US20110056658A1 - Heat pipe assembly and heat dissipation device having the same - Google Patents
Heat pipe assembly and heat dissipation device having the same Download PDFInfo
- Publication number
- US20110056658A1 US20110056658A1 US12/554,865 US55486509A US2011056658A1 US 20110056658 A1 US20110056658 A1 US 20110056658A1 US 55486509 A US55486509 A US 55486509A US 2011056658 A1 US2011056658 A1 US 2011056658A1
- Authority
- US
- United States
- Prior art keywords
- heat
- heat pipes
- evaporating
- sections
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to heat dissipation devices, and particularly to a heat pipe assembly including a number of heat pipes and a fixing structure which enables evaporating sections of the heat pipes being parallel to and adjoining with each other, and a heat dissipation device including such a heat pipe assembly.
- the heat dissipation device includes a heat pipe which uses a gas-liquid phase transition technology to dissipate the heat generated by the electronic elements.
- a number of heat pipes are included in the heat dissipation device.
- the heat pipes are secured to a base seat or a heat conducting seat of the heat dissipation device by welding method.
- evaporation sections of the heat pipes may be embedded in the grooves defined on the base seat or the heat conducting seat of the heat dissipation device and secured to the base seat or the heat conducting seat.
- the welding process is not easy to perform and the welded heat dissipation device has an unattractive appearance.
- the evaporation sections of the heat pipes When the evaporation sections of the heat pipes are embedded in the groves of the base seat or a heat conducting seat, the evaporation sections must be spaced from each other and can not be tightly adjoin with each other, whereby the evaporating sections can not be gathered to thermally contact with a surface of a heat generating electronic element. As a result, outermost two of the heat pipes can not be sufficiently used, thereby the heat dissipation device having low heat dissipation efficiency.
- the present invention provides a heat pipe assembly and a heat dissipation device including the heat pipe assembly.
- the heat pipe assembly includes a number of evaporation sections and a molded fixing seat.
- the fixing structure By the fixing structure, the evaporating sections of the heat pipe assembly are parallel to and adjoin with each other, whereby heat absorb surfaces of the evaporating sections are coplanar and adjoin with each other to thereby form a large-area heat absorbing surface to thermally contact with a heat generating electronic element.
- the heat pipe assembly includes a number of heat pipes and a fixing seat engaging with evaporating sections of the heat pipes.
- Each of the heat pipes includes an evaporating section and at least a condensing section.
- a bottom of the evaporation section of each of the heat pipes is flat and has a flat heat absorbing surface.
- the evaporating sections of the heat pipes are parallel to and adjoin with each other, whereby the heat absorbing surfaces thereof are coplanar and adjoin with each other.
- a top surface of the evaporating section of each of the heat pipes has a top edge.
- the fixing seat has an integral structure and combines with the top edges of the evaporating sections of the heat pipes, thereby facilitating the heat absorbing surfaces of the evaporating sections of the heat pipes being coplanar and adjoining with each other.
- a heat dissipation device including above-described heat pipe assembly is provided.
- the heat dissipation device further comprises a number of heat conducting fins disposed on the condensing sections of the heat pipes.
- FIG. 1 is a schematic, isometric view of a heat pipe assembly, according to a first embodiment of the present disclosure.
- FIG. 2 is a schematic, isometric view of the heat pipe assembly from a visual angle different from FIG. 1 .
- FIG. 3 is a partially, cross-sectional view of FIG. 1 .
- FIG. 4 is a partially, cross-sectional view of FIG. 2 .
- FIG. 5 is a partially, cross-sectional view of a heat pipe assembly, according to a second embodiment of the present disclosure.
- FIG. 6 is a partially, exploded view of a heat dissipation device of the present disclosure.
- FIGS. 1 and 2 are schematic, isometric views of a heat pipe assembly of the present invention in different visual angles.
- the heat pipe assembly includes a number of heat pipes 1 and a fixing seat 2 .
- Each of the heat pipes 1 is heat conducting element and includes a vacuous tubular body, a capillary structure disposed inside the tubular body and a working fluid contained in the tubular body and soaking the capillary structure.
- the tubular body of each of the heat pipes 1 is an integral structure and has a certain length.
- the heat pipes 1 each include an evaporating section 10 and at least a condensing section 11 connected with the evaporating section 10 .
- each of the heat pipes 1 has a U-shaped configuration, a bottom portion of the U-shaped configuration is the evaporating section 10 , and two lateral portions of the U-shaped configuration are two condensing sections 11 .
- a curved section 12 is connected between the evaporation section 10 and each condensing section 11 .
- the evaporation section 10 , two condensing sections 11 and two curved sections 12 cooperatively form each of the heat pipes 1 .
- a bottom of the evaporation section 10 of each of the heat pipes 1 is flat and has a flat heat absorbing surface 100 .
- Evaporating sections 10 of the heat pipes 1 are parallel to and adjoin with each other, whereby the heat absorb surfaces 100 of the evaporating sections 10 are coplanar and adjoin with each other to thereby form a large-area heat absorbing surface.
- the fixing seat 2 has an integral configuration and is made of plastic materials, such as, PC, PP, PE, PU or the like.
- the fixing seat 2 is made by integral molding process, e.g., injection molding, gel-casting molding, perfusion molding, die casting, dipping and so on.
- the fixing seat 2 engages with the evaporating sections 10 of the heat pipes 1 .
- the fixing seat 3 has a base 20 , a top surface the evaporation section 10 of each of the heat pipes 1 has a top edge 101 .
- the base 20 has a bottom surface combining with the top edge 101 of the top surface of the evaporation section 10 of each of the heat pipes 1 , whereby the evaporation sections 10 of the heat pipes 1 can be secured to enable the heat absorbing surfaces 100 of the evaporation sections 10 of the heat pipes 1 being parallel to and adjoining with each other.
- the heat absorbing surfaces 100 are coplanar and adjoin with each other to form a large-area surface, thereby facilitating thermally contacting with heat-generating sources (not shown).
- the fixing seat 2 further includes two reinforcement portions 21 respectively extending outwardly from two lateral ends of the base 20 .
- the reinforcement portion 21 located at right side of the base 20 of the fixing seat 2 encloses all of the curved sections 12 of the heat pipes 1 located at right side of the base 20 of the fixing seat 2 ; the reinforcement portion 21 located at left side of the base 20 of the fixing seat 2 encloses all of the curved sections 12 of the heat pipes 1 located at left side of the base 20 of the fixing seat 2 ; thereby enhancing a bonding strength between the fixing seat 2 and the heat pipes 1 .
- each of the evaporation sections 10 has two vertical lateral walls 102 , and the lateral walls 102 of adjacent evaporation sections 10 tightly joint with each other.
- the evaporation sections 10 of the heat pipes 1 can be gathered together to facilitate the evaporation sections 10 of the heat pipes 1 exchanging heat, whereby the heat pipes 1 can be evenly heated.
- the curved sections 12 of the heat pipes 1 are radially arranged relative to an assembly of the evaporation sections 10 of the heat pipes, that is, adjacent curved sections 12 are angled with each other, whereby the condensing sections 11 of the heat pipes 1 are spaced from each other.
- the condensing sections 11 of the heat pipes 1 are vertical to the evaporating sections 10 of the heat pipes 1 .
- the fixing seat 2 includes two enclosing portions 200 extending downwardly from the base 20 to respectively enclose the lateral walls 102 of the two outermost heat pipes 1 , thereby enhancing the bonding strength among the evaporating sections 10 of the heat pipes 1 .
- the enclosing portions 200 each include a bottom edge 201 not protrude downwardly relative to the heat absorbing surfaces 100 .
- the bottom edges 201 of the enclosing portions 200 are coplanar with the heat absorbing surfaces 100 .
- the heat sink includes a number of heat conducting fins 3 .
- the heat conducting fins 3 are parallel to and equidistantly spaced from each other.
- Two lateral portions of each of the heat conducting fins 3 defines a number of through holes 30 to allow the condensing sections 11 of the heat pipes 1 passing therethrough.
- An annular protruded flange 31 extends upwardly from an circumference edge defining each of the through holes 30 to enable adjacent heat conducting fins 3 spaces a certain distance.
- the heat conducting fins 3 define a number of airflow passages to increase heat dissipation efficiency.
- the condensing sections 11 of the heat pipes 1 respectively extend the through holes 30 of the heat conducting fins 3 to enable an assembly of the heat conducting fins 3 locating over the evaporation sections 10 of the heat pipes 1 .
- the heat pipes 1 and the fixing seat 2 cooperatively constitute the heat pipe assembly; the heat pipe assembly and the heat conducting fins 3 are construct the heat sink.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- The present invention relates to heat dissipation devices, and particularly to a heat pipe assembly including a number of heat pipes and a fixing structure which enables evaporating sections of the heat pipes being parallel to and adjoining with each other, and a heat dissipation device including such a heat pipe assembly.
- With the development of computer technologies, electronic elements run at high speed and therefore generate large amounts of heat. In order to keep the electronic elements operating at a normal temperature, the heat must be quickly and efficiently removed from the electronic elements by a heat dissipation device. Conventionally, the heat dissipation device includes a heat pipe which uses a gas-liquid phase transition technology to dissipate the heat generated by the electronic elements.
- However, in order to increase the heat dissipation efficiency of the heat dissipation device, a number of heat pipes are included in the heat dissipation device. Currently, the heat pipes are secured to a base seat or a heat conducting seat of the heat dissipation device by welding method. Also, evaporation sections of the heat pipes may be embedded in the grooves defined on the base seat or the heat conducting seat of the heat dissipation device and secured to the base seat or the heat conducting seat. However, the welding process is not easy to perform and the welded heat dissipation device has an unattractive appearance. When the evaporation sections of the heat pipes are embedded in the groves of the base seat or a heat conducting seat, the evaporation sections must be spaced from each other and can not be tightly adjoin with each other, whereby the evaporating sections can not be gathered to thermally contact with a surface of a heat generating electronic element. As a result, outermost two of the heat pipes can not be sufficiently used, thereby the heat dissipation device having low heat dissipation efficiency.
- Therefore, what is needed is a heat pipe assembly and a heat dissipation device including such a heat pipe assembly, thereby overcoming the above-described problems.
- The present invention provides a heat pipe assembly and a heat dissipation device including the heat pipe assembly. The heat pipe assembly includes a number of evaporation sections and a molded fixing seat. By the fixing structure, the evaporating sections of the heat pipe assembly are parallel to and adjoin with each other, whereby heat absorb surfaces of the evaporating sections are coplanar and adjoin with each other to thereby form a large-area heat absorbing surface to thermally contact with a heat generating electronic element.
- The heat pipe assembly includes a number of heat pipes and a fixing seat engaging with evaporating sections of the heat pipes. Each of the heat pipes includes an evaporating section and at least a condensing section. A bottom of the evaporation section of each of the heat pipes is flat and has a flat heat absorbing surface. The evaporating sections of the heat pipes are parallel to and adjoin with each other, whereby the heat absorbing surfaces thereof are coplanar and adjoin with each other. A top surface of the evaporating section of each of the heat pipes has a top edge. The fixing seat has an integral structure and combines with the top edges of the evaporating sections of the heat pipes, thereby facilitating the heat absorbing surfaces of the evaporating sections of the heat pipes being coplanar and adjoining with each other.
- A heat dissipation device including above-described heat pipe assembly is provided. The heat dissipation device further comprises a number of heat conducting fins disposed on the condensing sections of the heat pipes.
- These and other features and advantages of the various embodiments disclosed herein will be better understood with respect to the following description and drawings, in which like numbers refer to like parts throughout, and in which:
-
FIG. 1 is a schematic, isometric view of a heat pipe assembly, according to a first embodiment of the present disclosure. -
FIG. 2 is a schematic, isometric view of the heat pipe assembly from a visual angle different fromFIG. 1 . -
FIG. 3 is a partially, cross-sectional view ofFIG. 1 . -
FIG. 4 is a partially, cross-sectional view ofFIG. 2 . -
FIG. 5 is a partially, cross-sectional view of a heat pipe assembly, according to a second embodiment of the present disclosure. -
FIG. 6 is a partially, exploded view of a heat dissipation device of the present disclosure. -
FIGS. 1 and 2 are schematic, isometric views of a heat pipe assembly of the present invention in different visual angles. The heat pipe assembly includes a number ofheat pipes 1 and afixing seat 2. - Each of the
heat pipes 1 is heat conducting element and includes a vacuous tubular body, a capillary structure disposed inside the tubular body and a working fluid contained in the tubular body and soaking the capillary structure. The tubular body of each of theheat pipes 1 is an integral structure and has a certain length. Theheat pipes 1 each include anevaporating section 10 and at least acondensing section 11 connected with theevaporating section 10. In the present embodiment, each of theheat pipes 1 has a U-shaped configuration, a bottom portion of the U-shaped configuration is theevaporating section 10, and two lateral portions of the U-shaped configuration are twocondensing sections 11. Acurved section 12 is connected between theevaporation section 10 and eachcondensing section 11. Thus, theevaporation section 10, twocondensing sections 11 and twocurved sections 12 cooperatively form each of theheat pipes 1. In addition, a bottom of theevaporation section 10 of each of theheat pipes 1 is flat and has a flatheat absorbing surface 100. Evaporatingsections 10 of theheat pipes 1 are parallel to and adjoin with each other, whereby the heat absorbsurfaces 100 of the evaporatingsections 10 are coplanar and adjoin with each other to thereby form a large-area heat absorbing surface. - The
fixing seat 2 has an integral configuration and is made of plastic materials, such as, PC, PP, PE, PU or the like. Thefixing seat 2 is made by integral molding process, e.g., injection molding, gel-casting molding, perfusion molding, die casting, dipping and so on. The fixingseat 2 engages with the evaporatingsections 10 of theheat pipes 1. Referring toFIGS. 3 and 4 , thefixing seat 3 has abase 20, a top surface theevaporation section 10 of each of theheat pipes 1 has atop edge 101. Thebase 20 has a bottom surface combining with thetop edge 101 of the top surface of theevaporation section 10 of each of theheat pipes 1, whereby theevaporation sections 10 of theheat pipes 1 can be secured to enable theheat absorbing surfaces 100 of theevaporation sections 10 of theheat pipes 1 being parallel to and adjoining with each other. As a result, theheat absorbing surfaces 100 are coplanar and adjoin with each other to form a large-area surface, thereby facilitating thermally contacting with heat-generating sources (not shown). In addition, in order to increase a contact area between thefixing seat 2 and theheat pipes 1, thefixing seat 2 further includes tworeinforcement portions 21 respectively extending outwardly from two lateral ends of thebase 20. Thereinforcement portion 21 located at right side of thebase 20 of thefixing seat 2 encloses all of thecurved sections 12 of theheat pipes 1 located at right side of thebase 20 of thefixing seat 2; thereinforcement portion 21 located at left side of thebase 20 of thefixing seat 2 encloses all of thecurved sections 12 of theheat pipes 1 located at left side of thebase 20 of thefixing seat 2; thereby enhancing a bonding strength between thefixing seat 2 and theheat pipes 1. - In order to ensure the
evaporation sections 10 of theheat pipes 1 being parallel to and adjoining with each other, a cross section of each of theevaporation sections 10 is square or rectangular, as shown inFIG. 4 . Thus, each of theevaporation sections 10 has two verticallateral walls 102, and thelateral walls 102 ofadjacent evaporation sections 10 tightly joint with each other. As a result, theevaporation sections 10 of theheat pipes 1 can be gathered together to facilitate theevaporation sections 10 of theheat pipes 1 exchanging heat, whereby theheat pipes 1 can be evenly heated. Furthermore, as shown inFIG. 4 , thecurved sections 12 of theheat pipes 1 are radially arranged relative to an assembly of theevaporation sections 10 of the heat pipes, that is, adjacentcurved sections 12 are angled with each other, whereby thecondensing sections 11 of theheat pipes 1 are spaced from each other. In the illustrated embodiment, thecondensing sections 11 of theheat pipes 1 are vertical to the evaporatingsections 10 of theheat pipes 1. - Referring to
FIG. 5 , thefixing seat 2 includes two enclosingportions 200 extending downwardly from thebase 20 to respectively enclose thelateral walls 102 of the twooutermost heat pipes 1, thereby enhancing the bonding strength among the evaporatingsections 10 of theheat pipes 1. The enclosingportions 200 each include abottom edge 201 not protrude downwardly relative to theheat absorbing surfaces 100. In the present embodiment, thebottom edges 201 of the enclosingportions 200 are coplanar with theheat absorbing surfaces 100. - Referring to
FIG. 6 , a heat sink having the above-described heat pipe assembly ofFIG. 1 is illustrated. The heat sink includes a number ofheat conducting fins 3. Theheat conducting fins 3 are parallel to and equidistantly spaced from each other. Two lateral portions of each of theheat conducting fins 3 defines a number of throughholes 30 to allow thecondensing sections 11 of theheat pipes 1 passing therethrough. An annularprotruded flange 31 extends upwardly from an circumference edge defining each of the throughholes 30 to enable adjacentheat conducting fins 3 spaces a certain distance. Thus, theheat conducting fins 3 define a number of airflow passages to increase heat dissipation efficiency. In assembly, the condensingsections 11 of theheat pipes 1 respectively extend the throughholes 30 of theheat conducting fins 3 to enable an assembly of theheat conducting fins 3 locating over theevaporation sections 10 of theheat pipes 1. - Therefore, the
heat pipes 1 and the fixingseat 2 cooperatively constitute the heat pipe assembly; the heat pipe assembly and theheat conducting fins 3 are construct the heat sink. - The above description is given by way of example, and not limitation. Given the above disclosure, one skilled in the art could devise variations that are within the scope and spirit of the invention disclosed herein, including configurations ways of the recessed portions and materials and/or designs of the attaching structures. Further, the various features of the embodiments disclosed herein can be used alone, or in varying combinations with each other and are not intended to be limited to the specific combination described herein. Thus, the scope of the claims is not to be limited by the illustrated embodiments.
Claims (20)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/554,865 US20110056658A1 (en) | 2009-09-04 | 2009-09-04 | Heat pipe assembly and heat dissipation device having the same |
US14/056,802 US20140041838A1 (en) | 2009-09-04 | 2013-10-17 | Heat pipe assembly and heat dissipation device having the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/554,865 US20110056658A1 (en) | 2009-09-04 | 2009-09-04 | Heat pipe assembly and heat dissipation device having the same |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/056,802 Continuation-In-Part US20140041838A1 (en) | 2009-09-04 | 2013-10-17 | Heat pipe assembly and heat dissipation device having the same |
Publications (1)
Publication Number | Publication Date |
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US20110056658A1 true US20110056658A1 (en) | 2011-03-10 |
Family
ID=43646770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US12/554,865 Abandoned US20110056658A1 (en) | 2009-09-04 | 2009-09-04 | Heat pipe assembly and heat dissipation device having the same |
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US (1) | US20110056658A1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2298490A1 (en) * | 2009-09-18 | 2011-03-23 | Cpumate Inc. | Heat conducting structure with coplanar heated portion, manufacturing method thereof, and heat sink therewith |
US8291590B2 (en) * | 2009-01-20 | 2012-10-23 | Cpumate Inc. | Method for assembling fins-type heat sink |
US20130032313A1 (en) * | 2011-08-05 | 2013-02-07 | Chun-Ming Wu | Heat-dissipation unit and method of manufacturing same |
US20130098584A1 (en) * | 2009-09-18 | 2013-04-25 | Golden Sun News Techniques Co., Ltd. | Heat conducting structure with coplanar heated portion, manufacturing method thereof, and heat sink therewith |
WO2017020390A1 (en) * | 2015-03-30 | 2017-02-09 | 特能传热科技(中山)有限公司 | Heat dissipation device |
US20230100966A1 (en) * | 2019-12-03 | 2023-03-30 | Hewlett-Packard Development Company, L.P. | Processor cooling with phase change material filled shell |
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US20070144710A1 (en) * | 2005-12-22 | 2007-06-28 | Golden Sun News Techniques Co., Ltd. | Method for manufacturing heat pipe cooling device |
US20070151711A1 (en) * | 2006-01-05 | 2007-07-05 | Kuo-Hsin Chen | Heat sink and method for manufacturing the same |
US20070267181A1 (en) * | 2006-05-16 | 2007-11-22 | Kuo-Len Lin | Juxtaposing Structure For Heated Ends Of Heat Pipes |
US20080121372A1 (en) * | 2006-11-24 | 2008-05-29 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US7443676B1 (en) * | 2007-08-09 | 2008-10-28 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20090266522A1 (en) * | 2008-04-28 | 2009-10-29 | Kuo-Len Lin | Method of flatting evaporating section of heat pipe embedded in heat dissipation device and heat dissipation device with heat pipe |
US20100236754A1 (en) * | 2009-03-17 | 2010-09-23 | Tai-Sol Electronics Co., Ltd. | Airflow guider for use in heat sink |
US20110048677A1 (en) * | 2009-08-31 | 2011-03-03 | Kuo-Len Lin | Heat-conducting assembly for heat pipes of different diameters and heat sink having the same |
-
2009
- 2009-09-04 US US12/554,865 patent/US20110056658A1/en not_active Abandoned
Patent Citations (8)
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US20070144710A1 (en) * | 2005-12-22 | 2007-06-28 | Golden Sun News Techniques Co., Ltd. | Method for manufacturing heat pipe cooling device |
US20070151711A1 (en) * | 2006-01-05 | 2007-07-05 | Kuo-Hsin Chen | Heat sink and method for manufacturing the same |
US20070267181A1 (en) * | 2006-05-16 | 2007-11-22 | Kuo-Len Lin | Juxtaposing Structure For Heated Ends Of Heat Pipes |
US20080121372A1 (en) * | 2006-11-24 | 2008-05-29 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US7443676B1 (en) * | 2007-08-09 | 2008-10-28 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20090266522A1 (en) * | 2008-04-28 | 2009-10-29 | Kuo-Len Lin | Method of flatting evaporating section of heat pipe embedded in heat dissipation device and heat dissipation device with heat pipe |
US20100236754A1 (en) * | 2009-03-17 | 2010-09-23 | Tai-Sol Electronics Co., Ltd. | Airflow guider for use in heat sink |
US20110048677A1 (en) * | 2009-08-31 | 2011-03-03 | Kuo-Len Lin | Heat-conducting assembly for heat pipes of different diameters and heat sink having the same |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8291590B2 (en) * | 2009-01-20 | 2012-10-23 | Cpumate Inc. | Method for assembling fins-type heat sink |
EP2298490A1 (en) * | 2009-09-18 | 2011-03-23 | Cpumate Inc. | Heat conducting structure with coplanar heated portion, manufacturing method thereof, and heat sink therewith |
US20130098584A1 (en) * | 2009-09-18 | 2013-04-25 | Golden Sun News Techniques Co., Ltd. | Heat conducting structure with coplanar heated portion, manufacturing method thereof, and heat sink therewith |
US8978742B2 (en) * | 2009-09-18 | 2015-03-17 | Cpumate Inc. | Heat conducting structure with coplanar heated portion, manufacturing method thereof, and heat sink therewith |
US20130032313A1 (en) * | 2011-08-05 | 2013-02-07 | Chun-Ming Wu | Heat-dissipation unit and method of manufacturing same |
US20140165400A1 (en) * | 2011-08-05 | 2014-06-19 | Asia Vital Components Co., Ltd. | Heat-dissipation unit and method of manufacturing same |
WO2017020390A1 (en) * | 2015-03-30 | 2017-02-09 | 特能传热科技(中山)有限公司 | Heat dissipation device |
US20230100966A1 (en) * | 2019-12-03 | 2023-03-30 | Hewlett-Packard Development Company, L.P. | Processor cooling with phase change material filled shell |
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