CN101071140A - 基板检查用触头、基板检查用夹具及基板检查装置 - Google Patents

基板检查用触头、基板检查用夹具及基板检查装置 Download PDF

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Publication number
CN101071140A
CN101071140A CNA2007101029153A CN200710102915A CN101071140A CN 101071140 A CN101071140 A CN 101071140A CN A2007101029153 A CNA2007101029153 A CN A2007101029153A CN 200710102915 A CN200710102915 A CN 200710102915A CN 101071140 A CN101071140 A CN 101071140A
Authority
CN
China
Prior art keywords
diameter
pin body
hole
substrate inspection
mentioned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007101029153A
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English (en)
Chinese (zh)
Inventor
广部幸祐
藤野真
加藤穰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIHON LEAD ELECTRIC INDUSTRY Co Ltd
Original Assignee
NIHON LEAD ELECTRIC INDUSTRY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIHON LEAD ELECTRIC INDUSTRY Co Ltd filed Critical NIHON LEAD ELECTRIC INDUSTRY Co Ltd
Publication of CN101071140A publication Critical patent/CN101071140A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
CNA2007101029153A 2006-05-12 2007-05-11 基板检查用触头、基板检查用夹具及基板检查装置 Pending CN101071140A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006134202 2006-05-12
JP2006134202A JP2007304008A (ja) 2006-05-12 2006-05-12 基板検査用接触子、基板検査用治具及び基板検査装置

Publications (1)

Publication Number Publication Date
CN101071140A true CN101071140A (zh) 2007-11-14

Family

ID=38685701

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007101029153A Pending CN101071140A (zh) 2006-05-12 2007-05-11 基板检查用触头、基板检查用夹具及基板检查装置

Country Status (5)

Country Link
US (1) US20070264878A1 (https=)
JP (1) JP2007304008A (https=)
KR (1) KR100864435B1 (https=)
CN (1) CN101071140A (https=)
TW (1) TW200801527A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102074825A (zh) * 2009-10-22 2011-05-25 日本麦可罗尼克斯股份有限公司 电连接装置和使用该电连接装置的试验装置
TWI457576B (zh) * 2011-11-07 2014-10-21 Nidec Read Corp 基板檢查夾具、夾具底座單元及基板檢查裝置
CN105388412A (zh) * 2015-10-23 2016-03-09 京东方科技集团股份有限公司 用于pcba的测试装置
CN112582851A (zh) * 2019-09-29 2021-03-30 中核检修有限公司 记录仪校验辅助装置

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010025665A (ja) * 2008-07-17 2010-02-04 Nidec-Read Corp 基板検査治具及び接触子
DE102009004555A1 (de) * 2009-01-14 2010-09-30 Atg Luther & Maelzer Gmbh Verfahren zum Prüfen von Leiterplatten
JP2010276510A (ja) * 2009-05-29 2010-12-09 Nidec-Read Corp 検査用治具
JP5629545B2 (ja) * 2009-12-18 2014-11-19 株式会社日本マイクロニクス プローブカード及び検査装置
JP5966688B2 (ja) * 2012-07-04 2016-08-10 日本電産リード株式会社 配線構造及び基板検査装置
JP2014235119A (ja) * 2013-06-04 2014-12-15 日本電産リード株式会社 基板検査装置、基板検査方法および基板検査用治具
US9274166B2 (en) 2013-08-26 2016-03-01 Fujitsu Limited Pin verification device and method
CN104714059A (zh) * 2015-03-19 2015-06-17 东莞鸿爱斯通信科技有限公司 测试接头
JP6872943B2 (ja) * 2017-03-24 2021-05-19 株式会社日本マイクロニクス 電気的接続装置
US11162980B2 (en) * 2019-12-24 2021-11-02 Teradyne, Inc. Coaxial via arrangement in probe card for automated test equipment
TWI814198B (zh) * 2022-01-04 2023-09-01 美商全球連接器科技有限公司 電性測試裝置
CN121541029B (zh) * 2026-01-19 2026-04-03 昆山康泰达智能科技有限公司 一种pcba老化测试平台

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EP0242542A1 (de) * 1986-03-26 1987-10-28 Feinmetall Gesellschaft mit beschrÀ¤nkter Haftung Prüfadapter
JP2532331B2 (ja) * 1992-11-09 1996-09-11 日本発条株式会社 導電性接触子
US5442299A (en) * 1994-01-06 1995-08-15 International Business Machines Corporation Printed circuit board test fixture and method
US5506510A (en) * 1994-05-18 1996-04-09 Genrad, Inc. Adaptive alignment probe fixture for circuit board tester
JP3326095B2 (ja) * 1996-12-27 2002-09-17 日本発条株式会社 導電性接触子
JP3634074B2 (ja) * 1996-06-28 2005-03-30 日本発条株式会社 導電性接触子
JPH10214649A (ja) * 1997-01-30 1998-08-11 Yokowo Co Ltd スプリングコネクタおよび該スプリングコネクタを用いた装置
US6563332B2 (en) * 1997-08-21 2003-05-13 Ibiden Co., Ltd. Checker head
US6429672B2 (en) * 1998-06-30 2002-08-06 International Business Machines Corporation Contamination-tolerant electrical test probe
JP3538036B2 (ja) * 1998-09-10 2004-06-14 イビデン株式会社 チェッカーヘッドおよびその製造方法
DE19907727A1 (de) * 1999-02-23 2000-08-24 Test Plus Electronic Gmbh Testadapter zur Kontaktierung von bestückten Leiterplatinen
US6330744B1 (en) * 1999-07-12 2001-12-18 Pjc Technologies, Inc. Customized electrical test probe head using uniform probe assemblies
US6191595B1 (en) * 1999-07-30 2001-02-20 Credence Systems Corporation Adhesive attaching, thermal releasing flat pack probe assembly
JP2001041977A (ja) * 1999-08-02 2001-02-16 Takashi Nansai チューブレスプリント基板検査機用治具
JP3794608B2 (ja) * 1999-12-01 2006-07-05 矢崎総業株式会社 コネクタ導通検査具
US6570399B2 (en) * 2000-05-18 2003-05-27 Qa Technology Company, Inc. Test probe and separable mating connector assembly
KR20040087341A (ko) * 2002-03-05 2004-10-13 리카 일렉트로닉스 인터내셔널, 인크. 전자 패키지와 테스트 장비를 인터페이싱시키기 위한 장치
JP2004039729A (ja) * 2002-07-01 2004-02-05 Totsuka Densi Kk プリント配線基板の検査治具
US6773938B2 (en) * 2002-08-29 2004-08-10 Micron Technology, Inc. Probe card, e.g., for testing microelectronic components, and methods for making same
KR100405037B1 (en) 2003-07-21 2003-11-10 From 30 Co Ltd Probe card for inspecting semiconductor device
JP4405358B2 (ja) * 2004-09-30 2010-01-27 株式会社ヨコオ 検査ユニット
US7154286B1 (en) * 2005-06-30 2006-12-26 Interconnect Devices, Inc. Dual tapered spring probe
KR200421209Y1 (ko) * 2006-04-14 2006-07-10 캐롤라인 예 회로 기판의 검사를 위한 시험용 탐침 장치

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102074825A (zh) * 2009-10-22 2011-05-25 日本麦可罗尼克斯股份有限公司 电连接装置和使用该电连接装置的试验装置
US8525539B2 (en) 2009-10-22 2013-09-03 Kabushiki Kaisha Nihon Micronics Electrical connecting apparatus and testing system using the same
CN102074825B (zh) * 2009-10-22 2013-10-30 日本麦可罗尼克斯股份有限公司 电连接装置和使用该电连接装置的试验装置
TWI457576B (zh) * 2011-11-07 2014-10-21 Nidec Read Corp 基板檢查夾具、夾具底座單元及基板檢查裝置
CN105388412A (zh) * 2015-10-23 2016-03-09 京东方科技集团股份有限公司 用于pcba的测试装置
WO2017067457A1 (zh) * 2015-10-23 2017-04-27 京东方科技集团股份有限公司 用于印刷电路板组件的测试装置
CN112582851A (zh) * 2019-09-29 2021-03-30 中核检修有限公司 记录仪校验辅助装置

Also Published As

Publication number Publication date
KR20070109831A (ko) 2007-11-15
JP2007304008A (ja) 2007-11-22
TWI327222B (https=) 2010-07-11
KR100864435B1 (ko) 2008-10-20
TW200801527A (en) 2008-01-01
US20070264878A1 (en) 2007-11-15

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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Open date: 20071114