CN101051668B - 压电元件及其制造方法、电子器件、喷墨器件 - Google Patents

压电元件及其制造方法、电子器件、喷墨器件 Download PDF

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Publication number
CN101051668B
CN101051668B CN2007100916342A CN200710091634A CN101051668B CN 101051668 B CN101051668 B CN 101051668B CN 2007100916342 A CN2007100916342 A CN 2007100916342A CN 200710091634 A CN200710091634 A CN 200710091634A CN 101051668 B CN101051668 B CN 101051668B
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CN
China
Prior art keywords
electrode
conductive oxide
substrate
piezoelectric element
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007100916342A
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English (en)
Chinese (zh)
Other versions
CN101051668A (zh
Inventor
石仓淳理
柴田尚存
青木活水
斋藤康行
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Canon Inc
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Canon Inc
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Publication of CN101051668A publication Critical patent/CN101051668A/zh
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Expired - Fee Related legal-status Critical Current
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1607Production of print heads with piezoelectric elements
    • B41J2/161Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1626Manufacturing processes etching
    • B41J2/1628Manufacturing processes etching dry etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1626Manufacturing processes etching
    • B41J2/1629Manufacturing processes etching wet etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1632Manufacturing processes machining
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1642Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1646Manufacturing processes thin film formation thin film formation by sputtering
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/07Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/076Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877Conductive materials
    • H10N30/878Conductive materials the principal material being non-metallic, e.g. oxide or carbon based
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/20Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047Membrane type
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/42Piezoelectric device making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
CN2007100916342A 2006-04-03 2007-04-03 压电元件及其制造方法、电子器件、喷墨器件 Expired - Fee Related CN101051668B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2006-101451 2006-04-03
JP2006101451 2006-04-03
JP2006101451 2006-04-03
JP2007-052325 2007-03-02
JP2007052325 2007-03-02
JP2007052325A JP5188076B2 (ja) 2006-04-03 2007-03-02 圧電素子及びその製造方法、電子デバイス、インクジェット装置

Publications (2)

Publication Number Publication Date
CN101051668A CN101051668A (zh) 2007-10-10
CN101051668B true CN101051668B (zh) 2010-09-15

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Country Link
US (2) US7732997B2 (enExample)
JP (1) JP5188076B2 (enExample)
CN (1) CN101051668B (enExample)

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EP2042851A4 (en) * 2006-07-04 2012-10-24 Ngk Insulators Ltd PIEZOELECTRIC FILMSENSOR
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JP4784611B2 (ja) 2008-01-31 2011-10-05 ブラザー工業株式会社 圧電アクチュエータの製造方法及び液体移送装置の製造方法
JP5541452B2 (ja) 2010-03-18 2014-07-09 セイコーエプソン株式会社 液滴噴射ヘッドおよびその製造方法、ならびに液滴噴射装置
WO2011145453A1 (ja) * 2010-05-17 2011-11-24 株式会社村田製作所 圧電アクチュエータ及び駆動装置
JP5716364B2 (ja) * 2010-11-29 2015-05-13 株式会社リコー 電気機械変換素子、液体噴射ヘッド、及び電気機械変換素子の製造方法
JP5522126B2 (ja) * 2011-07-13 2014-06-18 ブラザー工業株式会社 圧電アクチュエータの製造方法及び液体移送装置の製造方法
CN108113762B (zh) 2012-06-27 2024-08-27 曼特瑞斯医药有限责任公司 组织的图像引导治疗
WO2014021854A1 (en) * 2012-07-31 2014-02-06 Hewlett-Packard Development Company, L.P. Thin film stack
CN104488100A (zh) * 2012-07-31 2015-04-01 惠普发展公司,有限责任合伙企业 薄膜叠层
CN103280523B (zh) * 2013-06-18 2015-03-25 厦门乃尔电子有限公司 高温压电元件电极制作方法及压电元件结构
FR3011147B1 (fr) * 2013-09-20 2015-10-16 Onera (Off Nat Aerospatiale) Actionneur plan piezoelectrique a grand deplacement en cisaillement.
US9433383B2 (en) 2014-03-18 2016-09-06 Monteris Medical Corporation Image-guided therapy of a tissue
US10675113B2 (en) 2014-03-18 2020-06-09 Monteris Medical Corporation Automated therapy of a three-dimensional tissue region
JP5757354B2 (ja) * 2014-04-09 2015-07-29 ブラザー工業株式会社 圧電アクチュエータの製造方法及び液体移送装置の製造方法
JP6504336B2 (ja) * 2014-10-17 2019-04-24 セイコーエプソン株式会社 圧電素子及びその製造方法並びに圧電素子応用デバイス
JP6617268B2 (ja) 2015-03-27 2019-12-11 パナソニックIpマネジメント株式会社 圧電素子および圧電素子の製造方法
US10327830B2 (en) 2015-04-01 2019-06-25 Monteris Medical Corporation Cryotherapy, thermal therapy, temperature modulation therapy, and probe apparatus therefor
EP3341980B1 (de) * 2015-08-26 2022-07-20 CeramTec GmbH Schicht und verfahren zu ihrer herstellung
US10166777B2 (en) * 2016-04-21 2019-01-01 Xerox Corporation Method of forming piezo driver electrodes
CN107482114B (zh) * 2017-08-03 2019-08-09 大连理工大学 一种PZT/Si扩散键合方法
JP7636302B2 (ja) 2021-08-31 2025-02-26 富士フイルム株式会社 圧電積層体及び圧電素子
JP7617824B2 (ja) 2021-08-31 2025-01-20 富士フイルム株式会社 圧電積層体及び圧電素子

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Also Published As

Publication number Publication date
US8387220B2 (en) 2013-03-05
CN101051668A (zh) 2007-10-10
JP5188076B2 (ja) 2013-04-24
US20070228894A1 (en) 2007-10-04
JP2007300071A (ja) 2007-11-15
US7732997B2 (en) 2010-06-08
US20100192341A1 (en) 2010-08-05

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