WO2015054952A1 - 基板运输设备及运输方法 - Google Patents

基板运输设备及运输方法 Download PDF

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Publication number
WO2015054952A1
WO2015054952A1 PCT/CN2013/089094 CN2013089094W WO2015054952A1 WO 2015054952 A1 WO2015054952 A1 WO 2015054952A1 CN 2013089094 W CN2013089094 W CN 2013089094W WO 2015054952 A1 WO2015054952 A1 WO 2015054952A1
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processing chamber
cassette
processing
substrate
chamber
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PCT/CN2013/089094
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English (en)
French (fr)
Inventor
陈增宏
吴俊豪
林昆贤
汪永强
杨卫兵
齐明虎
李晨阳子
杨国坤
蒋运芍
舒志优
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深圳市华星光电技术有限公司
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Publication of WO2015054952A1 publication Critical patent/WO2015054952A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733—Overhead conveying

Definitions

  • the present invention relates to substrate technology, and more particularly to a substrate transport apparatus and method of transport.
  • the substrate of the TFT-LCD requires different processing in different processing chambers, such as coating, exposure, etching, photoresist removal, etc., which need to be processed in different processing chambers.
  • processing chambers such as coating, exposure, etching, photoresist removal, etc.
  • FIG. 1 the transportation of the substrate between the various processing chambers in the industry is as shown in FIG.
  • Each processing chamber is disposed parallel to the moving direction of the transporter.
  • the transporter 100 is transported to the first inlet 301 of the first processing chamber 300, and the cassette 200 is in the first A processing chamber 300 performs processing, and the processed cassette 200 is output from the first outlet 302 of the first processing chamber 300; then transported by the carrier 100 to the second inlet 401 of the second processing chamber 400, in the second processing chamber 400. After processing, it is delivered by the second outlet 402 of the second processing chamber 400.
  • the present invention solves the above problems by constructing a substrate transport apparatus including a cassette for loading a substrate and a transporter for transporting the cassette, and the first step for processing the cassette is disposed in a direction perpendicular to the movement direction of the transporter. a processing chamber and a second processing chamber; the first processing chamber and the second processing chamber are disposed on the same side of the moving direction of the transporter, the distance between the first processing chamber and the transporter is smaller than the distance between the second processing chamber and the transporter;
  • the transport apparatus also includes a first conveyor belt disposed between the first processing chamber and the second processing chamber for driving the cassette from the first processing chamber to the second processing chamber.
  • the first processing chamber includes a first inlet for moving into the cassette and a first outlet for removing the cassette;
  • the second processing chamber includes a second inlet for moving into the cassette and for removing a second outlet of the cassette; one end of the first conveyor extends from the first outlet into the first processing chamber and the other end extends from the second inlet into the second processing chamber.
  • the substrate transporting apparatus of the present invention comprises a plurality of first processing chambers arranged side by side parallel to the moving direction of the transporting machine and a plurality of second processing chambers arranged side by side parallel to the moving direction of the transporting machine, and the second adjacent processing chambers
  • the two inlets are connected by a second conveyor belt.
  • the first processing chamber further includes a third outlet for outputting the cassette.
  • the first processing chamber is an etching chamber
  • the second processing chamber is a photoresist removing chamber
  • the present invention also provides a method of transporting using the above apparatus, comprising the steps of:
  • the conveyor removes the cassette processed through the second processing chamber.
  • step S100 further comprises:
  • the carrier transports the cassette to the first inlet of the first processing chamber.
  • step S200 further comprises:
  • the cassette is output from the first outlet of the first processing chamber and transported to the second inlet of the second processing chamber along a conveyor belt connecting the first processing chamber and the second processing chamber.
  • step S100 further comprises:
  • the carrier transports the cassette to the first processing chamber; otherwise, the carrier transports the cassette to the second conveyor that connects the second inlets of the plurality of second processing chambers.
  • the transporter can complete the process flow in the first processing chamber and the second processing chamber by transporting the cassette to the input port, and the processing is not required in the middle, thereby reducing handling
  • the amount of machine handling reduces the production cycle time of the substrate and increases the production capacity.
  • FIG. 1 is a schematic view of a conventional substrate transportation device
  • FIG. 2 is a schematic structural view of a first embodiment of a substrate transporting apparatus according to the present invention
  • FIG. 3 is a schematic structural view of a second embodiment of a substrate transport apparatus according to the present invention.
  • FIG. 4 is a flow chart of a method of using the second embodiment of the substrate transport apparatus of the present invention.
  • the carrier 100 requires multiple handling of the cassette 200 during substrate production.
  • the present invention improves the manner in which the original processing chambers are disposed in parallel so that the number of handling of the cassettes 100 for the cassettes 200 is minimized during handling.
  • FIG. 2 is a schematic structural view of a first embodiment of a substrate transporting apparatus according to the present invention.
  • the original parallel processing chambers are changed into a mixed series, that is, the first processing chamber 300 and the second processing chamber.
  • 400 is disposed perpendicular to the moving direction of the transporter 100, and the first processing chamber 300 and the second processing chamber 400 are disposed on the same side of the moving direction of the transporter 100, and the distance between the first processing chamber 300 and the transporter 100 is smaller than the second processing.
  • the first process chamber 300 and the second process chamber 400 may be various process chambers in the substrate production process, for example, the first process chamber 300 is an etch chamber, and the second process chamber 400 is a photoresist chamber.
  • Each processing chamber has at least one inlet (301, 401) for inputting the cassette 200 and at least one outlet (302, 402) for outputting the cassette 200.
  • the first outlet 302 of the first processing chamber 300 and the second inlet 401 of the second processing chamber 400 are connected using the first conveyor belt 501.
  • the handler 100 When transporting using this embodiment.
  • the handler 100 first transports the cassette 200 to the first inlet 301 of the first processing chamber 300, and the cassette 200 is sent to the first processing chamber 300 for processing, for example, etching.
  • the processed cassette 200 is transported from the first outlet 302 of the first processing chamber 300 and transported along the first conveyor belt 501 to the second inlet 401 of the second processing chamber 400, and the cassette 200 is sent to the second processing.
  • the chamber 400 is subjected to a process such as performing a photoresist.
  • the cassette 200 is output from the second outlet 402 of the second processing chamber 400 and then transported by the carrier 100 to the next position.
  • the handler 100 transports the cassette 200 only after all the processes have been placed and removed, and the intermediate process does not operate it, thereby reducing the handling of the conveyor and reducing the production substrate cycle. time.
  • a third outlet 303 for outputting the cassette 200 is further disposed on the first processing chamber 300, and the cassette 200 processed by the first processing chamber 300 can be externally controlled for the next process or by the handler. 100 carries out unplanned operations such as process quality inspection.
  • the first inlet 301, the third outlet 303 of the first processing chamber 300, and the second outlet 402 of the second processing chamber 400 are opened at a distance equal to the vertical direction of the conveyor 100 so that the handler 100 can be used each time.
  • the distance to the delivery port is equal.
  • the present invention connects the plurality of first processing chambers 300 and the plurality of second processing chambers 400 through a common second conveyor belt 502, as shown in the second embodiment of FIG.
  • a second inlet of the two second processing chambers 400 is connected by a T-shaped second conveyor belt 502 between two sets of first processing chamber 300 and second processing chamber 400 that are parallel to the direction of movement of the handler 100. 401.
  • some substrates that require only the second processing chamber 400 to be processed can be sent to the second processing chamber 400 through the second conveyor belt 502 for operation.
  • the equipment failure of the first processing chamber 300 or the downtime caused by the maintenance can be effectively reduced.
  • the processing can be carried out after being processed by the first processing chamber 300.
  • the substrate is returned directly to the processing of the second processing chamber 400, reducing the amount of handling carried by the carrier 100 to transport it to the second inlet 401 of the second, second processing chamber.
  • step S100 it is determined whether the substrate in the cassette 200 has passed the process of the first processing chamber 300. If the substrate has been processed by the first processing chamber 300, it is transported by the carrier 100 to the second conveyor belt 502. Otherwise, the cassette 200 is transported to the first inlet 301 of the first processing chamber, and the substrate in the cassette 200 is processed by the first processing chamber 300. If it is necessary to take out the processed cassette 200, the cassette 100 takes out the cassette 200 at the second outlet 303 of the first processing chamber, and otherwise proceeds to step S200.
  • step S200 the cassette 200 processed by the first processing chamber 300 is along a conveyor belt connecting the first processing chamber 300 and the second processing chamber 400 or a second conveying connecting the plurality of second processing chamber second inlets 401.
  • the belt 502 is conveyed to the second processing chamber 400 to perform the processing of the second processing chamber 400.
  • the present invention is described using two processing chambers. It should be understood that multiple processing chambers may be mixed and connected in a plurality of processes, that is, the previous process flow.
  • the processing chamber output port is connected to the input port of the processing chamber of the latter process by a conveyor belt.
  • four processes including coating, exposure, etching, and photoresist removal are included.
  • the processing chambers of the four processes can be connected in series, and then connected to the output port of the last processing chamber by a conveyor belt. A position that is flush with the first processing chamber input. In this way, the handling of the cassette can be minimized in the entire process, thereby increasing productivity.

Abstract

一种基板运输设备，包括用于装载基板的卡匣（200）与用于搬运卡匣的搬运机（100），沿垂直于搬运机运动方向依次设置有用于处理卡匣的第一处理室（300）和第二处理室（400），在第一处理室和第二处理室之间设置有用于驱动卡匣从第一处理室移至第二处理室的第一输送带（501）。搬运机只需将卡匣搬运至输入口，在工艺流程期间无需搬运机再进行处理，从而减少了搬运量，减少了基板生产周期时间，提高了产能。还提供了一种基板运输方法。

Description

基板运输设备及运输方法 技术领域
本发明涉及基板技术，更具体地说，涉及一种基板运输设备及运输方法。
背景技术
在基板的过程中，例如TFT-LCD的基板，需要在不同的处理室中进行不同的工艺处理，如镀膜、曝光、刻蚀、去光阻等均需要在不同的处理室中进行处理。目前行业内对于基板在各个处理室之间的搬运采用的是如图1的方式。各个处理室沿平行于搬运机运动方向设置，待处理的基板使用卡匣200装好后，使用搬运机100（crane）搬运到第一处理室300的第一入口301，卡匣200将在第一处理室300进行处理，处理后的卡匣200从第一处理室300的第一出口302输出；然后由搬运机100搬运至第二处理室400的第二入口401，在第二处理室400处理后由第二处理室400的第二出口402输送出来。
在上述的整个处理过程中，需要对于搬运机100进行多次移动，劳动量较大，一方面会对提高整体运营成本，另一方面这样的搬运方式会增加周期时间，不利于产能提升。
发明内容
本发明的目的在于，针对现有的基板方式会对提高整体运营成本以及增加周期时间的缺陷，提供一种基板运输设备及运输方法以克服上述问题。
本发明解决上述问题的方案是，构造一种基板运输设备，包括用于装载基板的卡匣与用于搬运卡匣的搬运机，沿垂直于搬运机运动方向依次设置有用于处理卡匣的第一处理室和第二处理室；第一处理室和第二处理室设置在搬运机的移动方向的同一侧，第一处理室与搬运机的距离小于第二处理室与搬运机的距离；基板运输设备还包括设置在第一处理室和第二处理室之间，用于驱动卡匣从第一处理室移至第二处理室的第一输送带。
本发明的基板运输设备，第一处理室包括用于移入卡匣的第一入口和用于移出卡匣的第一出口；第二处理室包括用于移入卡匣的第二入口和用于移出卡匣的第二出口；第一输送带的一端从第一出口延伸入第一处理室，另一端从第二入口延伸入第二处理室。
本发明的基板运输设备，包括多个平行于搬运机运动方向并排设置的第一处理室和多个平行于搬运机运动方向并排设置的第二处理室，相邻两个第二处理室的第二入口由第二输送带连接。
本发明的基板运输设备，第一处理室还包括用于输出卡匣的第三出口。
本发明的基板运输设备，第一处理室为刻蚀室，第二处理室为去光阻室。
本发明还提供利用上述设备进行运输的方法，包括以下步骤：
S0 、提供基板运输设备；
S100 、使用搬运机搬运卡匣至第一处理室，由第一处理室对卡匣进行工艺处理；
S200 、经过第一处理室处理的卡匣沿连接第一处理室和第二处理室的输送带输送到第二处理室，由第二处理室对卡匣进行工艺处理；
S300 、搬运机取出经过第二处理室处理的卡匣。
本发明的基板运输方法，其中步骤S100还包括：
搬运机搬运卡匣至第一处理室的第一入口。
本发明的基板运输方法，其中步骤S200还包括：
卡匣从第一处理室的第一出口输出，沿连接第一处理室和第二处理室的输送带输送到第二处理室的第二入口。
本发明的基板运输方法，其中步骤S100还包括：
当卡匣未经过第一处理室进行工艺处理时，搬运机搬运卡匣至第一处理室；否则搬运机搬运卡匣至连接多个第二处理室第二入口的第二输送带。
实施本发明的基板运输设备及运输方法，搬运机只要将卡匣搬运到输入口之后即可完成在第一处理室和第二处理室的工艺流程，中间无需搬运机进行处理，从而减少了搬运机的搬运量，减少了基板生产周期时间，提高了产能。
附图说明
以下结合附图对本发明进行说明，其中：
图1为现有的基板运输设备示意图；
图2为本发明基板运输设备第一实施例的结构示意图；
图3为本发明基板运输设备第二实施例的结构示意图；
图4为本发明基板运输设备第二实施例的使用方法的流程图。
具体实施方式
以下结合附图和具体实施方式对本发明进行详细说明。
为了克服如图1现有技术中，搬运机100需要在基板生产过程中对卡匣200的多次搬运的缺陷。本发明将原有的平行设置处理室的方式进行了改进，以使得在搬运过程中，搬运机100对于卡匣200的搬运次数降到最少。
如图2所示为本发明基板运输设备第一实施例的结构示意图，该实施例中将原有的平行设置的处理室改为混合串联的形式，即第一处理室300与第二处理室400相对于搬运机100的运动方向垂直设置，第一处理室300和第二处理室400设置在搬运机100的移动方向的同一侧，第一处理室300与搬运机100的距离小于第二处理室400与搬运机100的距离。第一处理室300和第二处理室400可以为基板生产过程中的各种处理室，例如第一处理室300为刻蚀室，第二处理室400为去光阻室。每个处理室均具有至少一个用于输入卡匣200的入口（301、401）和至少一个用于输出卡匣200的出口（302、402）。在本实施例中，第一处理室300的第一出口302与第二处理室400的第二入口401使用第一输送带501连接。
在使用该实施例进行运输的时候。搬运机100首先将卡匣200搬运到第一处理室300的第一入口301处，卡匣200被送入第一处理室300进行工艺处理，例如进行刻蚀。处理完的卡匣200从第一处理室300的第一出口302传送出来，并沿着第一输送带501运输到第二处理室400的第二入口401，卡匣200被送入第二处理室400进行工艺处理，例如进行出光阻。当进行完处理后，卡匣200从第二处理室400的第二出口402输出，然后由搬运机100搬运到下一个位置。整个过程中，搬运机100只在开始放置和取出完成所有工艺后对卡匣200进行搬运，中间的流程中并不会对其进行操作，从而减少了搬运机的搬运量，减少了生产基板周期时间。
优选的，在第一处理室300上还开设有用于输出卡匣200的第三出口303，经过第一处理室300处理的卡匣200可以由外部控制，进行下一步的工艺处理或者由搬运机100进行搬运进行计划外的操作，例如工艺质量检测等。
优选的，第一处理室300的第一入口301、第三出口303以及第二处理室400的第二出口402开设在与搬运机100的垂直方向距离相等的位置上，以便搬运机100每次移向输送口的距离都相等。
进一步的，本发明将多个第一处理室300和多个第二处理室400通过公用的第二输送带502进行连接，如图3的第二实施例所示。在两套平行于搬运机100运动方向并拍设置的第一处理室300和第二处理室400之间，由一个T字形的第二输送带502连接两个第二处理室400的第二入口401。这样，一些只需要第二处理室400进行工艺处理的基板就可以通过第二输送带502送到第二处理室400中进行操作。采用这样的第二输送带502，一方面可以有效的减少第一处理室300设备故障或者保养时所带来的停机时间，另一方面，可以对经过第一处理室300处理后移送去做测试的基板回来直接进行第二处理室400的工艺处理，减少了搬运机100将其搬运到较远的第二处理室的第二入口401所带来的搬运量。
采用第二实施例的结构进行工艺操作的方法流程图如图4所示。首先在步骤S100，判断卡匣200中的基板是否已经经过第一处理室300的工艺处理，若基板已经经过第一处理室300处理，则由搬运机100将其搬运至第二输送带502，否则将卡匣200搬运到第一处理室的第一入口301，由第一处理室300对卡匣200内的基板进行工艺处理。若需要取出处理后的卡匣200，则由搬运机100在第一处理室第二出口303将卡匣200取出，否则进入步骤S200。
此后在步骤S200，经过第一处理室300处理的卡匣200沿着连接第一处理室300和第二处理室400的输送带或者是连接多个第二处理室第二入口401的第二输送带502输送到第二处理室400，进行第二处理室400的工艺处理。
S300 、搬运机100从第二处理室第二出口402取出经过第二处理室400处理的卡匣200。
在以上的两个实施例中，均使用了两个处理室对本发明进行说明，需要理解的是，在需要进行多个工艺流程的时候可以将多个处理室进行混合串联，即前一个工艺流程的处理室输出口与后一个工艺流程的处理室的输入口用输送带进行连接。例如在一个完整的镀膜流程中包括了镀膜、曝光、蚀刻、去光阻等4个流程，可以将4个流程的处理室依次串联，然后在最后一个处理室的输出口，利用输送带连至与第一个处理室输入口平齐的位置。这样在整个工艺流程中，搬运机对于卡匣的搬运量就能够降至最少，从而提高产能。
以上仅为本发明具体实施方式，不能以此来限定本发明的范围，本技术领域内的一般技术人员根据本创作所作的均等变化，以及本领域内技术人员熟知的改变，都应仍属本发明涵盖的范围。

Claims (9)

  1. 一种基板运输设备，包括用于装载基板的卡匣（200）与用于搬运卡匣（200）的可移动的搬运机（100），其中，所述基板运输设备还包括用于处理卡匣（200）的第一处理室（300）和第二处理室（400），所述第一处理室（300）和所述第二处理室（400）设置在所述搬运机（100）的移动方向的同一侧，所述第一处理室（300）与所述搬运机（100）的距离小于所述第二处理室（400）与所述搬运机（100）的距离；以及设置在所述第一处理室（300）和第二处理室（400）之间的，用于驱动所述卡匣（200）从所述第一处理室（300）移至所述第二处理室（400）的第一输送带（501）。
  2. 根据权利要求1所述的基板运输设备，其中，所述第一处理室（300）包括用于移入所述卡匣（200）的第一入口（301）和用于移出所述卡匣（200）的第一出口（302）；所述第二处理室（400）包括用于移入所述卡匣（200）的第二入口（401）和用于移出所述卡匣（200）的第二出口（402）；所述第一输送带（501）的一端从所述第一出口（302）延伸入所述第一处理室，另一端从所述第二入口（401）延伸入所述第二处理室。
  3. 根据权利要求2的基板运输设备，其中，所述基板运输设备包括多个平行于所述搬运机（100）运动方向并排设置的第一处理室（300）和多个平行于所述搬运机（100）运动方向并排设置的第二处理室（400），相邻两个第二处理室（400）的第二入口（401）由第二输送带（502）连接。
  4. 根据权利要求2所述的基板运输设备，其中，所述第一处理室（300）还包括用于输出卡匣（200）的第三出口（303）。
  5. 根据权利要求1所述的基板运输设备，其中，所述第一处理室（300）为刻蚀室，所述第二处理室（400）为去光阻室。
  6. 一种基板运输方法，包括以下步骤：
    S0 、提供基板运输设备；
    S100 、使用搬运机搬运卡匣至第一处理室，由第一处理室对卡匣进行工艺处理；
    S200 、经过第一处理室处理的卡匣沿连接第一处理室和第二处理室的输送带输送到第二处理室，由第二处理室对卡匣进行工艺处理；
    S300 、搬运机取出经过第二处理室处理的卡匣。
  7. 根据权利要求6所述的基板运输方法，其中，所述步骤S100还包括：
    搬运机搬运卡匣至第一处理室的第一入口。
  8. 根据权利要求7所述的基板运输方法，所述步骤S200还包括：
    所述卡匣从第一处理室的第一出口输出，沿连接第一处理室和第二处理室的输送带输送到第二处理室的第二入口。
  9. 根据权利要求6所述的基板运输方法，其中，步骤S100还包括：
    当卡匣未经过第一处理室进行工艺处理时，搬运机搬运卡匣至第一处理室；否则搬运机搬运卡匣至连接多个第二处理室第二入口的第二输送带。
PCT/CN2013/089094 2013-10-17 2013-12-11 基板运输设备及运输方法 WO2015054952A1 (zh)

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