CN101199961B - 狭缝喷嘴 - Google Patents

狭缝喷嘴 Download PDF

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Publication number
CN101199961B
CN101199961B CN2007101953264A CN200710195326A CN101199961B CN 101199961 B CN101199961 B CN 101199961B CN 2007101953264 A CN2007101953264 A CN 2007101953264A CN 200710195326 A CN200710195326 A CN 200710195326A CN 101199961 B CN101199961 B CN 101199961B
Authority
CN
China
Prior art keywords
coating liquid
slit nozzle
slit
nozzle
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2007101953264A
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English (en)
Chinese (zh)
Other versions
CN101199961A (zh
Inventor
高瀬真治
山口和伸
熊泽博嗣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ameco Technology Co ltd
Process Equipment Business Division Preparation Co.,Ltd.
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of CN101199961A publication Critical patent/CN101199961A/zh
Application granted granted Critical
Publication of CN101199961B publication Critical patent/CN101199961B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

Landscapes

  • Coating Apparatus (AREA)
  • Nozzles (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN2007101953264A 2006-12-12 2007-12-10 狭缝喷嘴 Active CN101199961B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006-333930 2006-12-12
JP2006333930 2006-12-12
JP2006333930A JP5202838B2 (ja) 2006-12-12 2006-12-12 スリットノズル

Publications (2)

Publication Number Publication Date
CN101199961A CN101199961A (zh) 2008-06-18
CN101199961B true CN101199961B (zh) 2011-02-09

Family

ID=39515429

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007101953264A Active CN101199961B (zh) 2006-12-12 2007-12-10 狭缝喷嘴

Country Status (4)

Country Link
JP (1) JP5202838B2 (https=)
KR (1) KR100940986B1 (https=)
CN (1) CN101199961B (https=)
TW (1) TW200900162A (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5157486B2 (ja) * 2008-01-30 2013-03-06 大日本印刷株式会社 ダイヘッド及びこれを備えたダイコーター
KR100968770B1 (ko) * 2008-06-20 2010-07-08 주식회사 디엠에스 현상액 도포장치
JP5303232B2 (ja) * 2008-09-30 2013-10-02 東京応化工業株式会社 ノズル、塗布装置及びノズルのメンテナンス方法
JP5764978B2 (ja) * 2011-03-04 2015-08-19 東レ株式会社 塗布器
CN102688828A (zh) * 2011-03-25 2012-09-26 恒辉新能源（昆山）有限公司 高精度涂布器
JP5815984B2 (ja) * 2011-05-19 2015-11-17 富士機械工業株式会社 塗工装置
JP5970864B2 (ja) * 2012-03-02 2016-08-17 大日本印刷株式会社 スリットノズル
CN103801466B (zh) * 2012-11-15 2015-11-18 沈阳芯源微电子设备有限公司 一种低冲击力均布流量的湿法处理工艺喷嘴
JP5494788B2 (ja) * 2012-12-06 2014-05-21 大日本印刷株式会社 ダイヘッド及びこれを備えたダイコーター
KR102052061B1 (ko) * 2013-05-24 2019-12-04 삼성에스디아이 주식회사 슬릿 노즐의 형상 결정장치 및 방법
KR102106443B1 (ko) * 2013-05-24 2020-05-04 삼성에스디아이 주식회사 슬릿 노즐 및 이를 이용한 슬릿 코팅 장치
JP6196916B2 (ja) * 2014-02-25 2017-09-13 東京応化工業株式会社 ノズルおよび塗布装置
CN103984213B (zh) * 2014-04-15 2017-05-31 清华大学深圳研究生院 一种具有均压流道的均匀出流显影喷嘴
CN104166318A (zh) * 2014-09-09 2014-11-26 清华大学深圳研究生院 静压出流显影喷嘴
JP6367075B2 (ja) * 2014-10-08 2018-08-01 株式会社ヒラノテクシード ダイとダイの空気抜き方法
JP6564648B2 (ja) * 2015-08-20 2019-08-21 東京応化工業株式会社 ノズルおよび塗布装置
CN105170406B (zh) * 2015-09-16 2018-04-24 华南师范大学 狭缝涂布单元、涂布头以及涂布设备
JP6341957B2 (ja) * 2016-08-10 2018-06-13 富士機械工業株式会社 塗工装置
KR102368359B1 (ko) * 2019-05-14 2022-02-25 주식회사 엘지에너지솔루션 에어 벤트를 포함하는 슬롯 다이 코팅 장치
JP2022041420A (ja) * 2020-09-01 2022-03-11 エムテックスマート株式会社 塗布方法、燃料電池の製造方法または燃料電池、２次電池の製造方法または２次電池、全固体電池の製造方法または全固体電池
JP7836973B2 (ja) * 2021-04-09 2026-03-30 パナソニックＩｐマネジメント株式会社 塗工用ダイおよび塗工装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1806934A (zh) * 2005-01-19 2006-07-26 东京応化工业株式会社 缝隙嘴

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11156278A (ja) * 1997-11-27 1999-06-15 Dainippon Screen Mfg Co Ltd 処理液吐出ノズル及びそれを備えた基板処理装置
JP2003245583A (ja) * 2002-02-25 2003-09-02 Hirata Corp 液体塗布装置
JP4315787B2 (ja) * 2003-11-18 2009-08-19 大日本スクリーン製造株式会社 基板処理装置、並びに被充填体における液体充填度および気体混入度判定構造
KR20050116417A (ko) * 2004-06-07 2005-12-12 삼성전자주식회사 코팅물질 도포장치
JP2005349280A (ja) * 2004-06-09 2005-12-22 Tokyo Ohka Kogyo Co Ltd スリットノズル
JP4835003B2 (ja) * 2005-02-07 2011-12-14 凸版印刷株式会社 スリットノズル及びスリットノズルの気泡排出方法並びに塗布装置
KR200427086Y1 (ko) 2006-07-03 2006-09-20 박대용 방사 노즐

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1806934A (zh) * 2005-01-19 2006-07-26 东京応化工业株式会社 缝隙嘴

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2005-349280A 2005.12.22

Also Published As

Publication number Publication date
KR100940986B1 (ko) 2010-02-05
TWI330109B (https=) 2010-09-11
JP2008142648A (ja) 2008-06-26
TW200900162A (en) 2009-01-01
KR20080054348A (ko) 2008-06-17
JP5202838B2 (ja) 2013-06-05
CN101199961A (zh) 2008-06-18

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C06 Publication
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SE01 Entry into force of request for substantive examination
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GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20230531

Address after: Kanagawa, Japan

Patentee after: Process Equipment Business Division Preparation Co.,Ltd.

Address before: Kanagawa

Patentee before: TOKYO OHKA KOGYO Co.,Ltd.

Effective date of registration: 20230531

Address after: Ibaraki

Patentee after: Ameco Technology Co.,Ltd.

Address before: Kanagawa, Japan

Patentee before: Process Equipment Business Division Preparation Co.,Ltd.

TR01 Transfer of patent right