US20100101763A1 - Thin heat dissipating apparatus - Google Patents

Thin heat dissipating apparatus Download PDF

Info

Publication number
US20100101763A1
US20100101763A1 US12/258,629 US25862908A US2010101763A1 US 20100101763 A1 US20100101763 A1 US 20100101763A1 US 25862908 A US25862908 A US 25862908A US 2010101763 A1 US2010101763 A1 US 2010101763A1
Authority
US
United States
Prior art keywords
heat
heat dissipating
pipe
disposed
condensation section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/258,629
Inventor
Meng-Cheng Huang
Shih-Yuan Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Chaun Choung Technology Corp
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US12/258,629 priority Critical patent/US20100101763A1/en
Assigned to CHAUN-CHOUNG TECHNOLOGY CORP. reassignment CHAUN-CHOUNG TECHNOLOGY CORP. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUANG, MENG-CHENG, LIN, SHIH-YUAN
Publication of US20100101763A1 publication Critical patent/US20100101763A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention generally relates to a heat dissipating apparatus, and more particularly to a thin heat dissipating apparatus adopting a thermal exchange technology.
  • An application of a heat pipe used as a heat dissipating apparatus of a computer, particularly for a notebook computer with limited internal space has become a common technical measure for dissipating heat, and the heat pipe generally comes with no movable element.
  • a pipe body at a still state can be used for conducting heat.
  • the pipe body is bendable, so that the heat pipe occupies a relatively smaller space.
  • FIG. 1 a heat dissipating apparatus la applied in a notebook computer is shown.
  • the heat dissipating apparatus 1 a comprises two heat pipes 10 a, and a heat dissipating element 11 a is formed by stacking a plurality of fins and disposed at a condensing end of the two heat pipes 10 a, and a heat conducting base 12 a is disposed at an evaporation end of the two heat pipes 10 a.
  • the two heat conducting bases 12 a respectively correspond to electronic components with a heat generating source, such as a Southbridge and a Northbridge, and the heat produced by the two electronic components with a heat generating source is conducted to the heat dissipating element 11 a through the two heat pipes 10 a, and dissipated by the heat dissipating element 11 a.
  • a heat generating source such as a Southbridge and a Northbridge
  • the heat dissipating element 11 a Since the two heat pipes 10 a must be combined with the heat dissipating element 11 a for the thermal conduction, the heat dissipating element 11 a must provide two contact portions for combining the two heat pipes 10 a with the heat dissipating element 11 a.
  • the heat dissipating apparatus of this sort is generally applied in a notebook computer with a limited internal space, such that if the heat dissipating element 11 a occupies a relatively larger space, then such heat dissipating apparatus no longer fits the intended application. Furthermore, the installation of a fan may be affected due to the space limitation.
  • both ends of the heat pipe are evaporation ends, and a heat dissipating element is disposed at an appropriate position of the middle section of the heat pipe to serve as a condensation section, and the heat dissipating element is connected to the single heat pipe to reduce the occupied space.
  • the present invention provides a thin heat dissipating apparatus comprising a heat pipe, a heat dissipating element, and two heat conducting bases, wherein the pipe body of the heat pipe is formed integrally and includes two evaporation ends disposed on both ends of the pipe body respectively and a condensation section disposed on a portion of the pipe body for installing the heat dissipating element on the condensation section, and the two heat conducting bases are disposed on the two evaporation ends respectively to constitute the thin heat dissipating apparatus.
  • Another objective of the present invention is to provide a thin heat dissipating apparatus comprising a single heat pipe connected to two heat conducting bases.
  • both ends of the heat pipe serve as evaporation ends, and an appropriate position of a middle section of the heat pipe is selected and provided for installing a heat dissipating element and serving as a condensation section, so that the heat dissipating element can be connected to the single heat pipe to reduce the occupied volume or space.
  • the present invention provides a thin heat dissipating apparatus comprising a heat pipe, a heat dissipating element, and two heat conducting bases, wherein the pipe body of the heat pipe is formed integrally and includes two evaporation ends disposed at the distal ends of the pipe body respectively and a condensation section disposed at a portion of the pipe body for installing the heat dissipating element on the condensation section, and the two heat conducting bases are disposed on the two evaporation ends respectively to constitute the foregoing thin heat dissipating apparatus.
  • FIG. 1 is a perspective view of a conventional heat dissipating apparatus
  • FIG. 2 is an exploded view of a first preferred embodiment of the present invention
  • FIG. 3 is a perspective view of a first preferred embodiment of the present invention.
  • FIG. 4 is a schematic view of a partial application status in accordance with a first preferred embodiment of the present invention.
  • FIG. 5 is a cross-sectional view Section 5 - 5 as depicted in FIG. 4 ;
  • FIG. 6 is a cross-sectional view of a second preferred embodiment of the present invention.
  • FIG. 7 is a cross-sectional view of a third preferred embodiment of the present invention.
  • the present invention provides a thin heat dissipating apparatus 1 comprising a heat pipe 10 , a heat dissipating element 11 , and two heat conducting bases 12 .
  • the heat pipe 10 is a pipe body with vacuum inside, and having a thermal conducting element of a capillary tissue and a working fluid, and the pipe body of the heat pipe 10 is integrally formed and comes with a specific appropriate length and includes an evaporation end 100 disposed on both ends of the heat pipe 10 separately and a condensation section 101 disposed at a specific portion of the pipe body.
  • the heat pipe 10 is in a flat shape and disposed at the position of the pipe body of the two evaporation ends 100 and a condensation section 101 to provide a larger area of a thermal conduction contact for the heat dissipating element 11 and the heat conducting base 12 .
  • all pipe bodies of the heat pipe 10 are in a flat shape.
  • the pipe bodies of the heat pipe 10 can be maintained in the original circular tubular shape.
  • the heat dissipating element 11 is connected to the condensation section 101 of the heat pipe 10 for conducting heat and cooling down the temperature of the condensation section 101 .
  • the heat dissipating element 11 is a stacked heat dissipating apparatus formed by arranging a plurality of fins 110 transversally, and each fin 110 has an indent 111 disposed concavely and inwardly on a lateral side of the fin 110 , and the indent 111 comes with a shape corresponding to the shape of the flat surface of the pipe body of the heat pipe 10 , such that after the fins 110 are stacked, an indentation portion 112 is formed at the indent 111 and provided for a thermal conducting contact to the surface of the condensation section 101 of the heat pipe 10 and disposed at an upper half of the surface of the condensation section 101 .
  • the two heat conducting bases 12 are connected to the two evaporation ends 100 respectively for the thermal conduction, and the pipe body of the heat pipe 10 is extended and bent, such that the two heat conducting bases 12 correspond to a heat generating source 3 of an electronic component for the dissipating heat (as shown in FIG. 4 ) and conducting the heat produced by the two heat generating source 3 of the electronic components through the heat pipe 10 concurrently for providing a cooling effect by the heat dissipating element 2 .
  • each of the two heat conducting bases 12 includes a groove 120 concavely embedded into the evaporation end 100 of the heat pipe 10 , such that the evaporation end 100 is combined with the heat conducting base 12 to increase the contact area of the evaporation end 100 and the conducting base 12 and facilitate the thermal conduction.
  • FIGS. 4 and 5 if the heat dissipating apparatus 1 is applied to a notebook computer 2 with limited height and space, and the heat dissipating apparatus 1 adopts a heat pipe 10 to provide the required thermal conduction of the two heat conducting bases 12 , then the heat dissipating element 11 only needs a condensation section 101 of the heat pipe 10 for the thermal conducting contact without increasing the volume or space of the heat dissipating element 11 due to the requirement of aligning the two heat conducting bases 12 with the two heat pipes respectively to prevent its affection to the applications or occupying too much internal space of the notebook computer 2 .
  • the heat dissipating element 11 is installed at a position corresponding to a ventilation opening 20 of the notebook computer 2 , and a centrifugal heat dissipating fan 13 is installed for driving hot currents away from the heat dissipating element 11 , so that the heat dissipating element 13 of the heat pipe 10 can conduct the heat from the evaporation end 100 to the condensation section 101 and force the heat to be discharged from the ventilation opening 20 to the outside through the heat dissipating fan 13 .
  • the structure for connecting the heat pipe 10 and the heat dissipating element 11 can be simplified.
  • another heat dissipating element 11 is installed at the condensation section 101 of the heat pipe 10 and disposed at a lower half of the surface of the condensation section 101 , so that the two heat dissipating elements 11 can be used for clamping the condensation section 101 of the heat pipe 10 vertically up and down through the indent section 112 .
  • the heat dissipating element 11 can be installed directly at each fin 110 and passed through a through hole 113 of each fin 110 and the condensation section 101 of the heat pipe 10 .
  • a heat pipe 10 is connected to the two heat conducting bases 12 in series, such that the heat dissipating element 12 simply requires a connection of the single heat pipe 10 to reduce the volume or space occupied by the heat dissipating element 12 .
  • the invention is a novel product capable of achieving the expected objectives and overcoming the shortcomings of the present invention, and also complies with patent application requirements, and is duly filed for patent application.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipating apparatus includes a heat pipe, a heat dissipating element, and two heat conducting bases. The pipe body of the heat pipe is formed integrally and has two evaporation ends disposed on both distal ends of the pipe body respectively and a condensation section disposed at a portion of the pipe body for installing the heat dissipating element on the condensation section, and the two heat conducting bases are disposed on the two evaporation ends respectively, such that the invention simply requires connecting the heat dissipating element with the single heat pipe to achieve the effect of reducing the volume or space occupied by the heat dissipating element.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention generally relates to a heat dissipating apparatus, and more particularly to a thin heat dissipating apparatus adopting a thermal exchange technology.
  • 2. Description of Prior Art
  • An application of a heat pipe used as a heat dissipating apparatus of a computer, particularly for a notebook computer with limited internal space has become a common technical measure for dissipating heat, and the heat pipe generally comes with no movable element. A pipe body at a still state can be used for conducting heat. In addition, the pipe body is bendable, so that the heat pipe occupies a relatively smaller space.
  • In FIG. 1, a heat dissipating apparatus la applied in a notebook computer is shown. The heat dissipating apparatus 1 a comprises two heat pipes 10 a, and a heat dissipating element 11 a is formed by stacking a plurality of fins and disposed at a condensing end of the two heat pipes 10 a, and a heat conducting base 12 a is disposed at an evaporation end of the two heat pipes 10 a. With the foregoing structure, the two heat conducting bases 12 a respectively correspond to electronic components with a heat generating source, such as a Southbridge and a Northbridge, and the heat produced by the two electronic components with a heat generating source is conducted to the heat dissipating element 11 a through the two heat pipes 10a, and dissipated by the heat dissipating element 11 a.
  • Since the two heat pipes 10 a must be combined with the heat dissipating element 11 a for the thermal conduction, the heat dissipating element 11 a must provide two contact portions for combining the two heat pipes 10 a with the heat dissipating element 11 a. The heat dissipating apparatus of this sort is generally applied in a notebook computer with a limited internal space, such that if the heat dissipating element 11 a occupies a relatively larger space, then such heat dissipating apparatus no longer fits the intended application. Furthermore, the installation of a fan may be affected due to the space limitation.
  • In view of the foregoing shortcomings of the prior art, the inventor of the present invention based on years of experience in the related field to conduct extensive researches and experiments, and finally developed a feasible design to overcome the shortcomings of the prior art.
    • SUMMARY OF THE INVENTION
  • It is a primary objective of the present invention to provide a thin heat dissipating apparatus having a single heat pipe for connecting two heat conducting bases in series. In other words, both ends of the heat pipe are evaporation ends, and a heat dissipating element is disposed at an appropriate position of the middle section of the heat pipe to serve as a condensation section, and the heat dissipating element is connected to the single heat pipe to reduce the occupied space.
  • To achieve the foregoing objective, the present invention provides a thin heat dissipating apparatus comprising a heat pipe, a heat dissipating element, and two heat conducting bases, wherein the pipe body of the heat pipe is formed integrally and includes two evaporation ends disposed on both ends of the pipe body respectively and a condensation section disposed on a portion of the pipe body for installing the heat dissipating element on the condensation section, and the two heat conducting bases are disposed on the two evaporation ends respectively to constitute the thin heat dissipating apparatus.
  • Another objective of the present invention is to provide a thin heat dissipating apparatus comprising a single heat pipe connected to two heat conducting bases. In other words, both ends of the heat pipe serve as evaporation ends, and an appropriate position of a middle section of the heat pipe is selected and provided for installing a heat dissipating element and serving as a condensation section, so that the heat dissipating element can be connected to the single heat pipe to reduce the occupied volume or space.
  • To achieve the foregoing objective, the present invention provides a thin heat dissipating apparatus comprising a heat pipe, a heat dissipating element, and two heat conducting bases, wherein the pipe body of the heat pipe is formed integrally and includes two evaporation ends disposed at the distal ends of the pipe body respectively and a condensation section disposed at a portion of the pipe body for installing the heat dissipating element on the condensation section, and the two heat conducting bases are disposed on the two evaporation ends respectively to constitute the foregoing thin heat dissipating apparatus.
    • BRIEF DESCRIPTION OF DRAWINGS
  • FIG. 1 is a perspective view of a conventional heat dissipating apparatus;
  • FIG. 2 is an exploded view of a first preferred embodiment of the present invention;
  • FIG. 3 is a perspective view of a first preferred embodiment of the present invention;
  • FIG. 4 is a schematic view of a partial application status in accordance with a first preferred embodiment of the present invention;
  • FIG. 5 is a cross-sectional view Section 5-5 as depicted in FIG. 4;
  • FIG. 6 is a cross-sectional view of a second preferred embodiment of the present invention; and
  • FIG. 7 is a cross-sectional view of a third preferred embodiment of the present invention.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • The technical characteristics, features and advantages of the present invention will become apparent in the following detailed description of preferred embodiments with reference to the accompanying drawings, and the preferred embodiments are used for illustrating the present invention only, but not intended to limit the scope of the invention.
  • With reference to FIGS. 2 and 3 for an exploded view and a perspective view of a first preferred embodiment of the present invention respectively, the present invention provides a thin heat dissipating apparatus 1 comprising a heat pipe 10, a heat dissipating element 11, and two heat conducting bases 12.
  • The heat pipe 10 is a pipe body with vacuum inside, and having a thermal conducting element of a capillary tissue and a working fluid, and the pipe body of the heat pipe 10 is integrally formed and comes with a specific appropriate length and includes an evaporation end 100 disposed on both ends of the heat pipe 10 separately and a condensation section 101 disposed at a specific portion of the pipe body. In addition, the heat pipe 10 is in a flat shape and disposed at the position of the pipe body of the two evaporation ends 100 and a condensation section 101 to provide a larger area of a thermal conduction contact for the heat dissipating element 11 and the heat conducting base 12. In each preferred embodiment of the present invention, all pipe bodies of the heat pipe 10 are in a flat shape. Of course, the pipe bodies of the heat pipe 10 can be maintained in the original circular tubular shape.
  • The heat dissipating element 11 is connected to the condensation section 101 of the heat pipe 10 for conducting heat and cooling down the temperature of the condensation section 101. In each preferred embodiment of the present invention, the heat dissipating element 11 is a stacked heat dissipating apparatus formed by arranging a plurality of fins 110 transversally, and each fin 110 has an indent 111 disposed concavely and inwardly on a lateral side of the fin 110, and the indent 111 comes with a shape corresponding to the shape of the flat surface of the pipe body of the heat pipe 10, such that after the fins 110 are stacked, an indentation portion 112 is formed at the indent 111 and provided for a thermal conducting contact to the surface of the condensation section 101 of the heat pipe 10 and disposed at an upper half of the surface of the condensation section 101.
  • The two heat conducting bases 12 are connected to the two evaporation ends 100 respectively for the thermal conduction, and the pipe body of the heat pipe 10 is extended and bent, such that the two heat conducting bases 12 correspond to a heat generating source 3 of an electronic component for the dissipating heat (as shown in FIG. 4) and conducting the heat produced by the two heat generating source 3 of the electronic components through the heat pipe 10 concurrently for providing a cooling effect by the heat dissipating element 2. In each preferred embodiment of the present invention, each of the two heat conducting bases 12 includes a groove 120 concavely embedded into the evaporation end 100 of the heat pipe 10, such that the evaporation end 100 is combined with the heat conducting base 12 to increase the contact area of the evaporation end 100 and the conducting base 12 and facilitate the thermal conduction.
  • With the foregoing structure, a thin heat dissipating apparatus of the invention is formed.
  • In FIGS. 4 and 5, if the heat dissipating apparatus 1 is applied to a notebook computer 2 with limited height and space, and the heat dissipating apparatus 1 adopts a heat pipe 10 to provide the required thermal conduction of the two heat conducting bases 12, then the heat dissipating element 11 only needs a condensation section 101 of the heat pipe 10 for the thermal conducting contact without increasing the volume or space of the heat dissipating element 11 due to the requirement of aligning the two heat conducting bases 12 with the two heat pipes respectively to prevent its affection to the applications or occupying too much internal space of the notebook computer 2. The heat dissipating element 11 is installed at a position corresponding to a ventilation opening 20 of the notebook computer 2, and a centrifugal heat dissipating fan 13 is installed for driving hot currents away from the heat dissipating element 11, so that the heat dissipating element 13 of the heat pipe 10 can conduct the heat from the evaporation end 100 to the condensation section 101 and force the heat to be discharged from the ventilation opening 20 to the outside through the heat dissipating fan 13.
  • Since the heat dissipating element 11 requires the condensation section 101 of the heat pipe 10 for the thermal conducting contact, therefore the structure for connecting the heat pipe 10 and the heat dissipating element 11 can be simplified. In FIG. 6, another heat dissipating element 11 is installed at the condensation section 101 of the heat pipe 10 and disposed at a lower half of the surface of the condensation section 101, so that the two heat dissipating elements 11 can be used for clamping the condensation section 101 of the heat pipe 10 vertically up and down through the indent section 112. In FIG. 7, the heat dissipating element 11 can be installed directly at each fin 110 and passed through a through hole 113 of each fin 110 and the condensation section 101 of the heat pipe 10.
  • With the thin heat dissipating apparatus of the invention, a heat pipe 10 is connected to the two heat conducting bases 12 in series, such that the heat dissipating element 12 simply requires a connection of the single heat pipe 10 to reduce the volume or space occupied by the heat dissipating element 12.
  • In summation of the description above, the invention is a novel product capable of achieving the expected objectives and overcoming the shortcomings of the present invention, and also complies with patent application requirements, and is duly filed for patent application.
  • While the invention has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of the invention set forth in the claims.

Claims (12)

1. A thin heat dissipating apparatus, comprising;
a heat pipe, being integrally formed with a pipe body, and having two evaporation ends disposed at distal ends of the heat pipe respectively and a condensation section disposed at a portion of the pipe body;
a heat dissipating element, installed at the condensation section of the heat pipe; and
two heat conducting bases, disposed on the two evaporation ends of the heat pipe respectively.
2. The thin heat dissipating apparatus of claim 1, wherein the pipe body of the heat pipe disposed at the two evaporation ends and at the condensation section is in a flat shape.
3. The thin heat dissipating apparatus of claim 2, wherein the pipe body of the heat pipe is in a flat shape at the remaining portion.
4. The thin heat dissipating apparatus of claim 1, wherein the pipe body of the heat pipe is in a circular tubular shape.
5. The thin heat dissipating apparatus of claim 1, wherein the heat dissipating element is a stacked heat dissipating device formed by arranging a plurality of fins transversally.
6. The thin heat dissipating apparatus of claim 5, wherein each fin includes a through hole for passing through the condensation section of the heat pipe to install the heat dissipating element on the condensation section.
7. The thin heat dissipating apparatus of claim 5, wherein each fin includes an indent concavely disposed on a lateral edge of the fin, and having a shape matched precisely with the shape of the surface of the pipe body of the heat pipe, and the indents are used for forming an indent portion, and the indent portion is in contact with a surface of the condensation section of the heat pipe.
8. The thin heat dissipating apparatus of claim 7, wherein the heat dissipating element is disposed on the first half of the surface of the condensation section.
9. The thin heat dissipating apparatus of claim 8, further comprising another heat dissipating element disposed at a lower half of a surface of the condensation section.
10. The thin heat dissipating apparatus of claim 1, wherein the two heat conducting bases have a groove disposed thereon for embedding the evaporation end of the heat pipe, such that the two heat conducting bases are disposed on the two evaporation ends respectively.
11. The thin heat dissipating apparatus of claim 1, further comprising a heat dissipating fan for providing a heat driving effect for the heat dissipating element.
12. The thin heat dissipating apparatus of claim 11, wherein the heat dissipating fan is a centrifugal fan.
US12/258,629 2008-10-27 2008-10-27 Thin heat dissipating apparatus Abandoned US20100101763A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/258,629 US20100101763A1 (en) 2008-10-27 2008-10-27 Thin heat dissipating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/258,629 US20100101763A1 (en) 2008-10-27 2008-10-27 Thin heat dissipating apparatus

Publications (1)

Publication Number Publication Date
US20100101763A1 true US20100101763A1 (en) 2010-04-29

Family

ID=42116361

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/258,629 Abandoned US20100101763A1 (en) 2008-10-27 2008-10-27 Thin heat dissipating apparatus

Country Status (1)

Country Link
US (1) US20100101763A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140133102A1 (en) * 2012-11-13 2014-05-15 Hon Hai Precision Industry Co., Ltd. Heat dissipating assembly and electronic device assembly with heat dissipating assembly
JP2015088882A (en) * 2013-10-30 2015-05-07 東芝ホームテクノ株式会社 Portable information terminal
US20150346784A1 (en) * 2014-06-02 2015-12-03 Microsoft Corporation Integrated vapor chamber for thermal management of computing devices
WO2018094877A1 (en) * 2016-11-25 2018-05-31 华为技术有限公司 Heat dissipation panel, heat dissipation device and electronic apparatus
CN108770295A (en) * 2018-06-11 2018-11-06 Oppo广东移动通信有限公司 A kind of electronic equipment and radiating subassembly
US10691445B2 (en) 2014-06-03 2020-06-23 Microsoft Technology Licensing, Llc Isolating a portion of an online computing service for testing
US20220146206A1 (en) * 2019-04-29 2022-05-12 Sunon Electronics (Kunshan) Co., Ltd. Cooling module

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3965334A (en) * 1972-05-04 1976-06-22 N.V. Philips Corporation Heating device
US4067237A (en) * 1976-08-10 1978-01-10 Westinghouse Electric Corporation Novel heat pipe combination
US4254821A (en) * 1979-08-10 1981-03-10 Thermo Electron Corporation Heat pipe deicing apparatus
US5522455A (en) * 1994-05-05 1996-06-04 Northrop Grumman Corporation Heat pipe manifold with screen-lined insert
US6269865B1 (en) * 1997-08-22 2001-08-07 Bin-Juine Huang Network-type heat pipe device
US20020117295A1 (en) * 2001-02-26 2002-08-29 Ching-Hang Shen Heat dissipating structure
US20040112570A1 (en) * 2002-02-21 2004-06-17 Wenger Todd Michael Fin with elongated hole and heat pipe with elongated cross section
US20060098414A1 (en) * 2004-11-10 2006-05-11 Meng-Cheng Huang Heat sink
US20060181849A1 (en) * 2005-02-14 2006-08-17 Inventec Corporation Heatsink thermal module with noise improvement
US7116552B2 (en) * 2005-01-31 2006-10-03 Chaun-Choung Technology Corp. Heat-dissipation apparatus of portable computer
US7117930B2 (en) * 2002-06-14 2006-10-10 Thermal Corp. Heat pipe fin stack with extruded base
US20080164010A1 (en) * 2007-01-09 2008-07-10 Shung-Wen Kang Loop heat pipe with flat evaportor
US7540318B2 (en) * 2006-05-25 2009-06-02 Fujitsu Limited Heat sink
US20090279262A1 (en) * 2008-05-12 2009-11-12 Meng-Cheng Huang Heat dissipating structure

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3965334A (en) * 1972-05-04 1976-06-22 N.V. Philips Corporation Heating device
US4067237A (en) * 1976-08-10 1978-01-10 Westinghouse Electric Corporation Novel heat pipe combination
US4254821A (en) * 1979-08-10 1981-03-10 Thermo Electron Corporation Heat pipe deicing apparatus
US5522455A (en) * 1994-05-05 1996-06-04 Northrop Grumman Corporation Heat pipe manifold with screen-lined insert
US6269865B1 (en) * 1997-08-22 2001-08-07 Bin-Juine Huang Network-type heat pipe device
US20020117295A1 (en) * 2001-02-26 2002-08-29 Ching-Hang Shen Heat dissipating structure
US20040112570A1 (en) * 2002-02-21 2004-06-17 Wenger Todd Michael Fin with elongated hole and heat pipe with elongated cross section
US7117930B2 (en) * 2002-06-14 2006-10-10 Thermal Corp. Heat pipe fin stack with extruded base
US20060098414A1 (en) * 2004-11-10 2006-05-11 Meng-Cheng Huang Heat sink
US7116552B2 (en) * 2005-01-31 2006-10-03 Chaun-Choung Technology Corp. Heat-dissipation apparatus of portable computer
US20060181849A1 (en) * 2005-02-14 2006-08-17 Inventec Corporation Heatsink thermal module with noise improvement
US7540318B2 (en) * 2006-05-25 2009-06-02 Fujitsu Limited Heat sink
US20080164010A1 (en) * 2007-01-09 2008-07-10 Shung-Wen Kang Loop heat pipe with flat evaportor
US20090279262A1 (en) * 2008-05-12 2009-11-12 Meng-Cheng Huang Heat dissipating structure

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140133102A1 (en) * 2012-11-13 2014-05-15 Hon Hai Precision Industry Co., Ltd. Heat dissipating assembly and electronic device assembly with heat dissipating assembly
JP2015088882A (en) * 2013-10-30 2015-05-07 東芝ホームテクノ株式会社 Portable information terminal
US9568965B2 (en) 2013-10-30 2017-02-14 Toshiba Home Technology Corporation Mobile terminal
US20150346784A1 (en) * 2014-06-02 2015-12-03 Microsoft Corporation Integrated vapor chamber for thermal management of computing devices
US10698458B2 (en) * 2014-06-02 2020-06-30 Microsoft Technology Licensing, Llc Integrated vapor chamber for thermal management of computing devices
US10691445B2 (en) 2014-06-03 2020-06-23 Microsoft Technology Licensing, Llc Isolating a portion of an online computing service for testing
WO2018094877A1 (en) * 2016-11-25 2018-05-31 华为技术有限公司 Heat dissipation panel, heat dissipation device and electronic apparatus
CN109076720A (en) * 2016-11-25 2018-12-21 华为技术有限公司 Heat sink, radiator and electronic equipment
US11272639B2 (en) 2016-11-25 2022-03-08 Huawei Technologies Co., Ltd. Heat dissipation panel, heat dissipation apparatus, and electronic device
CN108770295A (en) * 2018-06-11 2018-11-06 Oppo广东移动通信有限公司 A kind of electronic equipment and radiating subassembly
US20220146206A1 (en) * 2019-04-29 2022-05-12 Sunon Electronics (Kunshan) Co., Ltd. Cooling module

Similar Documents

Publication Publication Date Title
US20100101763A1 (en) Thin heat dissipating apparatus
KR200465559Y1 (en) Heat sink
US7600558B2 (en) Cooler
US7331379B2 (en) Heat dissipation device with heat pipe
US20090151900A1 (en) Heat sink
US7855889B2 (en) Resilient fastener and thermal module incorporating the same
WO2011087117A1 (en) Heat sink
US20070000646A1 (en) Heat dissipation device with heat pipe
US7394656B1 (en) Heat dissipation device
WO2011105364A1 (en) Heat sink
CN101839658A (en) Heat sink
US9894803B1 (en) Thermal sink with an embedded heat pipe
US20070063339A1 (en) Heat dissipating assembly for heat dissipating substrate and application
US20120080177A1 (en) High-power finless heat dissipation module
US8579017B2 (en) Heat dissipation device with multiple heat sinks
US7963317B2 (en) Mini-sized heat-dissipating module having an extra strength of assembled relationship
US20080314554A1 (en) Heat dissipation device with a heat pipe
US20130168055A1 (en) Thermal module
TWI334529B (en) Heat dissipation device
US11454462B2 (en) Heat dissipating fin with thermosiphon
US20070084583A1 (en) Structure for connecting radiating fins
US20090321050A1 (en) Heat dissipation device
TWI321441B (en) Heat dissipation module
TWM350974U (en) Thin type heat dissipater
TWI410601B (en) A large area of ​​cooling fins, and a radiator with the fins

Legal Events

Date Code Title Description
AS Assignment

Owner name: CHAUN-CHOUNG TECHNOLOGY CORP.,TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HUANG, MENG-CHENG;LIN, SHIH-YUAN;REEL/FRAME:021739/0909

Effective date: 20080923

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION