CN101051668B - 压电元件及其制造方法、电子器件、喷墨器件 - Google Patents
压电元件及其制造方法、电子器件、喷墨器件 Download PDFInfo
- Publication number
- CN101051668B CN101051668B CN2007100916342A CN200710091634A CN101051668B CN 101051668 B CN101051668 B CN 101051668B CN 2007100916342 A CN2007100916342 A CN 2007100916342A CN 200710091634 A CN200710091634 A CN 200710091634A CN 101051668 B CN101051668 B CN 101051668B
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- electrode
- conductive oxide
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- piezoelectric element
- layer
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- Expired - Fee Related
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
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- 238000000034 method Methods 0.000 claims description 40
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims description 36
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- 238000000151 deposition Methods 0.000 claims description 9
- 238000004544 sputter deposition Methods 0.000 claims description 7
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims description 5
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
- H10N30/878—Conductive materials the principal material being non-metallic, e.g. oxide or carbon based
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006-101451 | 2006-04-03 | ||
| JP2006101451 | 2006-04-03 | ||
| JP2006101451 | 2006-04-03 | ||
| JP2007-052325 | 2007-03-02 | ||
| JP2007052325 | 2007-03-02 | ||
| JP2007052325A JP5188076B2 (ja) | 2006-04-03 | 2007-03-02 | 圧電素子及びその製造方法、電子デバイス、インクジェット装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101051668A CN101051668A (zh) | 2007-10-10 |
| CN101051668B true CN101051668B (zh) | 2010-09-15 |
Family
ID=38557790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100916342A Expired - Fee Related CN101051668B (zh) | 2006-04-03 | 2007-04-03 | 压电元件及其制造方法、电子器件、喷墨器件 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US7732997B2 (enExample) |
| JP (1) | JP5188076B2 (enExample) |
| CN (1) | CN101051668B (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2042851A4 (en) * | 2006-07-04 | 2012-10-24 | Ngk Insulators Ltd | PIEZOELECTRIC FILMSENSOR |
| EP2101364A4 (en) * | 2006-12-06 | 2013-04-03 | Murata Manufacturing Co | LAMINATED PIEZOELECTRIC ARRANGEMENT AND PROCESS FOR THEIR MANUFACTURE |
| JP4784611B2 (ja) | 2008-01-31 | 2011-10-05 | ブラザー工業株式会社 | 圧電アクチュエータの製造方法及び液体移送装置の製造方法 |
| JP5541452B2 (ja) | 2010-03-18 | 2014-07-09 | セイコーエプソン株式会社 | 液滴噴射ヘッドおよびその製造方法、ならびに液滴噴射装置 |
| WO2011145453A1 (ja) * | 2010-05-17 | 2011-11-24 | 株式会社村田製作所 | 圧電アクチュエータ及び駆動装置 |
| JP5716364B2 (ja) * | 2010-11-29 | 2015-05-13 | 株式会社リコー | 電気機械変換素子、液体噴射ヘッド、及び電気機械変換素子の製造方法 |
| JP5522126B2 (ja) * | 2011-07-13 | 2014-06-18 | ブラザー工業株式会社 | 圧電アクチュエータの製造方法及び液体移送装置の製造方法 |
| CN108113762B (zh) | 2012-06-27 | 2024-08-27 | 曼特瑞斯医药有限责任公司 | 组织的图像引导治疗 |
| WO2014021854A1 (en) * | 2012-07-31 | 2014-02-06 | Hewlett-Packard Development Company, L.P. | Thin film stack |
| CN104488100A (zh) * | 2012-07-31 | 2015-04-01 | 惠普发展公司,有限责任合伙企业 | 薄膜叠层 |
| CN103280523B (zh) * | 2013-06-18 | 2015-03-25 | 厦门乃尔电子有限公司 | 高温压电元件电极制作方法及压电元件结构 |
| FR3011147B1 (fr) * | 2013-09-20 | 2015-10-16 | Onera (Off Nat Aerospatiale) | Actionneur plan piezoelectrique a grand deplacement en cisaillement. |
| US9433383B2 (en) | 2014-03-18 | 2016-09-06 | Monteris Medical Corporation | Image-guided therapy of a tissue |
| US10675113B2 (en) | 2014-03-18 | 2020-06-09 | Monteris Medical Corporation | Automated therapy of a three-dimensional tissue region |
| JP5757354B2 (ja) * | 2014-04-09 | 2015-07-29 | ブラザー工業株式会社 | 圧電アクチュエータの製造方法及び液体移送装置の製造方法 |
| JP6504336B2 (ja) * | 2014-10-17 | 2019-04-24 | セイコーエプソン株式会社 | 圧電素子及びその製造方法並びに圧電素子応用デバイス |
| JP6617268B2 (ja) | 2015-03-27 | 2019-12-11 | パナソニックIpマネジメント株式会社 | 圧電素子および圧電素子の製造方法 |
| US10327830B2 (en) | 2015-04-01 | 2019-06-25 | Monteris Medical Corporation | Cryotherapy, thermal therapy, temperature modulation therapy, and probe apparatus therefor |
| EP3341980B1 (de) * | 2015-08-26 | 2022-07-20 | CeramTec GmbH | Schicht und verfahren zu ihrer herstellung |
| US10166777B2 (en) * | 2016-04-21 | 2019-01-01 | Xerox Corporation | Method of forming piezo driver electrodes |
| CN107482114B (zh) * | 2017-08-03 | 2019-08-09 | 大连理工大学 | 一种PZT/Si扩散键合方法 |
| JP7636302B2 (ja) | 2021-08-31 | 2025-02-26 | 富士フイルム株式会社 | 圧電積層体及び圧電素子 |
| JP7617824B2 (ja) | 2021-08-31 | 2025-01-20 | 富士フイルム株式会社 | 圧電積層体及び圧電素子 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1438117A (zh) * | 2002-01-22 | 2003-08-27 | 精工爱普生株式会社 | 压电体元件、液体喷头以及它们的制造方法 |
| CN1636729A (zh) * | 2004-01-09 | 2005-07-13 | 佳能株式会社 | 介电体元件、压电体元件、喷墨头及其制造方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4610771A (en) * | 1984-10-29 | 1986-09-09 | Ppg Industries, Inc. | Sputtered films of metal alloy oxides and method of preparation thereof |
| JPH027479A (ja) * | 1988-06-25 | 1990-01-11 | Matsushita Electric Ind Co Ltd | 圧電素子 |
| JPH08274573A (ja) | 1995-03-29 | 1996-10-18 | Olympus Optical Co Ltd | マイクロ圧電振動子、その製法及び圧電トランスデューサ |
| JP3582550B2 (ja) * | 1995-04-03 | 2004-10-27 | セイコーエプソン株式会社 | インクジェット記録用プリンタヘッドの製造方法 |
| US5933167A (en) * | 1995-04-03 | 1999-08-03 | Seiko Epson Corporation | Printer head for ink jet recording |
| JP3379479B2 (ja) * | 1998-07-01 | 2003-02-24 | セイコーエプソン株式会社 | 機能性薄膜、圧電体素子、インクジェット式記録ヘッド、プリンタ、圧電体素子の製造方法およびインクジェット式記録ヘッドの製造方法、 |
| JP2000328223A (ja) | 1999-05-25 | 2000-11-28 | Agency Of Ind Science & Technol | 積層構造体及びその原料粉、及び、圧電アクチュエータ |
| JP2001152360A (ja) | 1999-11-25 | 2001-06-05 | Ricoh Co Ltd | セラミックス誘電体膜の形成方法、セラミックス誘電体膜/基板の積層構造体、及び電気−機械変換素子 |
| JP2002016229A (ja) | 2000-06-29 | 2002-01-18 | Rikogaku Shinkokai | 強誘電体素子およびその製造方法 |
| JP3833070B2 (ja) * | 2001-02-09 | 2006-10-11 | キヤノン株式会社 | 液体噴射ヘッドおよび製造方法 |
| JP4103421B2 (ja) * | 2001-03-28 | 2008-06-18 | セイコーエプソン株式会社 | 電子デバイス及び電子機器 |
| JP2003110158A (ja) * | 2001-09-28 | 2003-04-11 | Seiko Epson Corp | 圧電体薄膜素子およびその製造方法、ならびにこれを用いたインクジェット記録ヘッド及びインクジェットプリンタ |
| JP2003163387A (ja) * | 2001-11-29 | 2003-06-06 | Matsushita Electric Ind Co Ltd | 強誘電体素子およびそれを用いたアクチュエータ、インクジェットヘッドならびにインクジェット式記録装置 |
| JP4474105B2 (ja) | 2002-02-15 | 2010-06-02 | キヤノン株式会社 | 撥水性部材、及び、インクジェットヘッドの製造方法 |
| US7265483B2 (en) * | 2004-03-29 | 2007-09-04 | Canon Kabushiki Kaisha | Dielectric member, piezoelectric member, ink jet head, ink jet recording apparatus and producing method for ink jet recording apparatus |
| JP3875240B2 (ja) * | 2004-03-31 | 2007-01-31 | 株式会社東芝 | 電子部品の製造方法 |
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2007
- 2007-03-02 JP JP2007052325A patent/JP5188076B2/ja active Active
- 2007-03-19 US US11/723,224 patent/US7732997B2/en not_active Expired - Fee Related
- 2007-04-03 CN CN2007100916342A patent/CN101051668B/zh not_active Expired - Fee Related
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2010
- 2010-04-07 US US12/756,071 patent/US8387220B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1438117A (zh) * | 2002-01-22 | 2003-08-27 | 精工爱普生株式会社 | 压电体元件、液体喷头以及它们的制造方法 |
| CN1636729A (zh) * | 2004-01-09 | 2005-07-13 | 佳能株式会社 | 介电体元件、压电体元件、喷墨头及其制造方法 |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2004-289441A 2004.10.14 |
Also Published As
| Publication number | Publication date |
|---|---|
| US8387220B2 (en) | 2013-03-05 |
| CN101051668A (zh) | 2007-10-10 |
| JP5188076B2 (ja) | 2013-04-24 |
| US20070228894A1 (en) | 2007-10-04 |
| JP2007300071A (ja) | 2007-11-15 |
| US7732997B2 (en) | 2010-06-08 |
| US20100192341A1 (en) | 2010-08-05 |
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