KR100405037B1 - Probe card for inspecting semiconductor device - Google Patents

Probe card for inspecting semiconductor device Download PDF

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Publication number
KR100405037B1
KR100405037B1 KR1020030049812A KR20030049812A KR100405037B1 KR 100405037 B1 KR100405037 B1 KR 100405037B1 KR 1020030049812 A KR1020030049812 A KR 1020030049812A KR 20030049812 A KR20030049812 A KR 20030049812A KR 100405037 B1 KR100405037 B1 KR 100405037B1
Authority
KR
South Korea
Prior art keywords
semiconductor device
probe card
inspecting
pcb
probe
Prior art date
Application number
KR1020030049812A
Other languages
Korean (ko)
Inventor
Yong Jin
Hong Jin Chong
Tae Goo Lee
Original Assignee
From 30 Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by From 30 Co Ltd filed Critical From 30 Co Ltd
Priority to KR1020030049812A priority Critical patent/KR100405037B1/en
Application granted granted Critical
Publication of KR100405037B1 publication Critical patent/KR100405037B1/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

PURPOSE: A probe card for inspecting a semiconductor device is provided to be capable of easily inspecting electrical characteristics, preventing the damage of a probe, and improving the inspection efficiency for the semiconductor device. CONSTITUTION: A probe card(10) for inspecting a semiconductor device is provided with an insulation base(20), an PCB(Printed Circuit Board)(30) installed beneath the insulation base, a support part(32) installed beneath the PCB, and a plurality of conductive probes(40). At this time, the support part has a plurality of loading holes(34) corresponding to each electrode pad of the semiconductor device. At the time, each probe includes a body part inserted to the loading hole of the support part, the first pin(44) installed at the upper portion of the body part for contacting the PCB, the first elastic part(45), the second pin(46) installed at the lower portion of the body part for contacting the electrode pad of the semiconductor device, and the second elastic part.
KR1020030049812A 2003-07-21 2003-07-21 Probe card for inspecting semiconductor device KR100405037B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020030049812A KR100405037B1 (en) 2003-07-21 2003-07-21 Probe card for inspecting semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020030049812A KR100405037B1 (en) 2003-07-21 2003-07-21 Probe card for inspecting semiconductor device

Publications (1)

Publication Number Publication Date
KR100405037B1 true KR100405037B1 (en) 2003-11-10

Family

ID=37422631

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020030049812A KR100405037B1 (en) 2003-07-21 2003-07-21 Probe card for inspecting semiconductor device

Country Status (1)

Country Link
KR (1) KR100405037B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100864435B1 (en) 2006-05-12 2008-10-20 니혼덴산리드가부시키가이샤 The probe, the fixture, and apparatus for circuit board inspection

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100864435B1 (en) 2006-05-12 2008-10-20 니혼덴산리드가부시키가이샤 The probe, the fixture, and apparatus for circuit board inspection

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