion of the tower main body 31.
  • the load lock units 40 and 50 include a load lock main body 41 installed between the polygon module unit 10 and the wafer distribution tower 30 to connect the first upper polygon paths 12 and 22 and the distribution paths 31a and 31a', and a cool station 42 installed inside the load lock main body 41 , having a plurality of slots where the wafer w are accommodated, and formed of a metallic material for cooling the wafer w accommodated therein.
  • a load lock elevator 44 for moving the coo! station 42 up and down to an appropriate height at which the polygon elevating robot 15 or the elevating robot 35 takes the wafer w is installed at the load lock main body 41 , as shown in FIG. 6.
  • An inert gas intake pipe (not shown) is installed at the side portion of the load, lock main body 41.
  • the inert gas such as Ar is injected into the upper load lock main body 41 through the inert gas intake pipe so that the wafer w accommodated in the cool station 42 is cooled down.
  • the inert gas intake pipe can be used as a means for making the inside of the load lock main body 41 under the atmospheric pressure.
  • a load lock vat valve 45 for opening and shutting the distribution path and a second load lock vat valve 46 for opening and shutting the first upper polygon path are installed at the upper load lock main body 41.
  • a load lock vacuum pump 47 for producing a vacuum in the upper load lock unit 40 is connected to a predetermined portion of the load lock main body 41.
  • each process module must be determined such that a particular process can be performed with respect to a wafer.
  • the structure of all process modules can be made to be the same or different according to the process.
  • the structure of a process module for example, a thin film forming module for performing a thin film forming process, is described below with reference to FIGS. 7 through 9.
  • a process module 100a is installed at the polygon tower 11 corresponding to the second polygon path 13a.
  • the process module 100a includes a reactor block 1 10 where the wafer w transferred by the polygon elevating robot 15 through the wafer transfer opening 1 16 when the module vat valve 101 is open, a shower head plate 120 coupled to the reactor block 110, a diffusion plate 130 installed at the shower head plate 120 for injecting a reaction gas and/or inert gas supplied from a reaction gas supplying portion (not shown), a wafer block 140 installed inside the reactor block 1 10 for accommodating the wafer w, and an exhaust portion (not shown) connected to the reactor block 1 10 for exhausting the gas in the reactor block 110 to the outside.
  • a first connection line 121 for transferring a first reaction gas and/or inert gas being supplied to the diffusion plate 130 and a second connection line 122 for transferring a second reaction gas and/or inert gas to the diffusion plate 130 are installed at the shower head plate 120.
  • the first and second connection pipes 1 1 1 and 1 12 are connected to the first and second connection lines 121 and 122 installed at the shower head plate 120.
  • a connection portion 1 13 is connected to a reaction gas supply portion (not shown).
  • the diffusion plate 130 located inside the reactor block 110 when the shower head plate 120 covers the reactor block 110 includes a plurality of injection holes 131 for injecting the first reaction gas and/or inert gas supplied through the first connection line 121 toward the upper portion of the wafer w and a plurality of nozzles 133 for injecting the second reaction gas and/or inert gas supplied through the second connection line 122 toward the outer circumference of the wafer w.
  • a plurality of heaters H to increase the temperature of the inside are installed in the process module.
  • the wafer w is transferred through the wafer transfer opening 116 and placed on the wafer block 140.
  • the first reaction gas and/or inert gas is injected onto the upper portion of the wafer w through the first connection pipe 111 - • the first connection line 121 - the injection holes 131 while the second reaction gas and/or inert gas is injected toward the inner side surface of the reactor block 110 through the second connection pipe 112 - the second connection line 122 - the nozzles 133.
  • the first and second reaction gases form a thin film on the wafer w and process resultants or gases unused in the deposition of a thin film are exhausted through exhaust holes 117 and 118 and a pumping port.
  • the present invention can continuously perform a series of processes with respect to a wafer by adopting a plurality of process modules which are well known and have the same or different structure as or from the above description, for example, 8 process modules in the present preferred embodiment.
  • Air where foreign material is removed by the fan filter 39 is supplied into the wafer distribution tower 30 to maintain a clean state in the wafer distribution tower 30.
  • a predetermined vacuum state is maintained in the polygon tower 11 by the polygon vacuum pumps 16.
  • a plurality of wafers are accommodated in the FOUP 36a of the first load port module 36.
  • the elevating robot 35 is moved by the vertical moving shaft 34a' and the horizontal guide 34b to a position corresponding to the first load port module 36.
  • One wafer w is taken from the FOUP 36a of the first load port module 36 by moving the rotation shaft 35b, the arm 35c, and the finger 35d.
  • the elevating robot 35 is moved to a position corresponding to the aligner 32 to insert the wafer w .into the slot 32a of the aligner 32.
  • the aligner 32 recognizes a degree of misalignment of the inserted wafer w and provides corresponding information to the elevating robot 35 so that the elevating robot 35 can accurately align and transfer the wafer w to the load lock unit.
  • the elevating robot 35 takes the wafer w from the aligner 32 by moving the rotation shaft 35b, the arm 35c, and the finger 35d and moves to a position corresponding to the upper distribution path 31 a.
  • the load lock vat valve 45 is lowered to open the distribution path 31 a.
  • the elevating robot 35 moves the arm 35c and the finger 35d to insert the wafer w into the slot of the cool station 42 through the distribution path 31 a, and escapes from the load lock unit 40 by folding the arm 35c and the finger 35d.
  • the load lock vat valve 45 ascends to close the upper distribution path 31a.
  • a valve (not shown) connected to the load lock vacuum pump 47 is open and the inside of the load lock main body 41 is made in a vacuum state to be the same as the polygon tower 11.
  • the second load lock vat valve 46 descends to open the first upper polygon path 12.
  • the polygon elevating robot 15 is moved up by the polygon elevator 15e to a position corresponding to the first polygon path 12 and unfolds the rotation shaft 15b, the arm 15c, and the finger 15d to take the wafer w from the slot of the cool station 42.
  • the second load lock vat valve 46 ascends to close the first polygon path 12.
  • the polygon elevating robot 15 transfers the wafer w to a position corresponding to the second upper polygon path 13a by using the rotation shaft 15b, the arm 15c, and the finer 15d which are rotated, unfolded and folded.
  • the module vat valve 101 of the process module 100a descends to open the wafer transfer opening 116.
  • the polygon elevating robot 15 places the wafer w on the wafer block 110 by unfolding the arm 15c and the finger 15d. After supplying the wafer w, the polygon elevating robot 15 folds the arm 15c and the finger 15d and completely escapes from the process module 100a.
  • the module vat valve 101 ascends to close the wafer transfer opening 116. Then, a particular process is performed at the process module 100a.
  • the module vat valve 101 descends to open the wafer transfer opening 116.
  • the polygon elevating robot 15 takes the wafer w from the process module 100a.
  • the polygon elevating robot 15 transfers the wafer w to a position corresponding to the second polygon path 13b and repeats the above-described action to supply the wafer w to the process module 100b. A subsequent particular process is performed at the second process module 100b.
  • the polygon elevating robot 15 takes the wafer w from the process module 100b and repeats the above-described action to sequentially supply the wafer w to the process modules 100c and 100d where particular processes are performed.
  • the polygon elevating robot 15 takes the wafer w from the process module 100d.
  • the polygon elevating robot 15 is moved down by the polygon elevator 15e to move the wafer w to a position corresponding to the process module 100e.
  • the polygon elevating robot 15 repeats the above operation to sequentially supply the wafer w to the process modules 100e, 100f, 100g, and 100h performing continuous processes.
  • the polygon elevating robot 15 takes the wafer w from the last process module 100h to a position corresponding to the first polygon path 22.
  • the second load lock vat valve 46 of the load lock unit 40 descends, the first polygon path 22 is open.
  • the polygon elevating robot 15 inserts the wafer w having sequentially completed particular processes into the slot of the cool station.
  • the load lock elevator 44 is operated to ascend the cool station 42 so that the wafer w having sequentially completed particular processes are inserted in empty slots.
  • the second load lock valve 46 ascends to close the first polygon path 22.
  • the inert gas is taken into the load lock unit 40 to cool the wafer w to an appropriate temperature.
  • a vent member (not shown) is operated to make the inside of the load lock main body 41 at an atmospheric pressure which is the pressure in the wafer distribution tower 30.
  • the first load lock vat valve 45 of the load lock unit 40 descends to open the distribution path 31 a'.
  • the elevating robot 35 moves to take the wafer w having completed the sequential processes from the cool station 42 through the distribution path 31 a' and accommodate the wafer w in the FOUP 36a of the first load port module 36.
  • the wafer returns to the slot of the same FOUP from which it has been taken.
  • a polygon module unit formed by incorporating a plurality of process modules for performing a series of continuous processes is adopted so that the amount of production per unit area can be increased.
  • the number of particles falling onto the wafer can be reduced or an oxide film generated on the wafer by air can be minimized.
  • a production yield can be improved.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

An automatic continuous wafer processing system includes a polygon module unit including a polygon tower where at least one first polygon path through which a wafer passes is formed, a plurality of process modules coupled in a cluster in a row direction and a column direction at each of the other sides of the polygon tower except for a surface where the first polygon path and processing a wafer that is taken in, and a polygon elevating robot moving up and down in a vertical direction in the polygon tower and transfering the wafer to the process modules; a wafer distribution tower including a tower main body where a distribution path is formed in the same number of the first polygon path, an aligner to recognize a degree of misalignment of the wafer, and an elevating robot to be capable of moving up and down to take the wafer from the aligner and move the wafer up and down to a position corresponding to each of the distribution paths; and at least one load lock unit installed between the polygon module unit and the wafer distribution tower, temporarily keeping the wafer passing through the first polygon path and the distribution path.

Description

AUTOMATIC CONTINUE WAFER PROCESSING SYSTEM AND METHOD FOR USING THE SAME
Technical Field The present invention relates to an automatic continuous wafer processing system in which a series of processes for processing wafers are performed without exposing the wafers to air, and to a wafer processing method using the above system.
Background Art
A series of processes for continuously processing wafers are needed to produce semiconductor chips. The processes are largely divided into four processes of a photo process, an etching process, a diffusion process, and a thin film deposition process. Since the respective processes should be performed in different conditions, a large number of process modules for performing these processes are needed. The process modules are efficiently arranged by the category of process in a large space, forming a process module line.
A wafer is sequentially transferred from one process module to another process module, manually or by a robot in a production line, during which the above processes are performed.
Disclosure of the Invention
To promote productivity in the above field, it is an object of the present invention to provide an automatic continuous wafer processing system which can reduce the space occupied by modules in a production line and the time taken for transferring a wafer from one process module to another process module, by incorporating a plurality of process modules performing a series of continuous processes in a semiconductor manufacturing process, and a wafer processing method using the above system.
It is another object of the present invention to provide an automatic continuous wafer processing system which can minimize the number of particles falling onto a wafer and formation of an oxide film on the wafer due to air, by preventing the wafer from being exposed to air, and a wafer processing method using the above system.
To achieve the above object, there is provided an automatic continuous wafer processing system comprising a polygon module unit including a polygon tower where at least one first polygon path through which a wafer passes is formed, a plurality of process modules coupled in a cluster in a row direction and a column direction at each of the other sides of the polygon tower except for a sur ace where the first polygon path and processing a wafer that is taken in, and a polygon elevating robot moving up and down in a vertical direction in the polygon tower and transferring the wafer to the process modules, a wafer distribution tower including a tower main body where a distribution path is formed in the same number of the first polygon path, an aligner fixed in the tower main body to recognize a degree of misalignment of the wafer that is inserted and generate corresponding information, and an elevating robot installed in the tower mam body to be capable of moving up and down to take the wafer from the aligner and move the wafer up and down to a position corresponding to each of the distribution paths, and at least one load lock unit installed between the polygon module unit and the wafer distribution tower to correspond to the first polygon path and the distribution path, temporarily keeping the wafer passing through the first polygon path and the distribution path, and separating the polygon module unit from the wafer distribution tower
It is preferred in the present invention that the wafer distribution tower comprises at least one load port module where a FOUR for accommodating wafers waiting for processes or completed the processes is installed.
It is preferred in the present invention that a fan filter for removing foreign material included in air taken in is installed at the wafer distribution tower.
It is preferred in the present invention that the elevating robot comprises a robot main body moving in a vertical direction in the tower main body, a rotation shaft rotating on the robot main body, an arm installed at the rotation shaft, and a finger performing a joint movement with respect to the arm and taking the wafer.
It is preferred in the present invention that the load lock units comprise a load lock main body installed to connect the first polygon path and the distribution path, a cool station installed in the load lock main body and having a plurality of slots formed therein where the wafers are accommodated and cooling the accommodated wafers, a load lock elevator to move the cool station up and down to an appropriate height at which the polygon elevating robot or the elevating robot takes the wafer, a load lock vat valve to open and close the distribution paths, and a second load lock vat valve to open and close the first polygon paths.
It is preferred in the present invention that the polygon elevating robot comprises a polygon elevator installed in the polygon tower in a vertical direction, a robot main body moving up and down by the polygon elevator, a rotation shaft rotating on the robot main body, an arm performing a joint movement with respect to the rotation shaft, and a finger performing a joint movement with respect to the arm to take the wafer.
To achieve the above object, there is provided a method of processing a wafer using a wafer processing system including a polygon module unit comprising a polygon tower where at least one first polygon path through which the wafer passes is formed, a plurality of process modules coupled to each of the other sides of the polygon tower except for a surface where the first polygon path is formed in a cluster and in a row direction and column direction to process the wafer taken in, and a polygon elevating robot moving up and down in the polygon tower to transfer the wafer to the process modules; and at least one load lock unit installed at the polygon tower to correspond to the first polygon path, temporarily keeping the wafer passing through the first polygon path, the process modules having a sequential relationship for process of the wafer and being sequentially arranged clockwise or counterclockwise around the polygon tower, the method comprising the steps of the polygon elevating robot transferring the wafer temporarily kept in the load lock unit to a first process module where a particular process is performed, the polygon elevating robot taking the wafer from the first process module and transferring the wafer to a subsequent process module sequentially and clockwise or counterclockwise, and the polygon elevating robot taking the wafer from a process module performing a final process of the sequential continuous processes and transferring the wafer to the load lock unit.
Brief Description of the Drawings
FIG. 1 is a perspective view of an automatic continuous wafer processing system according to the present invention;
FIG. 2 is a perspective view of the automatic continuous wafer processing system of FIG. 1 , viewed from a different angle;
FIG. 3 is a perspective view of a wafer distribution tower of FIG. 1 ;
FIG. 4 is a perspective view of a polygon tower of FIG. 2;
FIG. 5 is a perspective view showing the inside of the polygon tower of FIG. 4; FIG. 6 is a perspective view showing the inside of a load lock unit of FIG. 5;
FIG. 7 is a view showing the state in which a process module of FIG. 1 is coupled to the polygon tower;
FIG. 8 is an exploded perspective view of a preferred embodiment of the process module of FIG. 7; and
FIG. 9 is a sectional view of the preferred embodiment of the process module of FIG. 7.
Best mode for carrying out the Invention Hereinafter, an automatic continuous wafer processing system according to the present invention and a wafer processing method using the system is described with reference to the attached drawings.
FIG. 1 is a perspective view of an automatic continuous wafer processing system according to the present invention. FIG. 2 is a perspective view of the automatic continuous wafer processing system of FIG. 1 , viewed from a different angle. FIG. 3 is a perspective view of a wafer distribution tower of FIG. 1. FIG. 4 is a perspective view of a polygon tower of FIG 2. FIG. 5 is a perspective view showing the inside of the polygon tower of FIG. 4. FIG. 6 is a perspective view showing the inside of a load lock unit of FIG. 5.
As shown in the drawings, an automatic continuous wafer processing system according to the present invention includes a polygon module unit 10 where a plurality of process modules 100a, 100b, 100c, 100d, 100e, 100f, 100g, and 100g are installed, a wafer distribution tower 30 where distribution paths 31a and 31a' through which a wafer w to be supplied to the polygon module unit 10 passes are formed, and two load lock units 40 and 50 installed between the polygon module unit 10 and the wafer distribution tower 30 corresponding to the respective distribution paths 31a and 31 a'. Here, the wafer distribution tower 30 is for transfer of wafers between the load lock units 40 and 50 and FOUPs 36a and 37a installed at first and second load port modules 36 and 37. Each of the load lock units 40 and 50 is for transfer of wafers between the wafer distribution tower 30 in a ready state and the polygon module unit 10 maintained in a vacuum state and further separates the polygon module unit 10 from the wafer distribution tower 30.
In the present preferred embodiment, although the numbers of the distribution paths and load lock units are limited to 2 to simplify descriptions thereof, it is obvious that the numbers of the distribution paths and the load lock units can be one or two or more.
The polygon module unit 10, as shown in FIGS. 4 and 5, includes a polygon tower 11 having a polygonal column shape, i.e., a hexagonal column shape in the present preferred embodiment. At least one first polygon path, two (12 and 22) in the present preferred embodiment, through which a wafer w passes, are formed at the lower side of the polygon tower 11. A plurality of second polygon paths, eight (13a, 13b, 13c, 13d, 13e, 13f, 13g, and 13h) in the present preferred embodiment, are formed at the other sides, exclusive of the side where the first polygon paths 12 and 22 are formed in a row direction and a column direction.
As shown in FIG. 5, a polygon elevating robot 15 for transferring the wafer w to the first or second polygon paths while moving in a vertical direction is installed in the polygon tower 11. The polygon elevating robot 15 includes a polygon elevator 15e installed in the vertical direction in the polygon tower 1 1 , a robot main body 15a moving up and down by the polygon elevator 15e, a rotation shaft 15b rotating on the robot main body 15a, an arm 15c installed at the rotation shaft 15b, and a finger 15d performing a joint movement with respect to the arm 15c to take the wafer w. The polygon elevating robot 15 being moved up and down by the polygon elevator 15e transfers the supplied wafer w to the first polygon paths 12 and 22 or the second polygon paths 13a, 13b, 13d, 13d, 13e, 13f, 13g, and 13h.
Eight process modules 100a, 100b, 100c, 100d, 100e, 100f, 100g, and 100h besides the polygon tower 11 are coupled in a cluster to correspond to the second polygon paths 13a, 13b, 13d, 13d, 13e, 13f, 13g, and 13h. The process modules 100a, 100b, 100c, 100d, 100e, 100f, 100g, and 100h are installed in two tiers, that is, four in each tier, at the side portion of the polygon tower 11. Each of the process modules has a sequential processing relationship in a clockwise or counterclockwise direction. Here, a module vat valve 101 for opening and shutting a wafer transfer opening 116 to be described later and the second polygon paths 13a, 13b, 13c, 13d, 13e, 13f, 13g, and 13h is installed between the polygon tower 11 and each of the process modules 100a, 100b, 100c, 100d, 100e, 100f, 100g, and 100h. The function and structure of each process module are determined according to the process that is continuously performed.
A polygon vacuum pump 16 for producing a vacuum inside the polygon tower 11 is connected through a pumping line (not shown). When a degree of vacuum in the process module is maintained at a pressure of 10"2Torr, for example, a degree of vacuum in the polygon tower 11 is maintained by the polygon vacuum pump 16 to be slightly higher than 10"2Torr. By doing so, when the module vat valve 101 is open after the process is complete, the gas remaining in the process module is prevented from being exhausted to the polygon tower 11 so that the polygon tower 11 is prevented from being contaminated. Since the polygon vacuum pump 16 is well known, a detailed description thereof is omitted herein.
The wafer distribution tower 30 includes a tower main body 31 where the distribution paths 31 a and 31a' through which the wafer w passes are formed at an inner side surface thereof, an aligner 32 fixed in the tower main body 31 and used to accurately place the wafer w on the load lock units 40 and 50, a cylinder 34a installed in the tower main body 31 in a vertical direction and having a vertical moving shaft 34a' moving up and down, a horizontal guide 34b for moving the cylinder 34a in a horizontal direction, and an elevating robot 35 fixed on the vertical moving shaft 34a' and moving up and down to take the wafer w from the aligner 32 and place the wafer w to a position corresponding to each of the distribution paths 31 a and 31 a'.
The elevating robot 35 includes a robot main body 35a moving along with the vertical moving shaft 34a', a rotation. shaft 35b rotating on the robot main body 35a, an arm 35c installed at the rotation shaft 35b, and a finger 35d performing a joint movement with respect to the arm 35c to take the wafer w.
A slot 32a into which the wafer w transferred by the elevating robot 35 is inserted is formed in the aligner 32. The aligner 32 recognizes a degree of misalignment of the wafer w inserted in the slot 32a and provides corresponding information to the elevating robot 35 so that the wafer w can be accurately transferred to the load lock unit. Since the aligner 32 is well known, a detailed description thereof is omitted herein.
A panel 38 is installed at the tower main body 31 to prevent an inner space of the tower main body 31 from being exposed to the outside. A plurality of load port module, i.e., the first and second load port modules 36 and 37 in the present preferred embodiment, where the FOUPs 36a and 37a for accommodating the wafer w which is waiting for processes or has completed the processes are installed, are installed at the tower main body 31. Also, a fan filter 39 for removing foreign material included in air taken into the wafer distribution tower 30 is installed at a predetermined portion of the tower main body 31.
The load lock units 40 and 50 include a load lock main body 41 installed between the polygon module unit 10 and the wafer distribution tower 30 to connect the first upper polygon paths 12 and 22 and the distribution paths 31a and 31a', and a cool station 42 installed inside the load lock main body 41 , having a plurality of slots where the wafer w are accommodated, and formed of a metallic material for cooling the wafer w accommodated therein. Ten or more slots for accommodating a plurality of wafers, for example, ten or more wafers in the present preferred embodiment, are formed in the cool station 42.
A load lock elevator 44 for moving the coo! station 42 up and down to an appropriate height at which the polygon elevating robot 15 or the elevating robot 35 takes the wafer w is installed at the load lock main body 41 , as shown in FIG. 6.
An inert gas intake pipe (not shown) is installed at the side portion of the load, lock main body 41. The inert gas such as Ar is injected into the upper load lock main body 41 through the inert gas intake pipe so that the wafer w accommodated in the cool station 42 is cooled down. Here, the inert gas intake pipe can be used as a means for making the inside of the load lock main body 41 under the atmospheric pressure.
A load lock vat valve 45 for opening and shutting the distribution path and a second load lock vat valve 46 for opening and shutting the first upper polygon path are installed at the upper load lock main body 41. A load lock vacuum pump 47 for producing a vacuum in the upper load lock unit 40 is connected to a predetermined portion of the load lock main body 41.
All of the above-described constituent elements are controlled by a system control portion 200. The structure and function of each process module must be determined such that a particular process can be performed with respect to a wafer. Thus, the structure of all process modules can be made to be the same or different according to the process. In the present preferred embodiment, the structure of a process module, for example, a thin film forming module for performing a thin film forming process, is described below with reference to FIGS. 7 through 9.
Referring to FIGS. 4 and 7 through 9, a process module 100a is installed at the polygon tower 11 corresponding to the second polygon path 13a. The process module 100a includes a reactor block 1 10 where the wafer w transferred by the polygon elevating robot 15 through the wafer transfer opening 1 16 when the module vat valve 101 is open, a shower head plate 120 coupled to the reactor block 110, a diffusion plate 130 installed at the shower head plate 120 for injecting a reaction gas and/or inert gas supplied from a reaction gas supplying portion (not shown), a wafer block 140 installed inside the reactor block 1 10 for accommodating the wafer w, and an exhaust portion (not shown) connected to the reactor block 1 10 for exhausting the gas in the reactor block 110 to the outside. A first connection line 121 for transferring a first reaction gas and/or inert gas being supplied to the diffusion plate 130 and a second connection line 122 for transferring a second reaction gas and/or inert gas to the diffusion plate 130 are installed at the shower head plate 120. A first connection pipe 11 1 and a second connection pipe 1 12 connected to the first and second connection lines 121 and 122, respectively, are installed at the reactor block 1 10. The first and second connection pipes 1 1 1 and 1 12 are connected to the first and second connection lines 121 and 122 installed at the shower head plate 120. A connection portion 1 13 is connected to a reaction gas supply portion (not shown). The diffusion plate 130 located inside the reactor block 110 when the shower head plate 120 covers the reactor block 110 includes a plurality of injection holes 131 for injecting the first reaction gas and/or inert gas supplied through the first connection line 121 toward the upper portion of the wafer w and a plurality of nozzles 133 for injecting the second reaction gas and/or inert gas supplied through the second connection line 122 toward the outer circumference of the wafer w.
A plurality of heaters H to increase the temperature of the inside are installed in the process module. In the process module 100a, the wafer w is transferred through the wafer transfer opening 116 and placed on the wafer block 140. in a state in which the reactor block 110 is heated to a predetermined temperature, the first reaction gas and/or inert gas is injected onto the upper portion of the wafer w through the first connection pipe 111 - • the first connection line 121 - the injection holes 131 while the second reaction gas and/or inert gas is injected toward the inner side surface of the reactor block 110 through the second connection pipe 112 - the second connection line 122 - the nozzles 133. The first and second reaction gases form a thin film on the wafer w and process resultants or gases unused in the deposition of a thin film are exhausted through exhaust holes 117 and 118 and a pumping port.
The present invention can continuously perform a series of processes with respect to a wafer by adopting a plurality of process modules which are well known and have the same or different structure as or from the above description, for example, 8 process modules in the present preferred embodiment.
The operation of the automatic continuous wafer processing system having the above structure is described below.
Air where foreign material is removed by the fan filter 39 is supplied into the wafer distribution tower 30 to maintain a clean state in the wafer distribution tower 30. A predetermined vacuum state is maintained in the polygon tower 11 by the polygon vacuum pumps 16. In the meantime, a plurality of wafers are accommodated in the FOUP 36a of the first load port module 36.
Next, the elevating robot 35 is moved by the vertical moving shaft 34a' and the horizontal guide 34b to a position corresponding to the first load port module 36. One wafer w is taken from the FOUP 36a of the first load port module 36 by moving the rotation shaft 35b, the arm 35c, and the finger 35d. Then, the elevating robot 35 is moved to a position corresponding to the aligner 32 to insert the wafer w .into the slot 32a of the aligner 32. The aligner 32 recognizes a degree of misalignment of the inserted wafer w and provides corresponding information to the elevating robot 35 so that the elevating robot 35 can accurately align and transfer the wafer w to the load lock unit.
Next, the elevating robot 35 takes the wafer w from the aligner 32 by moving the rotation shaft 35b, the arm 35c, and the finger 35d and moves to a position corresponding to the upper distribution path 31 a.
Next, the load lock vat valve 45 is lowered to open the distribution path 31 a. The elevating robot 35 moves the arm 35c and the finger 35d to insert the wafer w into the slot of the cool station 42 through the distribution path 31 a, and escapes from the load lock unit 40 by folding the arm 35c and the finger 35d.
Next, the load lock vat valve 45 ascends to close the upper distribution path 31a. A valve (not shown) connected to the load lock vacuum pump 47 is open and the inside of the load lock main body 41 is made in a vacuum state to be the same as the polygon tower 11.
Next, when the inside of the upper load lock unit 40 and the inside the polygon tower 11 are in the same vacuum state, the second load lock vat valve 46 descends to open the first upper polygon path 12. The polygon elevating robot 15 is moved up by the polygon elevator 15e to a position corresponding to the first polygon path 12 and unfolds the rotation shaft 15b, the arm 15c, and the finger 15d to take the wafer w from the slot of the cool station 42. When the polygon elevating robot 15 takes the wafer w to the inside of the polygon tower 11 , the second load lock vat valve 46 ascends to close the first polygon path 12.
Next, the polygon elevating robot 15 transfers the wafer w to a position corresponding to the second upper polygon path 13a by using the rotation shaft 15b, the arm 15c, and the finer 15d which are rotated, unfolded and folded.
Next, when a degree of vacuum in the inside of the polygon tower 11 and that of the process module 100a become identical, the module vat valve 101 of the process module 100a descends to open the wafer transfer opening 116.
Next, the polygon elevating robot 15 places the wafer w on the wafer block 110 by unfolding the arm 15c and the finger 15d. After supplying the wafer w, the polygon elevating robot 15 folds the arm 15c and the finger 15d and completely escapes from the process module 100a.
Next, the module vat valve 101 ascends to close the wafer transfer opening 116. Then, a particular process is performed at the process module 100a.
Then, when the process is complete and a degree of vacuum in the process module 100a becomes identical with that of the polygon tower 11 , the module vat valve 101 descends to open the wafer transfer opening 116. The polygon elevating robot 15 takes the wafer w from the process module 100a.
Next, the polygon elevating robot 15 transfers the wafer w to a position corresponding to the second polygon path 13b and repeats the above-described action to supply the wafer w to the process module 100b. A subsequent particular process is performed at the second process module 100b. Next, the polygon elevating robot 15 takes the wafer w from the process module 100b and repeats the above-described action to sequentially supply the wafer w to the process modules 100c and 100d where particular processes are performed.
Next, the polygon elevating robot 15 takes the wafer w from the process module 100d.
Next, the polygon elevating robot 15 is moved down by the polygon elevator 15e to move the wafer w to a position corresponding to the process module 100e.
Next, the polygon elevating robot 15 repeats the above operation to sequentially supply the wafer w to the process modules 100e, 100f, 100g, and 100h performing continuous processes.
Next, the polygon elevating robot 15 takes the wafer w from the last process module 100h to a position corresponding to the first polygon path 22. Next, as the second load lock vat valve 46 of the load lock unit 40 descends, the first polygon path 22 is open. The polygon elevating robot 15 inserts the wafer w having sequentially completed particular processes into the slot of the cool station. Here, if other wafer is already inserted in the slot of the cool station, the load lock elevator 44 is operated to ascend the cool station 42 so that the wafer w having sequentially completed particular processes are inserted in empty slots.
Next, the second load lock valve 46 ascends to close the first polygon path 22.
In the meantime, since the wafer w is in a state of being heated, the inert gas is taken into the load lock unit 40 to cool the wafer w to an appropriate temperature.
Next, a vent member (not shown) is operated to make the inside of the load lock main body 41 at an atmospheric pressure which is the pressure in the wafer distribution tower 30.
Next, the first load lock vat valve 45 of the load lock unit 40 descends to open the distribution path 31 a'. The elevating robot 35 moves to take the wafer w having completed the sequential processes from the cool station 42 through the distribution path 31 a' and accommodate the wafer w in the FOUP 36a of the first load port module 36. Here, the wafer returns to the slot of the same FOUP from which it has been taken.
Although a single wafer is exampled in the above-described preferred embodiment, it is obvious that processes can be performed with respect to a plurality of wafers at the same time. For example, if the wafer having undergone a particular process at the process module 100a proceeds to the process module 100b, then a new wafer is accommodated in the process module 100a so that a plurality of wafers can be continuously processed. While this invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Industrial Applicability
As described above, according to the present invention, a polygon module unit formed by incorporating a plurality of process modules for performing a series of continuous processes is adopted so that the amount of production per unit area can be increased.
Also, by preventing the wafer from being exposed to the outside, the number of particles falling onto the wafer can be reduced or an oxide film generated on the wafer by air can be minimized. Thus, a production yield can be improved.

Claims

What is claimed is;
1. An automatic continuous wafer processing system comprising: a polygon module unit including a polygon tower where at least one first polygon path through which a wafer passes is formed, a plurality of process modules coupled in a cluster in a row direction and a column direction at each of the other sides of the polygon tower except for a surface where the first polygon path and processing a wafer that is taken in, and a polygon elevating robot moving up and down in a vertical direction in the polygon tower and transferring the wafer to the process modules; a wafer distribution tower including a tower main body where a distribution path is formed in the same number of the first polygon path, an aligner fixed in the tower main body to recognize a degree of misalignment of the wafer that is inserted and generate corresponding information, and an elevating robot installed in the tower main body to be capable of moving up and down to take the wafer from the aligner and move the wafer up and down to a position corresponding to each of the distribution paths; and at least one load lock unit installed between the polygon module unit and the wafer distribution tower to correspond to the first polygon path and the distribution path, temporarily keeping the wafer passing through the first polygon path and the distribution path, and separating the polygon module unit from the wafer distribution tower.
2. The system of claim 1 , wherein the wafer distribution tower comprises at least one load port module where a FOUP for accommodating wafers waiting for processes or completed the processes is installed.
3. The system of claim 2, wherein a fan filter for removing foreign material included in air taken in is installed at the wafer distribution tower.
4. The system of claim 1 , wherein the elevating robot comprises a robot main body moving in a vertical direction in the tower main body, a rotation shaft rotating on the robot main body, an arm installed at the rotation shaft, and a finger performing a joint movement with respect to the arm and taking the wafer.
5. The system of claim 1 , wherein the load lock units comprise a load lock main body installed to connect the first polygon path and the distribution path, a cool station installed in the load lock main body and having a plurality of slots formed therein where the wafers are accommodated and cooling the accommodated wafers, a load lock elevator to move the cool station up and down to an appropriate height at which the polygon elevating robot or the elevating robot takes the wafer, a load lock vat valve to open and close the distribution paths, and a second load lock vat valve to open and close the first polygon paths.
6. The system of claim 1 , wherein the polygon elevating robot comprises a polygon elevator installed in the polygon tower in a vertical direction, a robot main body moving up and down by the polygon elevator, a rotation shaft rotating on the robot main body, an arm performing a joint movement with respect to the rotation shaft, and a finger performing a joint movement with respect to the arm to take the wafer.
7. A method of processing a wafer using a wafer processing system including a polygon module unit comprising a polygon tower where at least one first polygon path through which the wafer passes is formed, a plurality of process modules coupled to each of the other sides of the polygon tower except for a surface where the first polygon path is formed in a cluster and in a row direction and column direction to process the wafer taken in, and a polygon elevating robot moving up and down in the polygon tower to transfer the wafer to the process modules; and at least one load lock unit installed at the polygon tower to correspond to the first polygon path and temporarily keeping the wafer passing through the first polygon path, the process modules having a sequential relationship for process of the wafer and being sequentially arranged clockwise or counterclockwise around the polygon tower, the method comprising the steps of: the polygon elevating robot transferring the wafer temporarily kept in the load lock unit to a first process module where a particular process is performed; the polygon elevating robot taking the wafer from the first process module and transferring the wafer to a subsequent process module sequentially and clockwise or counterclockwise; and the polygon elevating robot taking the wafer from a process module performing a final process of the sequential continuous processes and transferring the wafer to the load lock unit.
PCT/KR2002/000457 2001-03-17 2002-03-18 Automatic continue wafer processing system and method for using the same WO2002075789A1 (en)

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Citations (3)

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Publication number Priority date Publication date Assignee Title
EP0837494A2 (en) * 1996-10-21 1998-04-22 Applied Materials, Inc. Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool
JPH1140643A (en) * 1997-07-22 1999-02-12 Dainippon Screen Mfg Co Ltd Substrate processor
US6042623A (en) * 1998-01-12 2000-03-28 Tokyo Electron Limited Two-wafer loadlock wafer processing apparatus and loading and unloading method therefor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0837494A2 (en) * 1996-10-21 1998-04-22 Applied Materials, Inc. Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool
US6074443A (en) * 1996-10-21 2000-06-13 Applied Materials, Inc. Method and apparatus for scheduling wafer processing within a multiple chamber semiconductor wafer processing tool having a multiple blade robot
JPH1140643A (en) * 1997-07-22 1999-02-12 Dainippon Screen Mfg Co Ltd Substrate processor
US6042623A (en) * 1998-01-12 2000-03-28 Tokyo Electron Limited Two-wafer loadlock wafer processing apparatus and loading and unloading method therefor

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