CN101193529A - 散热装置 - Google Patents

散热装置 Download PDF

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CN101193529A
CN101193529A CNA2006101570597A CN200610157059A CN101193529A CN 101193529 A CN101193529 A CN 101193529A CN A2006101570597 A CNA2006101570597 A CN A2006101570597A CN 200610157059 A CN200610157059 A CN 200610157059A CN 101193529 A CN101193529 A CN 101193529A
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heat
radiating fin
runner
water conservancy
conservancy diversion
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CN101193529B (zh
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周世文
陈俊吉
陈葆春
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QUANYIDA TECHNOLOGY (FOSHAN) Co Ltd
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
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  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热装置,包括一基座、至少一热管以及若干散热鳍片;所述至少一热管具有与所述基座相连的吸热部和穿设于所述散热鳍片中的放热部;所述散热鳍片间隔排列,且每相邻的两散热鳍片间形成供气流通过的流道,所述流道中设置有导流结构,以将从流道入口流入的气流导向所述热管的放热部与散热鳍片的结合处。所述导流结构改变进入流道的气流方向,以根据散热鳍片各处的温度高低不同,重新分布气流,以使散热鳍片与热管结合的高温区域具有大量的气流,针对性加快高热区的散热。

Description

散热装置
技术领域
本发明涉及一种散热装置,特别是指一种具有导流结构的散热装置。
背景技术
随着电子产业的迅速发展,如计算机中电子元件的运算速度大幅度提高,其产生的热量也随之剧增,如何将电子元件的热量散发出去,以保证其正常运行,一直是业者必需解决的问题。众所周知,安装在主机板上的中央处理器是电脑系统的核心,当电脑运行时,中央处理器产生热量。过多的热量会导致中央处理器无法正常运行。为有效散发中央处理器在运行过程中产生的热量,通常在电路板上加装一与中央处理器接触的散热装置以便将其产生的热量散发出去。
为提高散热效率以满足越来越高的散热需求,目前很多产品中采用了热管,并在该散热装置的一侧加装一风扇以加快空气流动。该散热装置通常包括一基座、若干平行基座并间隔排列的散热鳍片、连接基座及散热鳍片的U形热管及安装于散热鳍片一侧的风扇。该U形热管包括焊接在基座上的水平部和二分别穿过散热鳍片两端的竖直部。该风扇平行热管安装,其产生的强制气流可将散热鳍片中的热量带走。这些U形热管将基座上的热量传导到散热鳍片的靠向两端部分,使散热鳍片与热管接触处及其附近区域温度较高,如果对该集热区域加快热量的散发,将使该散热装置的散热效率能得到相应的提高。
发明内容
本发明旨在提供一种有效利用风扇气流的散热装置。
一种散热装置,包括一基座、至少一热管以及若干散热鳍片;所述至少一热管具有与所述基座相连的吸热部和穿设于所述散热鳍片中的放热部;所述散热鳍片间隔排列,且每相邻的两散热鳍片间形成供气流通过的流道,所述流道中设置有导流结构,以将从流道入口流入的气流导向所述热管的放热部与散热鳍片的结合处。
本发明的散热装置的散热鳍片上设置有导流结构,以改变进入流道的气流方向,以根据散热鳍片各处的温度高低不同,重新分布气流,以使散热鳍片与热管结合的高温区域具有大量的气流,针对性加快高热区的散热。
下面参照附图,结合实施例对本发明作进一步的描述。
附图说明
图1是本发明第一实施例中散热装置的组装图。
图2是图1中的立体分解图。
图3是图2中散热片的放大图。
图4是本发明第二实施例中的散热片的立体图。
图5是本发明第三实施例中的散热片的立体图。
具体实施方式
图1和图2所示为本发明第一实施的散热装置,该散热装置包括一散热器10和一风扇20。该风扇20通过一对固定于散热器10两侧的风扇固定架30安装于散热器10前侧。
该散热器10包括一基座12,一第二散热鳍片组16,一导风架17,一第一散热鳍片组18及用以将基座12和第一散热鳍片组18导热连接的三热管14。
该基座12具有一矩形本体120,该本体120顶面上开设三相互平行的凹槽122,且三凹槽122中有两相邻的凹槽122较另一凹槽122的两端向内凹陷一些。该基座12的四角各连接一凸耳124。该凸耳124靠近末端穿设紧固件50,用以将散热器10固定到中央处理器(图未示)上。
每一热管14均呈U形设置,并包括一吸热部140及从吸热部140两端向上延伸的二平行放热部142,该吸热部140收容于基座12的凹槽124内以吸收来自基座12的热量。如图2所示,三热管14中最左边的热管14下端部分朝一侧小角度弯折,中间的热管14下端部分朝一侧更小角度弯折,最右边的热管14则在同一平面上并无弯折。这两下端部有弯折的热管14的吸热部140容置在两端有凹陷的凹槽122内。
该第二散热鳍片组16可由铝等材料一体弯折成型,该第二散热鳍片组16包括若干散热片160、将散热片160连接的上折边162和下折边164。所有上、下折边162、164分别形成上下平面,其中下折边164形成的下平面焊接在热管16吸热部160的顶面上,这样热管16的部分热量就可以传导到第二散热鳍片组16上,由第二散热鳍片组16散发到周围的环境中。
该导风架17夹置在第二散热鳍片组16及第一散热鳍片组18之间,该导风架17可以用作导流罩,将由风扇20产生的部分穿过第二散热鳍片组16后的气流导向位于中央处理器周围的电子元件(图未示)上。该导风架17具有与第二散热鳍片组16的散热片160垂直的一本体170,该本体170与基座12相隔设置,本体170尾部边缘弯折延伸出一向下弯折并朝向基座12呈弧形弯曲的导风部172;本体170两侧边缘各弯折延伸出一与本体170垂直的挡风板174。该本体170的两端开设有两排相互平行的透孔176,每排有三个透孔176,以供三热管14的放热部142从中穿过。
该第一散热鳍片组18由若干相互扣合的散热鳍片180堆叠排列而成,每一散热鳍片188都与基座12保持平行,且每两相邻散热鳍片180之间形成沿前后方向延伸的流道188。该散热鳍片180的中央位置设置有一导流结构,在本实施例中该导流结构为一楔形通孔182及沿其边缘垂直弯折延伸的导流侧壁1820,该楔形通孔182的尖端正对风扇20,即该尖端两侧的导流侧壁1820相对风扇20的气流方向倾斜;所述两侧导流侧壁1820靠近流道气流入口的两端部间的距离小于该导流侧壁1820远离流道入口的两端部间的距离,该导流侧壁1820的高度等于其所在流道180对应的两相邻散热鳍片180的距离,且该导流侧壁1820对风扇20产生的气流有导流作用。散热鳍片180两端上各设有三并列的穿孔184,该穿孔184用以收容热管14的放热部142,该穿孔184边缘延伸设有环壁1840,以增大第一散热鳍片180与放热部142接触表面积,这些热管14放热部140容置在所有散热鳍片180的穿孔184和环壁1840组成的通道中,将基座12的热量传导到散热鳍片180两端。该散热鳍片组18两相对侧面上各形成有一卡槽186,风扇固定架30卡制在卡槽186中,风扇20通过螺钉(未标号)与风扇固定架30连接从而实现与第一散热鳍片组18结合。
在该散热器10工作时,安装于第一散热鳍片组18前侧的风扇20运转产生的气流从中部进入流道188后将与位于流道中部的导流侧壁1820相遇,本来垂直风扇20扇叶面产生的平行气流撞击在楔形通孔182的两导流侧壁1820上后,气流方向改变,被导向散热鳍片180两侧与热管14放热部142的结合处。这样风扇20产生的气流就可以更多地流经第一散热鳍片18与热管14结合的温度较高区域,从而使风扇20产生的强制气流得到有效的利用,极大地提高散热器10的整体散热效率。
如图4所示,在第二实施例中散热鳍片190中部设置的导流结构为一向下冲压形成的楔形凸部192,该凸部192包括一垂直散热鳍片190的导流侧壁1920及与散热鳍片190平行的楔形顶壁1922;如图5所示,在第三实施例中散热鳍片150中部的导流结构为二相互成八字的直线形条孔152,该二条孔152相邻的内侧分别向下弯折延伸一折边1520。上述第二实施例的楔形凸部192尖端两侧的导流侧壁1920或第三实施例中的折边1520均和第一实施例一样相对所述风扇20的气流方向倾斜;每一所述侧壁1920或折边1520靠近流道气流入口的两端部间的距离小于该侧壁1920或折边1520远离流道入口的两端部间的距离,它们的功效原理也均与第一实施例的导流结构相同。

Claims (8)

1.一种散热装置,包括一基座、至少一热管以及若干散热鳍片;所述至少一热管具有与所述基座相连的吸热部和穿设于所述散热鳍片中的放热部;所述散热鳍片间隔排列,且每相邻的两散热鳍片间形成供气流通过的流道,其特征在于:所述流道中设置有导流结构,以将从流道入口流入的气流导向所述热管的放热部与散热鳍片的结合处。
2.如权利要求1所述的散热装置,其特征在于:所述导流结构包括两导流侧壁,该两导流侧壁相对流入流道的气流的方向倾斜;所述两侧壁靠近流道入口的两端间的距离小于该两侧壁远离流道入口的两端部间的距离。
3.如权利要求2所述的散热装置,其特征在于:所述导流侧壁的高度等于其所在流道对应的两相邻的散热鳍片的距离。
4.如权利要求3所述的散热装置,其特征在于:所述散热鳍片上设有楔形穿孔,所述导流侧壁由所述楔形穿孔的边缘弯折延伸而出。
5.如权利要求3所述的散热装置,其特征在于:述散热鳍片上设有楔形凸部,所述导流侧壁为形成于所述楔形凸部的侧壁。
6.如权利要求3所述的散热装置,其特征在于:述散热鳍片上设有二相互成八字形的直线形条孔,所述导流侧壁为二直线形条孔的折边。
7.如权利要求1所述的散热装置,其特征在于:所述至少一热管呈U形,包括两放热部,该两放热部均穿设于所述散热鳍片中,并位于所述导流结构的两侧。
8.如权利要求2所述的散热装置,其特征在于:所述至少一热管包括多个U形热管,所述U形热管在所述流入流道的气流方向上间隔排列。
CN2006101570597A 2006-11-24 2006-11-24 散热装置 Active CN101193529B (zh)

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CN107577321A (zh) * 2017-10-26 2018-01-12 航天特种材料及工艺技术研究所 一种基于相变材料的散热器
CN108271332A (zh) * 2017-01-03 2018-07-10 广达电脑股份有限公司 散热装置
CN111372146A (zh) * 2020-03-02 2020-07-03 姚向映 一种具有新型散热结构的无线路由器

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